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1. 发明授权

US06930390B2 Flexible printed wiring boards 失效
标题翻译：柔性印刷线路板
公开(公告)号：US06930390B2
公开(公告)日：2005-08-16
申请号：US09909827
申请日：2001-07-23
申请人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
发明人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
IPC分类号： H05K1/00 , H05K3/00 , H05K3/40 , H05K3/42 , H05K3/46 , H01L23/48
CPC分类号： H05K3/4007 , H05K1/0393 , H05K3/002 , H05K3/423 , H05K3/4614 , H05K3/4617 , H05K3/4635 , H05K3/4647 , H05K2201/0154 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0278
摘要： An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps.A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21. If the resist film 24 is formed after a flexible resin coating 22 is formed on the rigid resin coating 21, the flexible resin coating 22 can serve as an adhesive layer.
摘要翻译：本发明的目的是提供一种用于制造具有细金属凸块的柔性印刷线路板的简单方法。在金属膜11的表面和形成在金属膜11上的各金属凸块16的表面上依次形成树脂涂层21和抗蚀剂膜24，并且在表面上施加压力以压下抗蚀剂金属凸块16上的薄膜24，然后蚀刻。当树脂涂层21的表面部分地露出在抗蚀剂膜24的凹陷部分时，树脂涂层21的蚀刻从该部分进行，以从树脂涂层21凸出金属凸块16的表面。如果在刚性树脂涂层21上形成柔性树脂涂层22之后形成抗蚀剂膜24，则柔性树脂涂层22可以用作粘合剂层。

2. 发明授权

US06294316B1 Processes for manufacturing flexible printed wiring boards 有权
标题翻译：制造柔性印刷电路板的工艺
公开(公告)号：US06294316B1
公开(公告)日：2001-09-25
申请号：US09477815
申请日：2000-01-05
申请人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
发明人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
IPC分类号： G03F718
CPC分类号： H05K3/4007 , H05K1/0393 , H05K3/002 , H05K3/423 , H05K3/4614 , H05K3/4617 , H05K3/4635 , H05K3/4647 , H05K2201/0154 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0278
摘要： An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21.
摘要翻译：本发明的目的是提供一种用于制造具有细金属凸块的柔性印刷线路板的简单方法。在树脂涂层21和抗蚀剂膜24上依次形成在金属膜11的表面上和表面上形成在金属膜11上的每个金属凸块16，并且在表面上施加压力以将金属凸块16上的抗蚀剂膜24压下，然后进行蚀刻。当树脂涂层21的表面部分地露出在抗蚀剂膜24的凹陷部分时，树脂涂层21的蚀刻从该部分进行，以从树脂涂层21凸出金属凸块16的表面。

3. 发明授权

US06977349B2 Method for manufacturing wiring circuit boards with bumps and method for forming bumps 失效
标题翻译：用于制造具有凸块的布线电路板的方法和用于形成凸块的方法
公开(公告)号：US06977349B2
公开(公告)日：2005-12-20
申请号：US10403024
申请日：2003-04-01
申请人： Yutaka Kaneda , Keiichi Naito , Toshihiro Shinohara
发明人： Yutaka Kaneda , Keiichi Naito , Toshihiro Shinohara
IPC分类号： H05K3/34 , H05K3/06 , H05K3/20 , H05K3/40 , H05K3/46 , H01K1/00
CPC分类号： H05K3/4007 , H05K3/06 , H05K3/20 , H05K2201/0367 , H05K2203/0369
摘要： Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.
摘要翻译：可以制造具有凸块的布线电路板，使得可以进行稳定的凸点连接，并且不需要电镀预处理或其他难以操作的电镀。通过利用凸起形成蚀刻掩模7形成在金属箔3的凸起形成表面3a上的技术，金属箔3的厚度是布线电路1的厚度t 1和高度t 2之和要形成在布线电路1上的凸块2（t 1 + t 2），然后通过将金属箔3半蚀刻到与所需的凸起高度t 2相对应的深度来形成凸块2 凸点形成蚀刻掩模7侧，可以制造具有凸起的布线电路板，使得可以进行稳定的凸点连接，并且不需要电镀预处理或其他复杂的工艺。

