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1. 发明授权

US07109058B2 Bumpless semiconductor device 有权
标题翻译：无铅半导体器件
公开(公告)号：US07109058B2
公开(公告)日：2006-09-19
申请号：US10467638
申请日：2002-02-18
申请人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
发明人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/131 , H01L2224/73203 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/00015 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要翻译：当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。无源半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电粒子4金属结合到电焊盘2。采用在树脂粒子表面形成有金属镀层的复合粒子作为导电粒子4.这种无凸起的半导体器件可以通过（a）使导电粒子静电吸附在平板的一个面上来制造。和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜，并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

2. 发明申请

US20060249856A1 Bumpless semiconductor device 失效
标题翻译：无铅半导体器件
公开(公告)号：US20060249856A1
公开(公告)日：2006-11-09
申请号：US11486075
申请日：2006-07-14
申请人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
发明人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/131 , H01L2224/73203 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/00015 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要翻译：当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。无源半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电粒子4金属结合到电焊盘2。作为导电粒子4，使用在树脂粒子的表面形成金属镀层的复合粒子。可以通过（a）使导电颗粒静电吸附在平板的一个面上来制造这种无凸起的半导体器件; 和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜，并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

3. 发明授权

US07638876B2 Bumpless semiconductor device 失效
标题翻译：无铅半导体器件
公开(公告)号：US07638876B2
公开(公告)日：2009-12-29
申请号：US11486075
申请日：2006-07-14
申请人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
发明人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/131 , H01L2224/73203 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/00015 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要翻译：当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。无电解半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电颗粒4金属地结合到电焊盘2.复合颗粒，其中金属镀层形成在树脂粒子表面的导电粒子4.这种无凸起的半导体器件可以通过（a）使导电粒子静电吸附在平板的一个面上来制造; 和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜，并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

4. 发明授权

US07053312B2 Flexible wiring boards 有权
标题翻译：柔性线路板
公开(公告)号：US07053312B2
公开(公告)日：2006-05-30
申请号：US10640401
申请日：2003-08-14
申请人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
发明人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
IPC分类号： H05K1/00
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4857 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K3/423 , H05K3/4647 , H05K2201/0154 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0759 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , H01L2224/05624 , H01L2924/00014
摘要： A flexible wiring board are formed by growing metal bumps using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps can be formed with good precision because laser beam is not used to form opening in a polyimide film. After metal bumps have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to exposed the tops of metal bumps.
摘要翻译：通过使用通过光刻图案化的掩模膜生长金属凸块来形成柔性布线板。可以以良好的精度形成精细的开口，因此，由于激光束不用于在聚酰亚胺膜中形成开口，所以可以以高精度形成细小的金属凸块。在形成金属凸块之后，去除掩模膜，并施加液体树脂材料并干燥以形成涂层，然后将其固化成树脂膜。涂层可以在涂层阶段在表面部分进行蚀刻，以露出金属凸块的顶部。

5. 发明授权

US06717064B1 Substrate piece and flexible substrate 失效
标题翻译：基板和柔性基板
公开(公告)号：US06717064B1
公开(公告)日：2004-04-06
申请号：US09494040
申请日：2000-01-31
申请人： Hideyuki Kurita , Masato Taniguchi , Masayuki Nakamura , Hiroyuki Hishinuma , Hidetsugu Namiki
发明人： Hideyuki Kurita , Masato Taniguchi , Masayuki Nakamura , Hiroyuki Hishinuma , Hidetsugu Namiki
IPC分类号： H05K102
CPC分类号： H05K3/4617 , H01L24/16 , H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K3/28 , H05K3/4007 , H05K3/423 , H05K3/4647 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H01L2924/00 , H01L2224/0401
摘要： A flexible printed wiring board constructed by using elemental pieces at a low cost. The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24c on one face and adhesive resin films 19a to 19c on the other face. The supporting films 24a to 24c have connecting openings on the bottom face of which the surface of metal wiring circuits are exposed as lands 23a to 23c. On the other hand, conductive bumps 16a to 16c, which are connected respectively to the metal wiring circuits 14a to 14c, project on the resin films 19a to 19c. To construct a flexible printed wiring board 83 by using plural elemental pieces 81a to 81c, the tips of the conductive bumps 16b and 16c are brought into contact respectively with the lands 23a and 23b on the bottom face of the openings and contact-bonded under heating. Thus, the elemental pieces 81a to 81c are adhered to each other owing to the adhesiveness of the resin film 19b and 19c. The connection among the elemental pieces 81a to 81c can be further enhanced by surface-roughing the supporting films 24a to 24c.
摘要翻译：以低成本使用元件构成的柔性印刷布线板。根据本发明的元件片81a至81c分别在一个面上设置有支撑膜24a至24c，在另一个面上分别设置粘合树脂膜19a至19c。支撑膜24a至24c在其底面上具有连接开口，金属布线电路的表面露出为接地片23a至23c。另一方面，分别连接到金属布线电路14a至14c的导电凸块16a至16c突出在树脂膜19a至19c上。为了通过使用多个元件81a至81c来构造柔性印刷线路板83，导电凸块16b和16c的顶端分别与开口底面上的焊盘23a和23b接触并在加热下接触接合。因此，由于树脂膜19b和19c的粘附性，元件片81a至81c彼此粘合。通过对支撑膜24a〜24c进行表面粗化，能够进一步提高元件81a〜81c之间的连接。

