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1. 发明授权

US07061122B2 Components, methods and assemblies for multi-chip packages 有权
标题翻译：用于多芯片封装的组件，方法和组件
公开(公告)号：US07061122B2
公开(公告)日：2006-06-13
申请号：US10683097
申请日：2003-10-10
申请人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
发明人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
IPC分类号： H01L29/40
CPC分类号： H05K1/141 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/3511 , H05K3/3436 , H05K2201/10719 , H05K2203/1572 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647
摘要： An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
摘要翻译：具有独立测试和修复功能的超薄系统级封装（SIP）包括：插入器，其布置在其顶表面和底表面上，多个封装的半导体芯片通过焊料凸块安装，根据Land Grid Array （LGA）格式，并且其中在SIP上不使用底部填充物。

2. 发明申请

US20070166876A1 Components, methods and assemblies for multi-chip packages 审中-公开
标题翻译：用于多芯片封装的组件，方法和组件
公开(公告)号：US20070166876A1
公开(公告)日：2007-07-19
申请号：US11324453
申请日：2006-01-03
申请人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
发明人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
IPC分类号： H01L21/00
CPC分类号： H05K1/141 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/3511 , H05K3/3436 , H05K2201/10719 , H05K2203/1572 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647
摘要： An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
摘要翻译：具有独立测试和修复功能的超薄系统级封装（SIP）包括：插入器，其布置在其顶表面和底表面上，多个封装的半导体芯片通过焊料凸块安装，根据Land Grid Array （LGA）格式，并且其中在SIP上不使用底部填充物。

3. 发明授权

US07149095B2 Stacked microelectronic assemblies 有权
标题翻译：堆叠的微电子组件
公开(公告)号：US07149095B2
公开(公告)日：2006-12-12
申请号：US10281550
申请日：2002-10-28
申请人： Michael Warner , Philip Damberg , John B. Riley , David Gibson , Young-Gon Kim , Belgacem Haba , Vernon Solberg
发明人： Michael Warner , Philip Damberg , John B. Riley , David Gibson , Young-Gon Kim , Belgacem Haba , Vernon Solberg
IPC分类号： H05K1/11
CPC分类号： H05K1/189 , H01L23/5387 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/3011 , H01L2224/05599
摘要： A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the at least one attachment site and electrically connected to at least some of the first and second contacts. The substrate is folded so that the first contacts are accessible at a bottom of a subassembly and the second contacts are accessible at a top of a subassembly. The plurality of subassemblies are stacked one on top of another in a generally vertical configuration. The substrate of at least one of the subassemblies has a plurality of attachment sites and a plurality of microelectronic elements assembled to the attachment sites. The substrate is folded so that at least some of the plurality of microelectronic elements are disposed alongside one another.
摘要翻译：堆叠的微电子组件包括多个微电子子组件。每个子组件包括具有至少一个位置，多个第一触点和多个第二触点的基板。每个子组件还具有组装到至少一个附接位置并电连接到第一和第二触点中的至少一些的至少一个微电子元件。折叠基板使得第一触头在子组件的底部可接近，并且第二触头可在子组件的顶部接近。多个子组件以大致垂直的配置堆叠在另一个之上。至少一个子组件的衬底具有多个附接位置和组装到附接位置的多个微电子元件。折叠基板使得多个微电子元件中的至少一些彼此并排设置。

4. 发明授权

US06885106B1 Stacked microelectronic assemblies and methods of making same 失效
标题翻译：堆叠的微电子组件及其制造方法
公开(公告)号：US06885106B1
公开(公告)日：2005-04-26
申请号：US10044121
申请日：2002-01-11
申请人： Philip Damberg , Craig S. Mitchell , John B. Riley , Michael Warner , Joseph Fjelstad
发明人： Philip Damberg , Craig S. Mitchell , John B. Riley , Michael Warner , Joseph Fjelstad
IPC分类号： H01L23/31 , H01L23/49 , H01L25/065 , H01L23/48 , H01R12/00
CPC分类号： H01L25/0657 , H01L23/3114 , H01L23/3128 , H01L24/10 , H01L24/13 , H01L24/48 , H01L24/50 , H01L24/73 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/13 , H01L2224/13099 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/50 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one atop the other with the first microelectronic element disposed between the second microelectronic element and the dielectric. The dielectric element has opposed first and second surfaces with conductive features exposed at the first surface and terminals exposed on the second surface. Preferably, the contact-bearing face of the first microelectronic element confronts the first surface of the dielectric with at least some of the conductive features being movable with respect to the contacts or terminals. By providing such movable features, joining units have heights of about 300 microns or less may be joined to the terminals thereby reducing the overall height of the microelectronic assembly to 1.2 mm and less.
摘要翻译：堆叠的微电子组件包括介电元件和第一和第二微电子元件，第一和第二微电子元件彼此堆叠，第一微电子元件设置在第二微电子元件和电介质之间。电介质元件具有相对的第一表面和第二表面，其导电特征在第一表面暴露并且端子暴露在第二表面上。优选地，第一微电子元件的接触面面对电介质的第一表面，其中至少一些导电特征可相对于触点或端子移动。通过提供这种可移动特征，具有约300微米或更小的高度的接合单元可以连接到端子，从而将微电子组件的整体高度减小到1.2mm以下。

