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1. 发明授权

US08545599B2 Electrohydrodynamic device components employing solid solutions 失效
标题翻译：使用固溶体的电动液压装置部件
公开(公告)号：US08545599B2
公开(公告)日：2013-10-01
申请号：US12914786
申请日：2010-10-28
申请人： Giles Humpston
发明人： Giles Humpston
IPC分类号： B03C3/40
CPC分类号： G03G21/206 , B03C3/06 , B03C3/60 , B03C2201/14 , C23C10/28 , C23C14/16 , C23C14/5806 , C25D7/00
摘要： A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.
摘要翻译：热管理装置包括电动液体加速器，其中发射电极和另一电极通电以激励流体流动。电极之一包括由具有第一性能特性的溶剂金属和具有第二性能特性的溶质材料形成的固溶体。第一和第二性能特征在电极中基本独立地表现，因为溶剂金属和溶质材料在固溶体中保持基本上纯的。制造EHD产品的方法包括向电极提供这样的固溶体，并且相对于另一电极定位电极以在通电时激励流体流动。

2. 发明申请

US20110006432A1 RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS 有权
标题翻译：采用后置垫片延伸的重新构造的堆叠包装
公开(公告)号：US20110006432A1
公开(公告)日：2011-01-13
申请号：US12670952
申请日：2008-07-25
申请人： Belgacem Haba , Giles Humpston , David Ovrutsky , Laura Mirkarimi
发明人： Belgacem Haba , Giles Humpston , David Ovrutsky , Laura Mirkarimi
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L21/50 , H01L24/24 , H01L24/96 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/04105 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/00
摘要： A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.
摘要翻译：提供堆叠的微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），在前表面暴露的触点（22），后表面（118）和边缘（18 ，20）在前表面和后表面之间延伸。与触点连接的轨迹（24）可以沿着前表面朝着微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。导体可以与单元触点（76）导电连接，使得单元触点覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。

3. 发明授权

US07858445B2 Wire bonded wafer level cavity package 有权
标题翻译：接线晶圆级腔体封装
公开(公告)号：US07858445B2
公开(公告)日：2010-12-28
申请号：US12283710
申请日：2008-09-15
申请人： Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
发明人： Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
IPC分类号： H01L21/50
CPC分类号： B81B7/0006 , B81C1/00269 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.
摘要翻译：微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。该装置还包括盖在前表面上的盖。盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

4. 发明授权

US07793414B2 Methods for forming connection structures for microelectronic devices 有权
标题翻译：用于形成微电子器件的连接结构的方法
公开(公告)号：US07793414B2
公开(公告)日：2010-09-14
申请号：US11642570
申请日：2006-12-20
申请人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
发明人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
IPC分类号： H01R9/00 , H01R12/04
CPC分类号： H01L23/49838 , H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/041 , H05K3/06 , H05K3/202 , H05K3/4038 , H05K2201/09609 , H05K2201/097 , H05K2201/09827 , H05K2201/09881 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
摘要翻译：提供了用于微电子器件的连接结构和用于形成结构的方法。包括具有相对表面的基板和延伸穿过该表面的多个孔。还包括多个导电柱。每个柱从基部延伸到位于基板的相应孔内的尖端。可以提供另外的基底，使得每个柱的基部位于其表面上。可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。可选地，介电材料可以放置在基板和柱之间。

5. 发明授权

US07569424B2 Method of forming a wall structure in a microelectronic assembly 有权
标题翻译：在微电子组件中形成壁结构的方法
公开(公告)号：US07569424B2
公开(公告)日：2009-08-04
申请号：US11600289
申请日：2006-11-15
申请人： Michael J. Nystrom , Christopher Paul Wade , Giles Humpston
发明人： Michael J. Nystrom , Christopher Paul Wade , Giles Humpston
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L27/14618 , B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly, positioning a molding surface in contact with the deposited flowable material and controlling a distance between the upper surface of the first element and the molding surface with one or more objects positioned between the upper surface and the molding surface.
摘要翻译：在微电子组件中形成壁结构的方法包括在微电子组件中的第一元件的上表面上选择性地沉积可流动材料，将模制表面定位成与沉积的可流动材料接触并且控制上表面之间的距离第一元件和模制表面，其中一个或多个物体位于上表面和模制表面之间。

