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1. 发明申请

US20080276128A1 Metrics independent and recipe independent fault classes 有权
标题翻译：度量独立和食谱独立的故障类
公开(公告)号：US20080276128A1
公开(公告)日：2008-11-06
申请号：US11800460
申请日：2007-05-04
申请人： Y. Sean Lin , William R. Clements , Alexander T. Schwarm
发明人： Y. Sean Lin , William R. Clements , Alexander T. Schwarm
IPC分类号： G06F11/34
CPC分类号： G05B19/0428 , G05B2219/37519
摘要： A method and apparatus for diagnosing faults. Process data is analyzed using a first metric to identify a fault. The process data was obtained from a manufacturing machine running a first recipe. A fault signature that matches the fault is identified. The identified fault signature was generated using a second metric and/or a second recipe. At least one fault class that is associated with the fault signature is identified.
摘要翻译：一种用于诊断故障的方法和装置。使用第一个度量来分析过程数据以识别故障。过程数据是从运行第一配方的制造机器获得的。识别与故障匹配的故障签名。使用第二度量和/或第二配方生成所识别的故障签名。识别与故障签名相关联的至少一个故障类。

2. 发明授权

US06466895B1 Defect reference system automatic pattern classification 失效
标题翻译：缺陷参考系自动模式分类
公开(公告)号：US06466895B1
公开(公告)日：2002-10-15
申请号：US09586540
申请日：2000-05-31
申请人： Stefanie Harvey , Terry Reiss
发明人： Stefanie Harvey , Terry Reiss
IPC分类号： G06F300
CPC分类号： G05B19/41875 , G05B2219/32221 , G05B2219/37519 , H01L22/20 , H01L2924/0002 , Y02P90/14 , Y02P90/22 , Y02P90/265 , Y02P90/86 , H01L2924/00
摘要： A methodology is provided for qualitatively identifying features of an article, such as defects on the surface of a semiconductor substrate, with a string of symbols, such as numbers, according to relevant defect characteristics and information relating to the processing tools visited by the wafer, including reliability information. Embodiments include generalizing, after a defect on a wafer is discovered and inspected (as by optical review, SEM, EDS, AFM, etc.), each quantitative attribute of the defect such as the defect's size, material composition, color, position on the surface of the wafer, etc. into a qualitative category, assigning a numerical symbol to each attribute for identification, and sequencing the symbols in a predetermined manner. The identification sequences of all defects are stored in a database, where they are easily compared with other correspondingly identified defects. The identification sequence also includes a number representative of the wafer's last-visited processing tool, thereby associating the defect with a tool. After the defect is investigated and determined as being caused by a particular fault of the tool, this information is stored and linked to the defect's identification sequence. Thereafter, if a similar defect occurs in another wafer, the later defect's identification sequence is matched to that of the previous defect by searching the defect database, indicating the same cause for the later defect, thereby enabling ready identification of the root causes of defects, and enabling early corrective action to be taken.
摘要翻译：提供了一种方法，用于根据相关缺陷特性和与晶片访问的处理工具有关的信息，定性地识别物品的特征，例如半导体衬底的表面上的缺陷，具有诸如数字的符号串，包括可靠性信息。实施例包括在发现和检查晶片上的缺陷（如通过光学审查，SEM，EDS，AFM等）之后概括的缺陷的每个定量属性，例如缺陷的尺寸，材料组成，颜色，位置将晶片的表面等划分为定性类别，为每个属性分配数字符号以进行识别，并以预定方式对符号进行排序。所有缺陷的识别序列都存储在数据库中，可以方便地与其他相应识别的缺陷进行比较。识别序列还包括表示晶片最后访问的处理工具的数字，从而将缺陷与工具相关联。在缺陷被调查并确定为由工具的特定故障引起之后，该信息被存储并链接到缺陷的识别序列。此后，如果在另一个晶片中出现相似的缺陷，则通过搜索缺陷数据库来跟踪先前缺陷的后续缺陷的识别序列，指示与之相关的缺陷相同的原因，从而能够准确地识别缺陷的根本原因，并能够采取早期纠正措施。