4. 发明授权

US06312614B1 Method for production of interposer for mounting semiconductor element 失效
标题翻译：用于安装半导体元件的插入件的制造方法
公开(公告)号：US06312614B1
公开(公告)日：2001-11-06
申请号：US09577883
申请日：2000-05-25
申请人： Yoshio Arimitsu , Yutaka Kaneda
发明人： Yoshio Arimitsu , Yutaka Kaneda
IPC分类号： H01L2100
CPC分类号： H05K3/242 , H01L21/4846 , H01L23/4985 , H01L2924/0002 , H01L2924/3011 , H05K3/064 , H05K3/28 , H05K2203/0571 , H05K2203/058 , H05K2203/0588 , H01L2924/00
摘要： A semiconductor element mounting interposer is produced by (A) forming a conducting circuit that comprises motherboard connecting electrodes 2 and plated leads 3 on an insulating base film 1; (B) forming a patterning resin layer 5 over the conducting circuit 4; (C) etching patterning resin layer 5 so as to expose the motherboard connecting electrodes 2 and plated leads 3; (D) masking plated leads 3 with an electroplating resist layer 6; (E) depositing an electroplated metal layer 7 over the exposed motherboard connecting electrodes 2; (F) removing the electroplating resist layer 6; (G) removing the exposed plated leads 3 through etching; and (H) where the patterning resin layer 5 is a polyimide precursor layer, bringing about complete imidation of the polyimide precursor layer.
摘要翻译：通过（A）在绝缘基膜1上形成包括母板连接电极2和电镀引线3的导电电路来制造半导体元件安装插入件; （B）在导电电路4上形成图案化树脂层5; （C）蚀刻图形化树脂层5，以使母板连接电极2和电镀引线3露出; （D）用电镀抗蚀剂层6对电镀引线3进行掩模; （E）在暴露的母板连接电极2上沉积电镀金属层7; （F）去除电镀抗蚀剂层6; （G）通过蚀刻去除暴露的电镀引线3; 和（H），其中图案形成树脂层5是聚酰亚胺前体层，使聚酰亚胺前体层完全酰化。

5. 发明授权

US5187692A Acoustic transfer function simulating method and simulator using the same 失效
标题翻译：声学传递函数模拟方法和使用它的模拟器
公开(公告)号：US5187692A
公开(公告)日：1993-02-16
申请号：US856654
申请日：1992-03-20
申请人： Yoichi Haneda , Shoji Makino , Yutaka Kaneda
发明人： Yoichi Haneda , Shoji Makino , Yutaka Kaneda
IPC分类号： G01H5/00 , G01H17/00 , G10K11/178 , H04R3/02 , H04R3/04 , H04R29/00 , H04S1/00 , H04S7/00
CPC分类号： H04S1/005 , H04R29/00 , H04R3/02 , H04R3/04 , H04S2420/01 , H04S7/30 , Y10S367/901
摘要： A plurality of acoustic transfer functions for a plurality of sets of different positions of a loudspeaker and a microphone in an acoustic system are measured by an acoustic transfer function measuring part. The plurality of measured acoustic transfer functions are used to estimate poles of the acoustic system by a pole estimation part, and a fixed AR filter is provided with the estimated poles as fixed values. A variable MA filter is connected in series to the fixed AR filter and the acoustic transfer function of the acoustic system is simulated by the two filters. The filter coefficients of the variable MA filter are modified with a change in the acoustic transfer function of the acoustic system.