5. 发明申请

US20050189635A1 Packaged acoustic and electromagnetic transducer chips 审中-公开
标题翻译：封装的声学和电磁换能器芯片
公开(公告)号：US20050189635A1
公开(公告)日：2005-09-01
申请号：US11068831
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.
摘要翻译：本文公开了封装芯片的各种实施例及其制造方法。本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁的至少一个的换能器能量，并且所述芯片包括在前表面和后表面中的一个处暴露的多个接合焊盘。封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向芯片的内表面和背离芯片的外表面。金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。金属层还包括第一开口，用于使声能和电磁能中的至少一个沿至少一个方向传递到所述装置和所述装置。

6. 发明申请

US20050189622A1 Packaged acoustic and electromagnetic transducer chips 审中-公开
公开(公告)号：US20050189622A1
公开(公告)日：2005-09-01
申请号：US11068830
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

7. 发明申请

US20050280134A1 Multi-frequency noise suppression capacitor set 审中-公开
标题翻译：多频抑噪电容组
公开(公告)号：US20050280134A1
公开(公告)日：2005-12-22
申请号：US11154395
申请日：2005-06-16
申请人： David Gibson , Andy Stavros , Michael Warner
发明人： David Gibson , Andy Stavros , Michael Warner
IPC分类号： H01L23/02 , H01L23/50 , H01L23/64
CPC分类号： H01L23/66 , H01L23/50 , H01L23/642 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H01L2924/15331 , H01L2924/3011 , H01L2924/00
摘要： A decoupling device (10) includes a plurality of capacitors having different capacitances (14,16,18) physically mounted in a package (12, 212), and terminals including at least one first terminal (24, 224) and at least one second terminal (26, 226) adapted for mounting the package to a circuit panel. The plural capacitors are connected in parallel between the first and second terminals so as to form plural circuits with different self-resonant frequencies. The device can be mounted as a unit on a circuit board with the first terminals connected to a power conductor and the second terminals connected to a ground conductor, and provides low impedance shunting of noise over a wide frequency spectrum.
摘要翻译：解耦装置（10）包括具有物理地安装在封装（12,212）中的不同电容（14,16,18）的多个电容器，以及包括至少一个第一端子（24,224）和至少一个第二端子端子（26,226），适于将封装安装到电路板。多个电容器并联连接在第一和第二端子之间，以形成具有不同自谐振频率的多个电路。该装置可以作为单元安装在电路板上，其中第一端子连接到电源导体，并且第二端子连接到接地导体，并且在宽频谱上提供低阻抗的噪声分流。

