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1. 发明授权

US06294316B1 Processes for manufacturing flexible printed wiring boards 有权
标题翻译：制造柔性印刷电路板的工艺
公开(公告)号：US06294316B1
公开(公告)日：2001-09-25
申请号：US09477815
申请日：2000-01-05
申请人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
发明人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
IPC分类号： G03F718
CPC分类号： H05K3/4007 , H05K1/0393 , H05K3/002 , H05K3/423 , H05K3/4614 , H05K3/4617 , H05K3/4635 , H05K3/4647 , H05K2201/0154 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0278
摘要： An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21.
摘要翻译：本发明的目的是提供一种用于制造具有细金属凸块的柔性印刷线路板的简单方法。在树脂涂层21和抗蚀剂膜24上依次形成在金属膜11的表面上和表面上形成在金属膜11上的每个金属凸块16，并且在表面上施加压力以将金属凸块16上的抗蚀剂膜24压下，然后进行蚀刻。当树脂涂层21的表面部分地露出在抗蚀剂膜24的凹陷部分时，树脂涂层21的蚀刻从该部分进行，以从树脂涂层21凸出金属凸块16的表面。

2. 发明授权

US06930390B2 Flexible printed wiring boards 失效
标题翻译：柔性印刷线路板
公开(公告)号：US06930390B2
公开(公告)日：2005-08-16
申请号：US09909827
申请日：2001-07-23
申请人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
发明人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
IPC分类号： H05K1/00 , H05K3/00 , H05K3/40 , H05K3/42 , H05K3/46 , H01L23/48
CPC分类号： H05K3/4007 , H05K1/0393 , H05K3/002 , H05K3/423 , H05K3/4614 , H05K3/4617 , H05K3/4635 , H05K3/4647 , H05K2201/0154 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0278
摘要： An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps.A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21. If the resist film 24 is formed after a flexible resin coating 22 is formed on the rigid resin coating 21, the flexible resin coating 22 can serve as an adhesive layer.
摘要翻译：本发明的目的是提供一种用于制造具有细金属凸块的柔性印刷线路板的简单方法。在金属膜11的表面和形成在金属膜11上的各金属凸块16的表面上依次形成树脂涂层21和抗蚀剂膜24，并且在表面上施加压力以压下抗蚀剂金属凸块16上的薄膜24，然后蚀刻。当树脂涂层21的表面部分地露出在抗蚀剂膜24的凹陷部分时，树脂涂层21的蚀刻从该部分进行，以从树脂涂层21凸出金属凸块16的表面。如果在刚性树脂涂层21上形成柔性树脂涂层22之后形成抗蚀剂膜24，则柔性树脂涂层22可以用作粘合剂层。

3. 发明授权

US06653736B2 Multilayer flexible wiring boards 失效
标题翻译：多层柔性布线板
公开(公告)号：US06653736B2
公开(公告)日：2003-11-25
申请号：US10323915
申请日：2002-12-20
申请人： Soichiro Kishimoto , Hiroyuki Hishinuma
发明人： Soichiro Kishimoto , Hiroyuki Hishinuma
IPC分类号： H01L2348
CPC分类号： H05K3/4635 , H01L21/4857 , H01L23/49833 , H01L23/4985 , H01L2224/16 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H05K1/0393 , H05K3/244 , H05K3/28 , H05K3/4617 , H05K2201/0129 , H05K2201/0195 , H05K2201/0367 , H05K2201/0394 , H05K2203/0285 , H05K2203/1189
摘要： A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm2 or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.
摘要翻译：一种适用于安装半导体元件的多层柔性布线板。柔性布线板以下列方式制造。具有在金属布线的表面的至少一部分上露出金属涂层的金属布线的柔性布线板部件被粘附到具有形成有金属涂层的金属突起的另一柔性布线板片上。金属布线和金属突起上的金属涂层中的一个或两个由柔软金属涂层组成，其表面的维氏硬度为80kgf / mm 2或更低。将金属布线的金属涂层与所述金属突起的金属涂层和超声波接触，以将金属布线与金属突起连接。

4. 发明授权

US06812060B1 Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards 失效
标题翻译：多层柔性布线板及制造多层柔性布线板的工艺
公开(公告)号：US06812060B1
公开(公告)日：2004-11-02
申请号：US09688181
申请日：2000-10-16
申请人： Hideyuki Kurita , Hiroyuki Hishinuma
发明人： Hideyuki Kurita , Hiroyuki Hishinuma
IPC分类号： H01L2144
CPC分类号： H05K3/4635 , H01L24/05 , H05K1/0393 , H05K3/28 , H05K3/328 , H05K3/361 , H05K3/4084 , H05K3/4617 , H05K2201/0129 , H05K2201/0379 , H05K2201/0394 , H05K2203/0285 , Y10S439/943
摘要： The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces. A metal coating 26 is formed on the surface of a contact region 181 of a metal wiring 28 of each of two flexible wiring board pieces 10, 30 and ultrasonic wave is individually applied by an ultrasonic resonator 45 to the contact regions 181 in contact with each other. The metal coatings 26 are bonded to form a multilayer flexible wiring board 50. The bumpless process eliminates any plating step for forming bumps without being influenced by non-uniformity bump height. A thermoplastic resin film 33 may be formed on the surface of one flexible wiring board piece 30 to bond flexible wiring board pieces 10, 30 by the adhesion of the resin film 33.
摘要翻译：本发明提供柔性线路板片的无凸缘超声波接合。在两个柔性线路板片10,30中的每一个的金属布线28的接触区域181的表面上形成金属涂层26，并且超声波分别由将超声波谐振器45连接到彼此接触的接触区域181。金属涂层26被接合以形成多层柔性布线板50.无冲击工艺消除了用于形成凸块的任何电镀步骤，而不受不均匀凸起高度的影响。可以在一个柔性布线板片30的表面上形成热塑性树脂膜33，以通过树脂膜33的粘合来粘结柔性布线板片10,30。