6. 发明授权

US07407694B2 Block copolymer 失效
标题翻译：嵌段共聚物
公开(公告)号：US07407694B2
公开(公告)日：2008-08-05
申请号：US11203608
申请日：2005-08-11
申请人： Akio Taniguchi , Kentaro Takesada , Yutaka Kaneda , Tadashi Kokubo , Nobuaki Ohshiro , Atsushi Kumasaki , Takeshi Chiba , Tomoki Hiiro
发明人： Akio Taniguchi , Kentaro Takesada , Yutaka Kaneda , Tadashi Kokubo , Nobuaki Ohshiro , Atsushi Kumasaki , Takeshi Chiba , Tomoki Hiiro
IPC分类号： C08L53/00
CPC分类号： C08F293/00 , C08F293/005 , Y10T428/1352 , Y10T428/1386 , Y10T428/139
摘要： The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.
摘要翻译：本发明涉及包含（甲基）丙烯酸聚合物嵌段（a）和丙烯酸类聚合物嵌段（b）的嵌段共聚物（A）。（甲基）丙烯酸系聚合物嵌段（a）优选与具有高凝聚力的官能团的单体如羧基共聚，使得5％重量损失温度为300℃以上或拉伸强度为3MPa以上，通过根据JIS K6253的A型硬度计测定的硬度为50以下，在70℃下22小时后测定的压缩永久变形量为45％以下。嵌段共聚物（A）在高温下表现出优异的耐热分解性和低压缩永久变形。嵌段共聚物（A）可以用作汽车的软质材料，硬度低，附着力高，耐油性高，耐候性高，耐热性高，回收性能好，拉伸性能好，脱蜡性高。

7. 发明授权

US07309736B2 Acrylic block copolymer and thermoplastic resin composition 失效
标题翻译：丙烯酸嵌段共聚物和热塑性树脂组合物
公开(公告)号：US07309736B2
公开(公告)日：2007-12-18
申请号：US10522869
申请日：2003-07-31
申请人： Akio Taniguchi , Tadashi Kokubo , Kentaro Takesada , Kozo Kondo , Takeshi Chiba , Atsushi Kumasaki , Yutaka Kaneda
发明人： Akio Taniguchi , Tadashi Kokubo , Kentaro Takesada , Kozo Kondo , Takeshi Chiba , Atsushi Kumasaki , Yutaka Kaneda
IPC分类号： C08L53/00
CPC分类号： C08F293/005 , C08F8/48 , C08F297/026 , C08F2438/01 , C08L53/00 , C08L2666/02 , C09J153/00
摘要： The present invention provides a novel acrylic block copolymer rich in flexibility and excellent in mechanical strength, moldability, oil resistance, heat resistance, thermal decomposition resistance, weather resistance, and compression set, and further rich in reactivity. The present invention also provides compositions, seal products, and automobile, electric, and electronic parts, all of which include the acrylic block copolymer. The acrylic block copolymer includes a methacrylic polymer block (a) and an acrylic polymer block (b), at least one of the polymer blocks containing, in its main chain, at least one acid anhydride group (c) represented by formula (1): (wherein R1s each represent hydrogen or a methyl group and may be the same or different, n represents an integer of 0 to 3, and m represents an integer of 0 or 1).
摘要翻译：本发明提供了一种具有柔软性，机械强度，成型性，耐油性，耐热性，耐热分解性，耐候性和压缩永久变形性优异，反应性更强的新型丙烯酸系嵌段共聚物。本发明还提供组合物，密封产品以及汽车，电气和电子部件，所有这些部件都包括丙烯酸类嵌段共聚物。丙烯酸嵌段共聚物包括甲基丙烯酸系聚合物嵌段（a）和丙烯酸系聚合物嵌段（b），至少一个聚合物嵌段在其主链中含有至少一个由式（1）表示的酸酐基团（c）：（其中R 1〜S各自表示氢或甲基，可以相同或不同，n表示0〜3的整数，m表示0或1的整数）。

8. 发明申请

US20050272865A1 Block copolymer 失效
标题翻译：嵌段共聚物
公开(公告)号：US20050272865A1
公开(公告)日：2005-12-08
申请号：US11203608
申请日：2005-08-11
申请人： Akio Taniguchi , Kentaro Takesada , Yutaka Kaneda , Tadashi Kokubo , Nobuaki Ohshiro , Atsushi Kumasaki , Takeshi Chiba , Tomoki Hiiro
发明人： Akio Taniguchi , Kentaro Takesada , Yutaka Kaneda , Tadashi Kokubo , Nobuaki Ohshiro , Atsushi Kumasaki , Takeshi Chiba , Tomoki Hiiro
IPC分类号： C08F293/00 , C08L51/04
CPC分类号： C08F293/00 , C08F293/005 , Y10T428/1352 , Y10T428/1386 , Y10T428/139
摘要： The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.
摘要翻译：本发明涉及包含（甲基）丙烯酸聚合物嵌段（a）和丙烯酸类聚合物嵌段（b）的嵌段共聚物（A）。（甲基）丙烯酸系聚合物嵌段（a）优选与具有高凝聚力的官能团的单体如羧基共聚，使得5％重量损失温度为300℃以上或拉伸强度为3MPa以上，通过根据JIS K6253的A型硬度计测定的硬度为50以下，在70℃下22小时后测定的压缩永久变形量为45％以下。嵌段共聚物（A）在高温下表现出优异的耐热分解性和低压缩永久变形。嵌段共聚物（A）可以用作汽车的软质材料，硬度低，附着力高，耐油性高，耐候性高，耐热性高，回收性能好，拉伸性能好，脱蜡性高。

