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1. 发明授权

US07149095B2 Stacked microelectronic assemblies 有权
标题翻译：堆叠的微电子组件
公开(公告)号：US07149095B2
公开(公告)日：2006-12-12
申请号：US10281550
申请日：2002-10-28
申请人： Michael Warner , Philip Damberg , John B. Riley , David Gibson , Young-Gon Kim , Belgacem Haba , Vernon Solberg
发明人： Michael Warner , Philip Damberg , John B. Riley , David Gibson , Young-Gon Kim , Belgacem Haba , Vernon Solberg
IPC分类号： H05K1/11
CPC分类号： H05K1/189 , H01L23/5387 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/3011 , H01L2224/05599
摘要： A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the at least one attachment site and electrically connected to at least some of the first and second contacts. The substrate is folded so that the first contacts are accessible at a bottom of a subassembly and the second contacts are accessible at a top of a subassembly. The plurality of subassemblies are stacked one on top of another in a generally vertical configuration. The substrate of at least one of the subassemblies has a plurality of attachment sites and a plurality of microelectronic elements assembled to the attachment sites. The substrate is folded so that at least some of the plurality of microelectronic elements are disposed alongside one another.
摘要翻译：堆叠的微电子组件包括多个微电子子组件。每个子组件包括具有至少一个位置，多个第一触点和多个第二触点的基板。每个子组件还具有组装到至少一个附接位置并电连接到第一和第二触点中的至少一些的至少一个微电子元件。折叠基板使得第一触头在子组件的底部可接近，并且第二触头可在子组件的顶部接近。多个子组件以大致垂直的配置堆叠在另一个之上。至少一个子组件的衬底具有多个附接位置和组装到附接位置的多个微电子元件。折叠基板使得多个微电子元件中的至少一些彼此并排设置。

2. 发明申请

US20070166876A1 Components, methods and assemblies for multi-chip packages 审中-公开
标题翻译：用于多芯片封装的组件，方法和组件
公开(公告)号：US20070166876A1
公开(公告)日：2007-07-19
申请号：US11324453
申请日：2006-01-03
申请人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
发明人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
IPC分类号： H01L21/00
CPC分类号： H05K1/141 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/3511 , H05K3/3436 , H05K2201/10719 , H05K2203/1572 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647
摘要： An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
摘要翻译：具有独立测试和修复功能的超薄系统级封装（SIP）包括：插入器，其布置在其顶表面和底表面上，多个封装的半导体芯片通过焊料凸块安装，根据Land Grid Array （LGA）格式，并且其中在SIP上不使用底部填充物。

3. 发明授权

US07061122B2 Components, methods and assemblies for multi-chip packages 有权
标题翻译：用于多芯片封装的组件，方法和组件
公开(公告)号：US07061122B2
公开(公告)日：2006-06-13
申请号：US10683097
申请日：2003-10-10
申请人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
发明人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
IPC分类号： H01L29/40
CPC分类号： H05K1/141 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/3511 , H05K3/3436 , H05K2201/10719 , H05K2203/1572 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647
摘要： An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
摘要翻译：具有独立测试和修复功能的超薄系统级封装（SIP）包括：插入器，其布置在其顶表面和底表面上，多个封装的半导体芯片通过焊料凸块安装，根据Land Grid Array （LGA）格式，并且其中在SIP上不使用底部填充物。

4. 发明申请

US20060286717A1 Stacked microelectronic assemblies having basal compliant layers 审中-公开
标题翻译：堆叠的微电子组件具有基底柔性层
公开(公告)号：US20060286717A1
公开(公告)日：2006-12-21
申请号：US11123989
申请日：2005-05-06
申请人： Vernon Solberg , Pieter Bellaar , Young-Gon Kim , Belgacem Haba
发明人： Vernon Solberg , Pieter Bellaar , Young-Gon Kim , Belgacem Haba
IPC分类号： H01L21/00
CPC分类号： H01L25/0657 , H01L23/5387 , H01L25/105 , H01L2224/16225 , H01L2225/06513 , H01L2225/107
摘要： A method of making a stacked microelectronic assembly includes providing a flexible substrate having first and second ends, the flexible substrate having a plurality of attachment sites located between the first and second ends thereof including a first one of the attachment sites located adjacent the first end of the flexible substrate, the flexible substrate including conductive terminals accessible at a surface of the flexible substrate and wiring connected to the terminals, providing a compliant layer over the first attachment site, assembling a plurality of microelectronic elements over the attachment sites, wherein a first one of the microelectronic elements engages the compliant layer and is movable relative to the flexible substrate, electrically interconnecting the microelectronic elements and the wiring, folding the flexible substrate and stacking at least some of the microelectronic elements in generally vertical alignment with one another so that the first one of the microelectronic elements engaging the compliant layer is disposed at a bottom of the stacked assembly, and maintaining the stacked microelectronic elements in the substantially vertical alignment, wherein the conductive terminals are exposed at the bottom end of the stacked assembly.
摘要翻译：制造堆叠的微电子组件的方法包括提供具有第一和第二端的柔性衬底，所述柔性衬底具有位于其第一和第二端之间的多个附接位置，所述附接位置包括邻近第一端和第二端的第一附接位置柔性基板，柔性基板包括在柔性基板的表面可接触的导电端子和连接到端子的布线，在第一附接位置上提供柔性层，在附接位置上组装多个微电子元件，其中第一个的微电子元件接合顺应层并且可相对于柔性基板移动，将微电子元件和布线电互连，折叠柔性基板并将至少一些微电子元件堆叠成彼此大致垂直对准，使得第一其中一个microe 接合柔性层的电极元件设置在堆叠组件的底部，并且将堆叠的微电子元件保持在基本上垂直的对准中，其中导电端子在堆叠组件的底端处露出。