6. 发明授权

US07443597B2 Liquid lens with piezoelectric voltage converter 有权
标题翻译：液晶透镜带压电变压器
公开(公告)号：US07443597B2
公开(公告)日：2008-10-28
申请号：US11318821
申请日：2005-12-27
申请人： Giles Humpston
发明人： Giles Humpston
IPC分类号： G02B1/06
CPC分类号： G02B3/14 , G02B26/005 , H04N5/2254 , H04N5/2257
摘要： An electronic camera module includes a lens or refractive element formed by a pair of immiscible liquids and having optical properties which can be varied by applying a voltage so as to deform the meniscus. One of the two liquids extends from the meniscus all the way to the front surface of the sensor, so that light passing through the meniscus does not encounter further changes in refractive index enroute to the sensor.
摘要翻译：电子照相机模块包括由一对不混溶液体形成的具有光学特性的透镜或折射元件，该特性可以通过施加电压以使弯液面变形来改变。两个液体中的一个液体从弯液面一直延伸到传感器的前表面，使得穿过弯月面的光不会遇到传感器的折射率的进一步变化。

7. 发明申请

US20080191300A1 Pin referenced image sensor to reduce tilt in a camera module 有权
标题翻译：引脚参考图像传感器，以减少相机模块中的倾斜
公开(公告)号：US20080191300A1
公开(公告)日：2008-08-14
申请号：US12004149
申请日：2007-12-20
申请人： Michael J. Nystrom , David B. Tuckerman , Belgacem Haba , Giles Humpston , Jesse Burl Thompson
发明人： Michael J. Nystrom , David B. Tuckerman , Belgacem Haba , Giles Humpston , Jesse Burl Thompson
IPC分类号： H01L27/146
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14683 , H01L31/0203 , H01L31/0232 , H01L2224/48091 , H01L2224/73265 , H04N5/2253 , H04N5/2257 , H01L2924/00014
摘要： The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit includes a semiconductor chip having a front surface including an imaging area facing in a forward direction in alignment with the transparent region and an imaging circuit adapted to generate signals representative of an optical image impinging on the imaging area. The module further includes posts protruding from the bottom side of the circuit panel, wherein at least some of the posts being engagement posts having bottom surfaces, and at least some of the bottom surfaces abutting an engagement surface of the sensor unit.
摘要翻译：本发明涉及摄像机模块。相机模块包括具有顶侧，底侧和透明区域的电路板，电路板具有导体。该模块还包括设置在电路板的底侧上的传感器单元，并且传感器单元包括半导体芯片，该半导体芯片具有前表面，该前表面包括与透明区域对准的向前方向的成像区域和适于产生表示入射到成像区域上的光学图像的信号。模块还包括从电路板的底侧突出的柱，其中至少一些柱是具有底表面的接合柱，并且至少一些底表面邻接传感器单元的接合表面。

8. 发明申请

US20070145536A1 Compliant terminal mountings with vented spaces and methods 有权
标题翻译：具有通风空间和方法的符合标准的端子座
公开(公告)号：US20070145536A1
公开(公告)日：2007-06-28
申请号：US11318815
申请日：2005-12-27
申请人： Michael Nystrom , Belgacem Haba , Giles Humpston
发明人： Michael Nystrom , Belgacem Haba , Giles Humpston
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/3114 , H01L23/525 , H01L24/10 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.
摘要翻译：在半导体晶片上提供柔性结构。顺应结构包括腔。顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。处理后，通风口打开，将空腔连接到组件的外部。通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。

9. 发明申请

US20060220234A1 Wire bonded wafer level cavity package 有权
公开(公告)号：US20060220234A1
公开(公告)日：2006-10-05
申请号：US11322617
申请日：2005-12-30
申请人： Kenneth Honer , Giles Humpston , David Tuckerman , Michael Nystrom
发明人： Kenneth Honer , Giles Humpston , David Tuckerman , Michael Nystrom
IPC分类号： H01L23/34
CPC分类号： B81B7/0006 , B81C1/00269 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

10. 发明申请

US20060138626A1 Microelectronic packages using a ceramic substrate having a window and a conductive surface region 审中-公开
标题翻译：使用具有窗口和导电表面区域的陶瓷基板的微电子封装
公开(公告)号：US20060138626A1
公开(公告)日：2006-06-29
申请号：US11025432
申请日：2004-12-29
申请人： Victor Liew , Giles Humpston
发明人： Victor Liew , Giles Humpston
IPC分类号： H01L23/06
CPC分类号： H01L23/49822 , H01L23/13 , H01L23/49816 , H01L23/5389 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/14 , H01L2924/15311 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.
摘要翻译：微电子封装包括微电子器件，单一陶瓷衬底和多个端子。微电子器件在其上具有前表面和多个电触点。衬底具有第一和第二相对表面。窗口从第一表面上的第一开口沿侧壁延伸到第二表面上的第二开口。可以在侧壁和/或第二基板表面上设置导电区域。衬底位于器件和端子之间，使得衬底的第一表面面向器件的前表面，并且第一开口与前器件表面上的至少一个触点对准。还提供了用于生产微电子封装和晶片级组件的方法。

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