9. 发明授权

US5408530A Echo cancelling method and echo canceller using the same 失效
标题翻译：回波消除方法和回波消除器使用相同
公开(公告)号：US5408530A
公开(公告)日：1995-04-18
申请号：US127375
申请日：1993-09-28
申请人： Shoji Makino , Yutaka Kaneda
发明人： Shoji Makino , Yutaka Kaneda
IPC分类号： H04B3/23 , H04M9/08
CPC分类号： H04M9/082
摘要： A received signal vector x(n), a coefficient error covariance matrix P(n) from a memory part 12 and a forgetting factor .nu. from a memory part 13 are provided to a gain calculating part 14 to obtain a gain vector k(n). The thus obtained gain vector k(n) and an error e(n) between an echo and an echo replica are multiplied in a multiplying part 16. The multiplied output and a filter coefficient h(n) from a memory part 18 are added together to update the latter. The thus updated filter coefficient is used as the filter coefficient of an estimated echo path (an FIR filter, for example). The coefficient error covariance matrix P(n), the gain vector k(n), the received signal vector x(n) and the forgetting factor .nu. are provided to an updating part 19 to update the coefficient error covariance matrix P(n), and an adjustment matrix A representing an expectation of an impulse response variation of an echo path is added to the updated coefficient error covariance matrix P(n) and the added value is used as a new coefficient error covariance matrix P(n).
摘要翻译：接收信号矢量x（n），来自存储器部分12的系数误差协方差矩阵P（n）和来自存储器部分13的遗忘因子nu被提供给增益计算部分14以获得增益矢量k（n）。如此获得的增益矢量k（n）和回波和回波复制品之间的误差e（n）在乘法部分16中相乘。将乘法输出和来自存储器部分18的滤波器系数h（n）相加在一起更新后者。将这样更新的滤波器系数用作估计回波路径的滤波器系数（例如FIR滤波器）。将系数误差协方差矩阵P（n），增益矢量k（n），接收信号矢量x（n）和遗忘因子nu提供给更新部分19以更新系数误差协方差矩阵P（n）并且将表示回波路径的脉冲响应变化的期望的调整矩阵A添加到更新的系数误差协方差矩阵P（n），并且将附加值用作新的系数误差协方差矩阵P（n）。

10. 发明授权

US07211735B2 Processes for manufacturing multilayer flexible wiring boards 有权
标题翻译：制造多层柔性布线板的工艺
公开(公告)号：US07211735B2
公开(公告)日：2007-05-01
申请号：US10028624
申请日：2001-12-20
申请人： Yutaka Kaneda
发明人： Yutaka Kaneda
IPC分类号： H05K1/00
CPC分类号： H05K3/0002 , H05K1/0393 , H05K3/002 , H05K3/0082 , H05K3/064 , H05K3/4007 , H05K3/423 , H05K3/4614 , H05K3/4635 , H05K2201/0166 , H05K2201/0367 , H05K2203/056 , H05K2203/0733 , H05K2203/1545 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： A process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.
摘要翻译：一种制造多层柔性布线板的方法，其允许各层布线板精确定位并容易堆叠。制备用于曝光的掩模，其中与垂直于基板的传送方向P的方向布置与多层柔性布线板的布线板的各层相对应的多个图案孔。该曝光用掩模用于形成与同一片状基板上的多层柔性布线基板的各层布线基板对应的多个布线图案。

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