8. 发明授权

US6081035A Microelectronic bond ribbon design 失效
标题翻译：微电子键带设计
公开(公告)号：US6081035A
公开(公告)日：2000-06-27
申请号：US736415
申请日：1996-10-24
申请人： Michael Warner , Thomas H. Distefano , David Gibson
发明人： Michael Warner , Thomas H. Distefano , David Gibson
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/49541 , H01L23/49558 , H01L23/49572 , H01L23/49586 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/12042 , H01L2924/14
摘要： An improved bond ribbon design, said bond ribbon having a dual taper that functions to localize the bending along a predetermined distribution of the bond ribbon during the bonding of the bond ribbon to an associated contact of a semiconductor chip. Use of the dual-tapered bond ribbons during bonding provides a bonded bond ribbon having a form that is substantially s-shaped. The radii of curvature making out the curves of the s-shaped configuration can be predetermined and controlled by the length and taper of the individual tapered section. The improved bond ribbon further comprises an anchor pad, said anchor pad characterized by a large surface area that decreases the likelihood of delamination of it from a supporting dielectric structure. A multiplicity of these improved bond ribbons can be fabricated in an external connection component so as to facilitate the alignment and bonding process of multiple bond ribbons to corresponding contacts of the semiconductor chip and can be designed, configured or placed such that the corner contact of the semiconductor chip are accessible for bonding. With respect to the problems associated with accessing the corner contacts of a semiconductor chip when using the connection component, three approaches are offered as solutions.
摘要翻译：改进的粘结带设计，所述粘结带具有双锥度，其功能是在粘结带与半导体芯片的相关联的接合处期间沿着粘合带的预定分布定位弯曲。在接合期间使用双锥形粘结带提供具有基本上S形的形式的粘结粘结带。形成s形构造曲线的曲率半径可以由单个锥形部分的长度和锥度来预定和控制。改进的粘结带还包括锚垫，所述锚垫的特征在于大的表面积减小了其从支撑介质结构分层的可能性。可以在外部连接部件中制造多个这些改进的接合带，以便于将多个接合带对准和接合处理到半导体芯片的对应接点，并且可以被设计，配置或放置，使得半导体芯片可用于接合。关于在使用连接部件时访问半导体芯片的角接触相关的问题，提供三种方案作为解决方案。

9. 发明申请

US20090319292A1 Method and System to Manage Caregiver Costs in a Health Care Facility 审中-公开
标题翻译：管理保健设施护理人员成本的方法和系统
公开(公告)号：US20090319292A1
公开(公告)日：2009-12-24
申请号：US12143294
申请日：2008-06-20
申请人： Michael Warner , Kraig McKinley
发明人： Michael Warner , Kraig McKinley
IPC分类号： G06Q50/00 , G06Q10/00
CPC分类号： G06F19/328 , G06Q50/22
摘要： A method to manage caregiver costs in a health care facility may include allowing selection of a patient or group of patients for analyzing care costs and allowing selection of a set of parameters related to services provided to the patient or group of patients by the health care facility. The method may also include collecting patient data associated with the selected patient or group of patients based on the set of parameters. The method may additionally include determining at least one of patient acuity, location within the health care facility and caregiver attributes for the selected patient or group of patients based on the patient data and determining care costs based on at least one of the patient acuity, location, and caregiver attributes for the patient or group of patients. The method may further include presenting a care costs report to a user to manage costs within the health care facility.
摘要翻译：在保健设施中管理护理者成本的方法可以包括允许选择患者或患者组以分析护理成本并且允许选择与医疗保健设施提供给患者或患者组的服务有关的一组参数。该方法还可以包括基于该组参数收集与所选择的患者或患者组相关联的患者数据。该方法可以另外包括基于患者数据确定患者敏锐度，医疗保健设施内的位置和所选择的患者或患者组的护理者属性中的至少一个，并且基于患者的敏锐度，位置，以及患者或患者组的护理者属性。该方法还可以包括向用户呈现护理成本报告以管理医疗保健设施内的成本。

10. 发明申请

US20080122047A1 Collective and synergistic MRAM shields 有权
标题翻译：集体和协同的MRAM盾牌
公开(公告)号：US20080122047A1
公开(公告)日：2008-05-29
申请号：US11973869
申请日：2007-10-10
申请人： Kenneth Allen Honer , Guilian Gao , William Walter Carlson , Michael Warner
发明人： Kenneth Allen Honer , Guilian Gao , William Walter Carlson , Michael Warner
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L24/48 , H01L25/105 , H01L27/222 , H01L2224/16 , H01L2224/48091 , H01L2224/4824 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/15331 , H01L2924/3025 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Various structures chip packages are disclosed including a magnetoresistive random access memory (“MRAM”) device and a magnetic shield structure. The magnetic shield structure may be made from material having either ferromagnetic or diamagnetic material and may be shaped and incorporated into the chip package to divert stray magnetic fields away from the MRAM device.
摘要翻译：公开了包括磁阻随机存取存储器（“MRAM”）器件和磁屏蔽结构的各种结构芯片封装。磁屏蔽结构可以由具有铁磁性或反磁性材料的材料制成，并且可以被成形并结合到芯片封装中以将杂散磁场转移离开MRAM器件。

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