6. 发明授权

US06643923B1 Processes for manufacturing flexible wiring boards 失效
标题翻译：制造柔性布线板的工艺
公开(公告)号：US06643923B1
公开(公告)日：2003-11-11
申请号：US09744572
申请日：2001-02-28
申请人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
发明人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
IPC分类号： H05K302
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4857 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K3/423 , H05K3/4647 , H05K2201/0154 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0759 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , H01L2224/05624 , H01L2924/00014
摘要： A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps (16) using a mask film patterned by photolithography. Fine openings are formed in a polyimide film with good precision allowing fine metal bumps (16) to be formed with good precision. After metal bumps (16) have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps (16).
摘要翻译：根据本发明的柔性线路板的制造方法包括使用通过光刻图案化的掩模膜生长金属凸块（16）。在聚酰亚胺膜中形成精细的开口，精度高，能够精确地形成精细的金属凸块（16）。在形成金属凸块（16）之后，除去掩模膜并施加液体树脂材料并干燥以形成涂层，然后将其固化成树脂膜。涂层可以在涂覆阶段在表面部分进行蚀刻以暴露金属凸块（16）的顶部。

7. 发明授权

US06848176B2 Process for manufacturing flexible wiring boards 失效
标题翻译：制造柔性布线板的工艺
公开(公告)号：US06848176B2
公开(公告)日：2005-02-01
申请号：US10640272
申请日：2003-08-14
申请人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
发明人： Hiroyuki Hishinuma , Hideyuki Kurita , Ryo Ito , Masayuki Nakamura
IPC分类号： H05K3/18 , H01L21/48 , H01L21/60 , H01L23/498 , H05K3/40 , H05K3/42 , H05K3/46 , H05K3/02 , H05K3/10
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4857 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K3/423 , H05K3/4647 , H05K2201/0154 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0759 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , H01L2224/05624 , H01L2924/00014
摘要： A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.
摘要翻译：根据本发明的制造柔性布线板的方法包括使用通过光刻图案化的掩模膜生长金属凸块16。可以精确地形成精细的开口，因此，由于激光束不用于在聚酰亚胺膜中形成开口，所以可以以高精度形成精细的金属凸块16。在形成金属凸块16之后，去除掩模膜并施加液态树脂材料并干燥以形成涂层，然后将其固化成树脂膜。可以在涂覆阶段期间在表面部分蚀刻涂层以暴露金属凸块16的顶部。

8. 发明授权

US09129437B2 Line plotting method 有权
标题翻译：线绘图法
公开(公告)号：US09129437B2
公开(公告)日：2015-09-08
申请号：US12428212
申请日：2009-04-22
申请人： Kouji Nishikawa , Makoto Adachi , Masayuki Nakamura , Motonobu Mamiya , Kae Yamashita
发明人： Kouji Nishikawa , Makoto Adachi , Masayuki Nakamura , Motonobu Mamiya , Kae Yamashita
IPC分类号： G06T11/20
CPC分类号： G06T11/203
摘要： A line plotting method for plotting lines whose coordinates are given on a display screen on which pixels are arranged according to a prescribed rule, the method includes correcting coordinates at the end point of a line on the basis of which the end point is a starting point or an ending point or whether the end point is inside a prescribed frame determining whether a direction from a starting point of a line after correction toward its ending point horizontally or vertically is the same as a direction from a starting point before correction of a line toward its ending point determining whether integer values of the coordinates of starting and ending points after correction are the same when directions from starting points after and before correction of a line toward their ending points are not matched.
摘要翻译：一种线绘制方法，用于绘制在根据规定的规则排列像素的显示屏上给出其坐标的线，该方法包括校正终点处的起点处的线的终点处的坐标或者终点是否在规定的帧内，确定从校正后的线的起点到水平或垂直的终点的方向是否与从线的校正前的起点的方向相同其终点确定校正后的开始点和结束点的坐标的整数值是否相同，当从线路朝向其终点的校正之前和之后的起始点的方向不匹配时。

