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1. 发明授权

US5972739A Method of manufacturing a tab semiconductor device 失效
标题翻译：制造凸片半导体器件的方法
公开(公告)号：US5972739A
公开(公告)日：1999-10-26
申请号：US41592
申请日：1998-03-13
申请人： Yoshitsugu Funada , Koji Matsui
发明人： Yoshitsugu Funada , Koji Matsui
IPC分类号： H01L21/60 , H01L23/29 , H01L23/31 , H01L23/498 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/293 , H01L23/3107 , H01L23/3164 , H01L23/4985 , H01L24/81 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042
摘要： A resin-encapsulated semiconductor device includes a semiconductor chip consisting of a semiconductor element having metal bumps and metal leads electrically connected to the metal bumps and having a surface-treated layer obtained by a surface treatment, and a resin film stacked on the outer side of the semiconductor chip and tightly adhered to the semiconductor chip by a heat treatment and pressurization treatment.
摘要翻译：树脂封装的半导体器件包括由具有金属凸块的半导体元件和与金属凸块电连接并具有通过表面处理获得的表面处理层的金属引线构成的半导体芯片，以及层叠在半导体芯片，并通过热处理和加压处理紧密地附着到半导体芯片。

2. 发明授权

US06232398B1 Alkali or acid corrodible organic or composite particles in resin matrix 失效
标题翻译：碱性或酸性腐蚀性有机或复合颗粒在树脂基质中
公开(公告)号：US06232398B1
公开(公告)日：2001-05-15
申请号：US08986104
申请日：1997-12-05
申请人： Yoshitsugu Funada , Koji Matsui
发明人： Yoshitsugu Funada , Koji Matsui
IPC分类号： C08L6310
CPC分类号： H05K1/0373 , C08L63/00 , H05K3/181 , H05K3/381 , H05K2201/0209 , H05K2201/0212 , H05K2201/0218 , H05K2201/0254 , C08L2666/04 , C08L2666/02
摘要： A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.
摘要翻译：含有芴环氧丙烯酸酯和/或苯并环丁烯树脂的耐酸碱性树脂基体包括绝缘性有机颗粒和具有有机成分和无机成分的绝缘性复合颗粒中的至少一种，其总量为颗粒在5-50体积％的范围内，其中绝缘有机颗粒和绝缘复合颗粒的有机组分被碱或酸腐蚀，并且其中不小于90体积％的绝缘体有机颗粒和绝缘复合颗粒的粒径在1-20微米的范围内。

3. 发明授权

US5830563A Interconnection structures and method of making same 失效
标题翻译：互连结构及其制作方法
公开(公告)号：US5830563A
公开(公告)日：1998-11-03
申请号：US752798
申请日：1996-11-20
申请人： Tadanori Shimoto , Yoshitsugu Funada , Koji Matsui , Yuzo Shimada , Kazuaki Utsumi
发明人： Tadanori Shimoto , Yoshitsugu Funada , Koji Matsui , Yuzo Shimada , Kazuaki Utsumi
IPC分类号： H05K1/00 , H05K3/00 , H05K3/18 , H05K3/46 , B32B3/00
CPC分类号： H05K3/4661 , H05K3/465 , H05K2201/0195 , H05K2201/0355 , H05K2201/0394 , H05K3/0023 , H05K3/184 , H05K3/4676 , Y10S428/901 , Y10T428/24917 , Y10T428/3154
摘要： This invention relates to an interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of the insulating films consists of a fluorene skeleton-containing epoxy acrylate resin, and to a method of making a multilayer interconnection structure including the steps of roughening the surface of an insulating resin layer and forming a conductor thereon by electroless plating, wherein the average roughness (Ra), maximum roughness (Ry) and conductor thickness (T) of the roughened surface of the insulating resin layer satisfy the following relations: 0.2.ltoreq.Ra.ltoreq.0.6 (unit: .mu.m) (1) 0.02.ltoreq.Ra/T.ltoreq.0.2 (2) 0.05.ltoreq.Ry/T.ltoreq.0.5 (3) and catalyst nuclei for electroless plating are supplied by applying a solution of a metallic salt to the roughened surface of the insulating resin layer or dipping the substrate in a solution of a metallic salt, drying and heat-treating the substrate, and then subjecting it to displacement palladium plating.
摘要翻译：本发明涉及一种互连结构，其包括一个或多个绝缘膜和一层或多层导体电极图案，其中绝缘膜中的至少一层由含芴骨架的环氧丙烯酸酯树脂组成，以及制备多层互连结构，包括通过无电解电镀使绝缘树脂层的表面粗糙化并在其上形成导体的步骤，其中绝缘树脂的粗糙表面的平均粗糙度（Ra），最大粗糙度（Ry）和导体厚度（T）层满足以下关系：0.2

