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    • 8. 发明授权
    • Method for planarizing wafers
    • 平面化晶圆的方法
    • US4672023A
    • 1987-06-09
    • US789947
    • 1985-10-21
    • Charles C. Leung
    • Charles C. Leung
    • H01L21/027H01L21/311H01L21/762H01L21/312
    • H01L21/31138H01L21/0274H01L21/311H01L21/76232
    • A method for filling indentations to planarize the surface of a wafer is disclosed. The method includes three steps: (1) coating the wafer surface with a layer of positive photoresist that fills the indentations and covers the surface of the wafer; (2) exposing the layer of photoresist to light or other radiation source of such intensity and duration that the layer of photoresist is exposed down to the surface of the wafer but not into the indentations; and (3) removing the exposed portion of the photoresist by using a developer, resulting in a planarized wafer containing indentations filled with unexposed photoresist. Once the wafer has been planarized by this method, overstructures can be formed over the top of the photoresist filled indentations.
    • 公开了一种用于填充凹槽以平坦化晶片表面的方法。 该方法包括三个步骤:(1)用填充凹陷并覆盖晶片表面的正性光致抗蚀剂层涂覆晶片表面; (2)将光致抗蚀剂层暴露于光或其它辐射源,其强度和持续时间使得该光致抗蚀剂层向下暴露于晶片的表面而不是凹陷; 和(3)通过使用显影剂去除光致抗蚀剂的暴露部分,导致包含填充有未曝光光致抗蚀剂的凹陷的平坦化晶片。 一旦通过该方法平坦化了晶片,就可以在光致抗蚀剂填充压痕的顶部上形成过结构。