5. 发明授权

US06643923B1 Processes for manufacturing flexible wiring boards 失效
标题翻译：制造柔性布线板的工艺
公开(公告)号：US06643923B1
公开(公告)日：2003-11-11
申请号：US09744572
申请日：2001-02-28
申请人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
发明人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
IPC分类号： H05K302
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4857 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K3/423 , H05K3/4647 , H05K2201/0154 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0759 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , H01L2224/05624 , H01L2924/00014
摘要： A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps (16) using a mask film patterned by photolithography. Fine openings are formed in a polyimide film with good precision allowing fine metal bumps (16) to be formed with good precision. After metal bumps (16) have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps (16).
摘要翻译：根据本发明的柔性线路板的制造方法包括使用通过光刻图案化的掩模膜生长金属凸块（16）。在聚酰亚胺膜中形成精细的开口，精度高，能够精确地形成精细的金属凸块（16）。在形成金属凸块（16）之后，除去掩模膜并施加液体树脂材料并干燥以形成涂层，然后将其固化成树脂膜。涂层可以在涂覆阶段在表面部分进行蚀刻以暴露金属凸块（16）的顶部。

6. 发明申请

US20060249856A1 Bumpless semiconductor device 失效
标题翻译：无铅半导体器件
公开(公告)号：US20060249856A1
公开(公告)日：2006-11-09
申请号：US11486075
申请日：2006-07-14
申请人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
发明人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/131 , H01L2224/73203 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/00015 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要翻译：当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。无源半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电粒子4金属结合到电焊盘2。作为导电粒子4，使用在树脂粒子的表面形成金属镀层的复合粒子。可以通过（a）使导电颗粒静电吸附在平板的一个面上来制造这种无凸起的半导体器件; 和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜，并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

7. 发明授权

US06848176B2 Process for manufacturing flexible wiring boards 失效
标题翻译：制造柔性布线板的工艺
公开(公告)号：US06848176B2
公开(公告)日：2005-02-01
申请号：US10640272
申请日：2003-08-14
申请人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
发明人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
IPC分类号： H05K3/18 , H01L21/48 , H01L21/60 , H01L23/498 , H05K3/40 , H05K3/42 , H05K3/46 , H05K3/02 , H05K3/10
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4857 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K3/423 , H05K3/4647 , H05K2201/0154 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0759 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , H01L2224/05624 , H01L2924/00014
摘要： A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.
摘要翻译：根据本发明的制造柔性布线板的方法包括使用通过光刻图案化的掩模膜生长金属凸块16。可以精确地形成精细的开口，因此，由于激光束不用于在聚酰亚胺膜中形成开口，所以可以以高精度形成精细的金属凸块16。在形成金属凸块16之后，去除掩模膜并施加液态树脂材料并干燥以形成涂层，然后将其固化成树脂膜。可以在涂覆阶段期间在表面部分蚀刻涂层以暴露金属凸块16的顶部。

8. 发明授权

US07638876B2 Bumpless semiconductor device 失效
标题翻译：无铅半导体器件
公开(公告)号：US07638876B2
公开(公告)日：2009-12-29
申请号：US11486075
申请日：2006-07-14
申请人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
发明人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/131 , H01L2224/73203 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/00015 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要翻译：当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。无电解半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电颗粒4金属地结合到电焊盘2.复合颗粒，其中金属镀层形成在树脂粒子表面的导电粒子4.这种无凸起的半导体器件可以通过（a）使导电粒子静电吸附在平板的一个面上来制造; 和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜，并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

9. 发明授权

US06524892B1 Method of fabricating multilayer flexible wiring boards 有权
标题翻译：多层柔性布线板的制作方法
公开(公告)号：US06524892B1
公开(公告)日：2003-02-25
申请号：US09707957
申请日：2000-11-08
申请人： Soichiro Kishimoto , Hiroyuki Hishinuma
发明人： Soichiro Kishimoto , Hiroyuki Hishinuma
IPC分类号： H01L2144
CPC分类号： H05K3/4635 , H01L21/4857 , H01L23/49833 , H01L23/4985 , H01L2224/16 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H05K1/0393 , H05K3/244 , H05K3/28 , H05K3/4617 , H05K2201/0129 , H05K2201/0195 , H05K2201/0367 , H05K2201/0394 , H05K2203/0285 , H05K2203/1189
摘要： A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm2 or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.
摘要翻译：一种适用于安装半导体元件的多层柔性布线板。柔性布线板以下列方式制造。具有在金属布线的表面的至少一部分上露出金属涂层的金属布线的柔性布线板部件被粘附到具有形成有金属涂层的金属突起的另一柔性布线板片上。金属布线和金属突起上的金属涂层中的一个或两个由柔软金属涂层组成，其表面的维氏硬度为80kgf / mm 2或更低。将金属布线的金属涂层与所述金属突起的金属涂层和超声波接触，以将金属布线与金属突起连接。

10. 发明授权

US07109058B2 Bumpless semiconductor device 有权
标题翻译：无铅半导体器件
公开(公告)号：US07109058B2
公开(公告)日：2006-09-19
申请号：US10467638
申请日：2002-02-18
申请人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
发明人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/131 , H01L2224/73203 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/00015 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要翻译：当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。无源半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电粒子4金属结合到电焊盘2。采用在树脂粒子表面形成有金属镀层的复合粒子作为导电粒子4.这种无凸起的半导体器件可以通过（a）使导电粒子静电吸附在平板的一个面上来制造。和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜，并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

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