4. 发明授权

US5372872A Multilayer printed circuit board 失效
标题翻译：多层印刷电路板
公开(公告)号：US5372872A
公开(公告)日：1994-12-13
申请号：US160353
申请日：1993-11-29
申请人： Yoshitsugu Funada , Koji Matsui
发明人： Yoshitsugu Funada , Koji Matsui
IPC分类号： H05K1/02 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H05K3/4641 , H05K1/0219 , H05K1/0224 , H05K2201/0281 , H05K2201/029 , H05K2201/0323 , H05K2201/09536 , H05K2201/10378 , H05K3/4623 , Y10T428/24926 , Y10T428/31522
摘要： A multilayer printed circuit board reducing cross-talk noise between signal interconnection layers and between through-holes for connecting the signal interconnection layers is disclosed. The multilayer printed circuit board has printed substrates each formed thereon an interconnection layer, and prepreg sandwiched therebetween. The prepreg comprises an reinforcement lattice cloth formed of rovings of a electroconductive material maintained at a ground potential and a dielectric resin impregnated thereinto and forming a dielectric solid layer having through-holes penetrating therethrough. The electroconductive reinforcement lattice cloth functions as a ground layer between signal interconnection layers and between through-holes . The rovings may be of a metal or a semiconductive material such as carbon fiber. The multilayer printed circuit board is superior in heat resistance, dimensional stability and mechanical strength.
摘要翻译：公开了一种降低信号互连层之间的串扰噪声和用于连接信号互连层的通孔之间的多层印刷电路板。多层印刷电路板具有各自形成有互连层的印刷基板，夹在其间的预浸料坯。预浸料包括由保持在地电位的导电材料的粗纱和浸渍在其中的电介质树脂形成的增强网格布，并形成具有穿透其中的通孔的介电固体层。导电增强网格布作为信号互连层之间和通孔之间的接地层。粗纱可以是金属或半导体材料，例如碳纤维。多层印刷电路板的耐热性，尺寸稳定性和机械强度优异。

5. 发明授权

US06311888B1 Resin film and a method for connecting electronic parts by the use thereof 有权
公开(公告)号：US06311888B1
公开(公告)日：2001-11-06
申请号：US09544456
申请日：2000-04-07
申请人： Yoshitsugu Funada , Rieka Ohuchi
发明人： Yoshitsugu Funada , Rieka Ohuchi
IPC分类号： B23K3102
CPC分类号： B32B27/08 , B32B27/20 , B32B2250/40 , H01L24/29 , H01L24/45 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/29499 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48624 , H01L2224/48724 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2224/8385 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/15787 , H01L2924/351 , H05K3/323 , H05K2201/0209 , H05K2201/0212 , H05K2201/0379 , H05K2201/10674 , H05K2203/1189 , Y10T428/24942 , Y10T428/259 , Y10T428/31855 , H01L2224/13099 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2924/0503 , H01L2924/0504 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/48
摘要： This invention provides a resin film preferably used for mounting a semiconductor chip on a substrate through flip-chip connection, and a method based on the use of such a resin film. The resin film has a laminated B/A/B structure where a first resin layer (A) having inorganic particles dispersed in an insulating resin is sandwiched by second and third resin layers (B) having no inorganic particles in their insulating resins. The method for connecting electronic parts comprises the steps of forming metal projections (bumps) on a plurality of connection terminals prepared on the surface of a first electronic part; preliminarily pressing the resin film against a plurality of connection terminal surfaces of the other electronic part; applying pressure onto the connection parts in the presence of heat after having properly aligned the metal projections of the first electronic part with the corresponding connection terminals of the other electronic part, thereby establishing electric connection and at the same time mechanical contact between the two electronic parts through the resin film melt and solidifying.

6. 发明授权

US6078229A Surface acoustic wave device mounted with a resin film and method of making same 有权
标题翻译：安装有树脂膜的表面声波装置及其制造方法
公开(公告)号：US6078229A
公开(公告)日：2000-06-20
申请号：US128782
申请日：1998-08-04
申请人： Yoshitsugu Funada , Michinobu Tanioka
发明人： Yoshitsugu Funada , Michinobu Tanioka
IPC分类号： H05K1/14 , H03H3/08 , H03H9/05 , H03H9/25 , H03H9/64
CPC分类号： H03H9/1078 , H03H9/059 , Y10T29/42
摘要： It is an object on the invention to provide a SAW device sealed by resin, which is low priced and suited for decreasing its thickness and weight and requires no particular course for processing a substrate, and a method for fabricating the same. A functional surface of a piezoelectric substrate provided with interdigtal transducers and a mounting surface of a circuit substrate are opposed to each other to form vibration cavities for surface wave propagation areas therebetween. Electrical power is supplied to the piezoelectric substrate from the circuit substrate via electrode pads formed on respective inner surface of both the substrate and bumps inserted therebetween. A resin film adheres to the respective inner surfaces of both the substrates except the surface wave propagation areas to shield the vibration cavity from the environmental space. Apertures are previously formed at predetermined parts of the resin film by means of a laser. A resin film is temporarily adhered to the inner surface of the circuit substrate for instance, and positioning of both the substrates are adjusted relative to each other. Thereafter, both the substrates are permanently adhered to each other by hot-pressing them, and sealing is completed.
摘要翻译：本发明的目的是提供一种由树脂密封的SAW器件，其价格低廉并且适合于减小其厚度和重量，并且不需要特别的处理衬底的过程及其制造方法。设置有齿间传感器和电路基板的安装面的压电基板的功能面彼此相对，以形成其间的表面波传播区域的振动腔。通过形成在两个基板和插入其间的凸块的相应内表面上的电极焊盘，从电路基板向压电基板供电。除了表面波传播区域之外，树脂膜粘附到两个基板的各个内表面，以将振动腔与环境空间隔离。预先通过激光在树脂膜的预定部分处形成孔。例如，树脂膜暂时粘附到电路基板的内表面，并且相对于彼此调整两个基板的定位。此后，通过热压它们两个基板彼此永久地粘合，并且完成密封。