3. 发明授权

US08010321B2 Metrics independent and recipe independent fault classes 有权
标题翻译：度量独立和食谱独立的故障类
公开(公告)号：US08010321B2
公开(公告)日：2011-08-30
申请号：US11800460
申请日：2007-05-04
申请人： Y. Sean Lin , William R. Clements, III , Alexander T. Schwarm
发明人： Y. Sean Lin , William R. Clements, III , Alexander T. Schwarm
IPC分类号： G06F3/01 , G06F11/07 , G21C21/02 , H04B3/46
CPC分类号： G05B19/0428 , G05B2219/37519
摘要： A method and apparatus for diagnosing faults. Process data is analyzed using a first metric to identify a fault. The process data was obtained from a manufacturing machine running a first recipe. A fault signature that matches the fault is identified. The identified fault signature was generated using a second metric and/or a second recipe. At least one fault class that is associated with the fault signature is identified.
摘要翻译：一种用于诊断故障的方法和装置。使用第一个度量来分析过程数据以识别故障。过程数据是从运行第一配方的制造机器获得的。识别与故障匹配的故障签名。使用第二度量和/或第二配方生成所识别的故障签名。识别与故障签名相关联的至少一个故障类。

4. 发明申请

US20190235472A1 ABNORMALITY DETERMINATION APPARATUS, NON-TRANSITORY COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM, ABNORMALITY DETERMINATION SYSTEM AND ABNORMALITY DETERMINATION METHOD 审中-公开
公开(公告)号：US20190235472A1
公开(公告)日：2019-08-01
申请号：US16254034
申请日：2019-01-22
申请人： FANUC CORPORATION
发明人： Susumu MAEKAWA , Hirohide TSUNODA
IPC分类号： G05B19/4065 , G05B19/404
CPC分类号： G05B19/4065 , G05B19/404 , G05B2219/37428 , G05B2219/37519
摘要： An abnormality determination apparatus, which determines abnormality of a temperature sensor in a machine tool, includes: a temperature pattern storage unit which stores a normal pattern indicating temperature change relative to machining time for a machining classification of the machine tool; a temperature data acquisition unit which acquires temperature data outputted by the temperature sensor provided to the machine tool; a machining classification determination unit which determines a machining classification of the machine tool; a comparison data acquisition unit which extracts the normal pattern relative to a determined machining classification from the temperature pattern storage unit; a comparison unit which compares the extracted normal pattern, and as acquired pattern indicating temperature change relative to machining time according to the acquired temperature data; and an abnormality determination unit which determines abnormality of a temperature sensor based on a comparison result.

5. 发明授权

US07100081B1 Method and apparatus for fault classification based on residual vectors 有权
标题翻译：基于残差向量的故障分类方法和装置
公开(公告)号：US07100081B1
公开(公告)日：2006-08-29
申请号：US10682019
申请日：2003-10-09
申请人： Matthew A. Purdy , Robert J. Chong , Gregory A. Cherry , Richard J. Markle
发明人： Matthew A. Purdy , Robert J. Chong , Gregory A. Cherry , Richard J. Markle
IPC分类号： G06F11/00 , G06F19/00
CPC分类号： G05B23/0254 , G05B19/41875 , G05B2219/37519 , G05B2219/45031 , Y02P90/22
摘要： A method includes receiving a current residual vector. The current residual vector is compared to a plurality of historical residual vectors. Each historical residual vector has an associated fault classification code. At least one of the historical residual vectors is selected responsive to determining that the current residual vector matches at least one of the historical residual vectors. A fault condition is classified based on the fault classification code associated with the selected historical residual vector.
摘要翻译：一种方法包括接收当前残差矢量。将当前残差向量与多个历史残差向量进行比较。每个历史残差向量都有相关的故障分类码。响应于确定当前残差向量与至少一个历史残差向量相匹配来选择至少一个历史残差向量。基于与所选择的历史残差向量相关联的故障分类码，对故障条件进行分类。