9. 发明授权

US08462167B2 Memory access control circuit and image processing system 有权
标题翻译：存储器访问控制电路和图像处理系统
公开(公告)号：US08462167B2
公开(公告)日：2013-06-11
申请号：US12608322
申请日：2009-10-29
申请人： Akihiro Kawahara , Makoto Adachi , Kouji Nishikawa , Masayuki Nakamura , Motonobu Mamiya , Kae Yamashita
发明人： Akihiro Kawahara , Makoto Adachi , Kouji Nishikawa , Masayuki Nakamura , Motonobu Mamiya , Kae Yamashita
IPC分类号： G06T1/60
CPC分类号： G09G5/397 , G09G5/363 , G09G5/393
摘要： A memory access control circuit includes a first internal register, an address transmitting unit that sets a state of the first internal register to a first state to transmit a first address and sets a state of the first internal register to a second state to transmit a second address, a second internal register, a data receiving unit that sets a state of the second internal register to a third state to receive first data corresponding to the first address, performs data processing on the first data without delay, sets a state of the second internal register to a fourth state to receive second data corresponding to the second address, and performs data processing on the second data after delaying the second data by a given delay time, a first backup unit and a second backup unit.
摘要翻译：存储器访问控制电路包括第一内部寄存器，地址发送单元，其将第一内部寄存器的状态设置为第一状态以发送第一地址，并将第一内部寄存器的状态设置为第二状态，以发送第二内部寄存器地址，第二内部寄存器，数据接收单元，其将第二内部寄存器的状态设置为第三状态，以接收对应于第一地址的第一数据，对延迟的第一数据执行数据处理，设置第二内部寄存器的状态内部寄存器到第四状态以接收对应于第二地址的第二数据，并且在延迟给定延迟时间的第二数据之后对第二数据执行数据处理，第一备份单元和第二备份单元。

10. 发明授权

US08394503B2 Resin-metal bonded article and method for producing the same 有权
标题翻译：树脂金属粘结制品及其制造方法
公开(公告)号：US08394503B2
公开(公告)日：2013-03-12
申请号：US12735062
申请日：2008-12-15
申请人： Masumi Kuroyama , Kazuo Kato , Tomonori Ishikawa , Yaeko Sasaki , Setsuko Sato , Masayuki Nakamura , Shuhei Miura
发明人： Masumi Kuroyama , Kazuo Kato , Tomonori Ishikawa , Yaeko Sasaki , Setsuko Sato , Masayuki Nakamura , Shuhei Miura
IPC分类号： B32B15/04 , B32B15/09 , B32B15/20 , B32B18/00 , B32B37/12
CPC分类号： B29C45/14311 , B29K2067/006 , B29K2081/04 , B29K2705/00 , Y10T156/1089 , Y10T428/31533 , Y10T428/31678 , Y10T428/31681 , Y10T428/31786
摘要： Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10%≦Cu2O/(Cu2O+CuO)≦75%. Preferably, this resin-metal bonded article further contains a triazine thiol derivative in the resin-component-side bonding surface of the copper component.
摘要翻译：公开了一种改善了铜成分和PPS或PBT树脂之间的粘合性的树脂 - 金属接合体。还公开了一种用于制造这种树脂 - 金属粘合制品的方法。树脂金属接合体是通过将铜氧化物的铜成分接合面与铜成分的表面接合而得到的，其中，氧化铜的含量为10％以下; Cu 2 O /（Cu 2 O + CuO）％。优选地，该树脂金属粘合体在铜成分的树脂成分侧接合面中还含有三嗪硫醇衍生物。

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