7. 发明授权

US06214446B1 Resin film and a method for connecting electronic parts by the use thereof 有权
标题翻译：树脂膜及其使用方法
公开(公告)号：US06214446B1
公开(公告)日：2001-04-10
申请号：US09258794
申请日：1999-03-01
申请人： Yoshitsugu Funada , Rieka Ohuchi
发明人： Yoshitsugu Funada , Rieka Ohuchi
IPC分类号： B32B702
CPC分类号： B32B27/08 , B32B27/20 , B32B2250/40 , H01L24/29 , H01L24/45 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/29499 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48624 , H01L2224/48724 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2224/8385 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/15787 , H01L2924/351 , H05K3/323 , H05K2201/0209 , H05K2201/0212 , H05K2201/0379 , H05K2201/10674 , H05K2203/1189 , Y10T428/24942 , Y10T428/259 , Y10T428/31855 , H01L2224/13099 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2924/0503 , H01L2924/0504 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/48
摘要： This invention provides a resin film preferably used for mounting a semiconductor chip on a substrate through flip-chip connection, and a method based on the use of such a resin film. The resin film has a laminated B/A/B structure where a first resin layer (A) having inorganic particles dispersed in an insulating resin is sandwiched by second and third resin layers (B) having no inorganic particles in their insulating resins. The method for connecting electronic parts comprises the steps of forming metal projections (bumps) on a plurality of connection terminals prepared on the surface of a first electronic part; preliminarily pressing the resin film against a plurality of connection terminal surfaces of the other electronic part; applying pressure onto the connection parts in the presence of heat after having properly aligned the metal projections of the first electronic part with the corresponding connection terminals of the other electronic part, thereby establishing electric connection and at the same time mechanical contact between the two electronic parts through the resin film melt and solidifying.
摘要翻译：本发明提供一种优选用于通过倒装芯片连接将半导体芯片安装在基板上的树脂膜以及基于使用这种树脂膜的方法。树脂膜具有层压B / A / B结构，其中分散在绝缘树脂中的具有无机颗粒的第一树脂层（A）在其绝缘树脂中被不含无机颗粒的第二和第三树脂层（B）夹持。用于连接电子部件的方法包括在准备在第一电子部件的表面上的多个连接端子上形成金属突起（凸起）的步骤; 预先将树脂膜压靠在另一个电子部件的多个连接端子表面上; 在第一电子部件的金属突起与其他电子部件的对应的连接端子正确对准之后，在存在热的情况下将压力施加到连接部件上，从而建立电连接，同时在两个电子部件之间机械接触通过树脂薄膜熔融固化。

8. 发明授权

US5681648A Printed wiring board and method for preparing the same 失效
标题翻译：印刷电路板及其制备方法
公开(公告)号：US5681648A
公开(公告)日：1997-10-28
申请号：US594297
申请日：1996-01-30
申请人： Yoshitsugu Funada , Koji Matsui
发明人： Yoshitsugu Funada , Koji Matsui
IPC分类号： H05K1/09 , C23C18/16 , C23C18/30 , H05K3/10 , H05K3/18 , H05K3/24 , B32B3/00 , B05D3/04 , B32B9/00
CPC分类号： H05K3/181 , C23C18/1608 , C23C18/1651 , C23C18/208 , C23C18/24 , C23C18/30 , C23C18/54 , H05K3/105 , Y10S428/901 , Y10T428/24917
摘要： The present invention provides a novel printed wiring board which has an insulating substrate. The printed wiring board also has a metal compound layer formed on a surface of the insulating substrate, wherein the metal compound layer is made of a metal compound having a sufficient insulating property and showing a reduction to a metal. The metal compound layer has a surface formed thereon with a metal wiring pattern which is formed by selective reduction of the above metal compound of the metal compound layer. The printed wiring board also has a palladium-displacement plating layer formed on the metal wiring pattern. The printed wiring board also has an electroless plating layer.
摘要翻译：本发明提供一种具有绝缘基板的新型印刷电路板。印刷电路板还具有形成在绝缘基板的表面上的金属化合物层，其中金属化合物层由具有足够绝缘性并显示出金属还原的金属化合物制成。金属化合物层的表面形成有通过金属化合物层的上述金属化合物的选择性还原而形成的金属布线图案。印刷电路板还具有形成在金属布线图案上的钯 - 位移镀层。印刷线路板也具有化学镀层。

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