6. 发明授权

US07277824B1 Method and apparatus for classifying faults based on wafer state data and sensor tool trace data 有权
标题翻译：基于晶片状态数据和传感器工具跟踪数据对故障进行分类的方法和装置
公开(公告)号：US07277824B1
公开(公告)日：2007-10-02
申请号：US11180393
申请日：2005-07-13
申请人： Matthew S. Ryskoski , Kevin R. Lensing
发明人： Matthew S. Ryskoski , Kevin R. Lensing
IPC分类号： G01B5/28
CPC分类号： G05B19/41875 , G05B2219/32221 , G05B2219/37519 , G05B2219/45031 , Y02P90/22
摘要： The present invention provides a method and apparatus for classifying faults. The method includes accessing wafer state data associated with at least one wafer processed by at least one processing tool and sensor tool trace data associated with the at least one processing tool and determining that at least one fault occurred based upon at least one of the wafer state data and the sensor tool trace data. The method also includes selecting, in response to determining that the at least one fault occurred, a subset of a plurality of faults based upon at least one of the wafer state data and the sensor tool trace data and selecting at least one fault from the subset of the plurality of faults based upon at least one of the wafer state data and the sensor tool trace data.
摘要翻译：本发明提供一种分类故障的方法和装置。该方法包括访问与由至少一个处理工具处理的至少一个晶片相关联的晶片状态数据和与至少一个处理工具相关联的传感器工具跟踪数据，并且基于晶片状态中的至少一个确定至少一个故障数据和传感器工具跟踪数据。该方法还包括基于至少一个晶片状态数据和传感器工具跟踪数据选择响应于确定至少一个故障发生的多个故障的子集，并从该子集中选择至少一个故障基于晶片状态数据和传感器工具跟踪数据中的至少一个的多个故障。

7. 发明授权

US06980873B2 System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment 失效
标题翻译：在半导体制造环境中进行实时故障检测，分类和校正的系统和方法
公开(公告)号：US06980873B2
公开(公告)日：2005-12-27
申请号：US10831064
申请日：2004-04-23
申请人： Hsueh Chi Shen
发明人： Hsueh Chi Shen
IPC分类号： G05B23/02 , G06F19/00
CPC分类号： G05B23/024 , G05B2219/37519
摘要： A system and method for detecting a fault and identifying a remedy for the fault in real-time in a semiconductor product manufacturing facility are provided. In one example, the method includes importing data from a manufacturing device and data representing a plurality of different manufacturing devices into an analysis tool. The imported data is analyzed using the analysis tool to determine if a fault exists in the manufacturing device's operation and, if a fault exists, the fault is classified and a remedy for the fault is identified based at least partly on the classification. Configuration data used to control the manufacturing device may be updated, and the update may apply the remedy to the configuration information. The manufacturing device's operation may then be modified using the updated configuration data.
摘要翻译：提供了一种用于在半导体产品制造设施中实时检测故障并识别故障补救的系统和方法。在一个示例中，该方法包括将来自制造设备的数据和表示多个不同制造设备的数据导入到分析工具中。使用分析工具对导入的数据进行分析，以确定制造设备的操作中是否存在故障，如果存在故障，则对故障进行分类，并至少部分根据分类识别故障的补救措施。可以更新用于控制制造装置的配置数据，并且更新可以将补救应用于配置信息。然后可以使用更新的配置数据修改制造设备的操作。

8. 发明申请

US20050251276A1 SYSTEM AND METHOD FOR REAL-TIME FAULT DETECTION, CLASSIFICATION, AND CORRECTION IN A SEMICONDUCTOR MANUFACTURING ENVIRONMENT 失效
标题翻译：半导体制造环境中的实时故障检测，分类和校正的系统和方法
公开(公告)号：US20050251276A1
公开(公告)日：2005-11-10
申请号：US10831064
申请日：2004-04-23
申请人： Hsueh Shen
发明人： Hsueh Shen
IPC分类号： G05B23/02 , G06F19/00
CPC分类号： G05B23/024 , G05B2219/37519
摘要： A system and method for detecting a fault and identifying a remedy for the fault in real-time in a semiconductor product manufacturing facility are provided. In one example, the method includes importing data from a manufacturing device and data representing a plurality of different manufacturing devices into an analysis tool. The imported data is analyzed using the analysis tool to determine if a fault exists in the manufacturing device's operation and, if a fault exists, the fault is classified and a remedy for the fault is identified based at least partly on the classification. Configuration data used to control the manufacturing device may be updated, and the update may apply the remedy to the configuration information. The manufacturing device's operation may then be modified using the updated configuration data.
摘要翻译：提供了一种用于在半导体产品制造设施中实时检测故障并识别故障补救的系统和方法。在一个示例中，该方法包括将来自制造设备的数据和表示多个不同制造设备的数据导入到分析工具中。使用分析工具对导入的数据进行分析，以确定制造设备的操作中是否存在故障，如果存在故障，则对故障进行分类，并至少部分根据分类识别故障的补救措施。可以更新用于控制制造装置的配置数据，并且更新可以将补救应用于配置信息。然后可以使用更新的配置数据修改制造设备的操作。