5. 发明授权

US07935569B2 Components, methods and assemblies for stacked packages 有权
标题翻译：堆叠包的组件，方法和装配
公开(公告)号：US07935569B2
公开(公告)日：2011-05-03
申请号：US11975996
申请日：2007-10-23
申请人： Kyong-Mo Bang , David Gibson , Young-Gon Kim , John B. Riley, III
发明人： Kyong-Mo Bang , David Gibson , Young-Gon Kim , John B. Riley, III
IPC分类号： H01L21/00
CPC分类号： H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/50 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/85399 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H05K1/141 , H05K3/3436 , H05K2201/10674 , H05K2201/10734 , H05K2203/1572 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.
摘要翻译：包括底部单元半导体芯片的底部单元安装到电路板，并且诸如封装半导体芯片的一个或多个顶部元件安装到底部单元。可以使用与将组件安装到电路板上通常使用的相同的技术来执行两种安装操作。通常的封装芯片可以用作顶部元件，从而降低组装成本，并允许通过选择封装的芯片来定制组件。该组件实现了与使用预组装的堆叠芯片单元获得的效果相似的优点，但是不包含包装在封装芯片中的裸芯片的特殊处理费用。

6. 发明授权

US07294928B2 Components, methods and assemblies for stacked packages 有权
标题翻译：堆叠包的组件，方法和装配
公开(公告)号：US07294928B2
公开(公告)日：2007-11-13
申请号：US10656534
申请日：2003-09-05
申请人： Kyong-Mo Bang , David Gibson , Young-Gon Kim , John B. Riley
发明人： Kyong-Mo Bang , David Gibson , Young-Gon Kim , John B. Riley
IPC分类号： H01L23/48 , H01L23/52 , H01L23/538 , H01L23/498 , H05K1/14
CPC分类号： H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/50 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/85399 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H05K1/141 , H05K3/3436 , H05K2201/10674 , H05K2201/10734 , H05K2203/1572 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.
摘要翻译：包括底部单元半导体芯片的底部单元安装到电路板，并且诸如封装半导体芯片的一个或多个顶部元件安装到底部单元。可以使用与将组件安装到电路板上通常使用的相同的技术来执行两种安装操作。通常的封装芯片可以用作顶部元件，从而降低组装成本，并允许通过选择封装的芯片来定制组件。该组件实现了与使用预组装的堆叠芯片单元获得的效果相似的优点，但是不包含包装在封装芯片中的裸芯片的特殊处理费用。

7. 发明申请

US20050116326A1 Formation of circuitry with modification of feature height 有权
标题翻译：形成具有特征高度修改的电路
公开(公告)号：US20050116326A1
公开(公告)日：2005-06-02
申请号：US10959465
申请日：2004-10-06
申请人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David Tuckerman
发明人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David Tuckerman
IPC分类号： H01L23/13 , H01L23/498 , H01L21/44 , H01L23/02 , H01L29/40
CPC分类号： H01L24/48 , H01L23/13 , H01L23/49811 , H01L24/45 , H01L24/49 , H01L2224/0233 , H01L2224/02377 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49208 , H01L2924/00014 , H01L2924/00
摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
摘要翻译：用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其他方式减小至少一些柱的高度从电介质元件突出的柱。

8. 发明授权

US07816251B2 Formation of circuitry with modification of feature height 有权
标题翻译：形成具有特征高度修改的电路
公开(公告)号：US07816251B2
公开(公告)日：2010-10-19
申请号：US12291853
申请日：2008-11-14
申请人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
发明人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
IPC分类号： H01L21/44
CPC分类号： H01L24/48 , H01L23/13 , H01L23/49811 , H01L24/45 , H01L24/49 , H01L2224/0233 , H01L2224/02377 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49208 , H01L2924/00014 , H01L2924/00
摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
摘要翻译：用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其它方式减小至少一些柱的高度从电介质元件伸出的柱。

9. 发明申请

US20090071000A1 Formation of circuitry with modification of feature height 有权
标题翻译：形成具有特征高度修改的电路
公开(公告)号：US20090071000A1
公开(公告)日：2009-03-19
申请号：US12291853
申请日：2008-11-14
申请人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
发明人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
IPC分类号： H01R43/20
CPC分类号： H01L24/48 , H01L23/13 , H01L23/49811 , H01L24/45 , H01L24/49 , H01L2224/0233 , H01L2224/02377 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49208 , H01L2924/00014 , H01L2924/00
摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
摘要翻译：用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其他方式减小至少一些柱的高度从电介质元件突出的柱。

10. 发明授权

US07462936B2 Formation of circuitry with modification of feature height 有权
标题翻译：形成具有特征高度修改的电路
公开(公告)号：US07462936B2
公开(公告)日：2008-12-09
申请号：US10959465
申请日：2004-10-06
申请人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
发明人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L23/13 , H01L23/49811 , H01L24/45 , H01L24/49 , H01L2224/0233 , H01L2224/02377 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49208 , H01L2924/00014 , H01L2924/00
摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
摘要翻译：用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其它方式减小至少一些柱的高度从电介质元件伸出的柱。

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