9. 发明申请

WO2008142386A1 MACHINING PROCESS MONITOR 审中-公开
标题翻译：加工过程监控
公开(公告)号：WO2008142386A1
公开(公告)日：2008-11-27
申请号：PCT/GB2008/001700
申请日：2008-05-16
申请人： ROLLS-ROYCE PLC , SAGE, Colin , CLIFTON, David, Andrew
发明人： SAGE, Colin , CLIFTON, David, Andrew
IPC分类号： G05B19/4065
CPC分类号： G05B19/4065 , G05B2219/34048 , G05B2219/37519 , G05B2219/37545 , G05B2219/50197
摘要： The invention concerns a manufacturing process monitor, in particular a machining process, and a method of multi-parameter data acquisition and analysis for process diagnostics. Multiple sensors (14, 16, 18, 20, 22) are attached to a machine tool (2) to monitor a plurality of machining parameters including machine power consumption, acoustic emissions, vibration, power and force. During each operation the sensor outputs (24, 26, 28, 30, 32, 34, 38, 40) are repeatedly sampled (36) and processed (46) to provide a signature (54) characteristic of the operation. The data is analysed to determine the limits of a normal machining operation, including the condition and status of the tools (6) and equipment (2). By storing the signatures (50) for a large number of operations of known "normal" and "abnormal" outcomes a data population is created with which new signatures can be compared and a diagnostic indication (54) produced. Warnings of abnormalities and abnormal events, such as tool damage, may be produced automatically and in real-time.
摘要翻译：本发明涉及制造过程监视器，特别是加工过程，以及用于过程诊断的多参数数据采集和分析方法。多个传感器（14,16,18,20,22）连接到机床（2）以监视多个加工参数，包括机器功率消耗，声发射，振动，功率和力。在每次操作期间，传感器输出（24,26,28,30,32,34,38,40）被重复采样（36）和处理（46）以提供操作的特征（54）。分析数据以确定正常加工操作的限制，包括工具（6）和设备（2）的状态和状态。通过存储已知“正常”和“异常”结果的大量操作的签名（50），创建可以比较新签名的数据群，并产生诊断指示（54）。可能会自动和实时地产生异常和异常事件的警告，如刀具损坏。

10. 发明申请

WO2008137062A1 METRICS INDEPENDENT AND RECIPE INDEPENDENT FAULT CLASSES 审中-公开
标题翻译：独立和独立的度量独立故障类
公开(公告)号：WO2008137062A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/005667
申请日：2008-05-01
申请人： APPLIED MATERIALS, INC. , LIN, Y., Sean , CLEMENTS, William, R., III , SCHWARM, Alexander, T.
发明人： LIN, Y., Sean , CLEMENTS, William, R., III , SCHWARM, Alexander, T.
IPC分类号： G06F11/30
CPC分类号： G05B19/0428 , G05B2219/37519
摘要： A method and apparatus for diagnosing faults. Process data is analyzed using a first metric to identify a fault. The process data was obtained from a manufacturing machine running a first recipe. A fault signature that matches the fault is identified. The identified fault signature was generated using a second metric and/or a second recipe. At least one fault class that is associated with the fault signature is identified.
摘要翻译：一种用于诊断故障的方法和装置。使用第一个度量来分析过程数据以识别故障。过程数据是从运行第一配方的制造机器获得的。识别与故障匹配的故障签名。使用第二度量和/或第二配方生成所识别的故障签名。识别与故障签名相关联的至少一个故障类。

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