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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件结构及其制造方法
    • US20110147733A1
    • 2011-06-23
    • US12776484
    • 2010-05-10
    • Yih-Chyun KAOChun-Nan LinLi-Kai ChenWen-Ching Tsai
    • Yih-Chyun KAOChun-Nan LinLi-Kai ChenWen-Ching Tsai
    • H01L29/786H01L29/12H01L21/34
    • H01L29/7869
    • A semiconductor device structure on a substrate and a manufacture method thereof is provided. The semiconductor device structure includes an oxide semiconductor transistor and a passivation layer containing free hydrogen. The semiconductor device structure is formed by following steps. A gate electrode is formed on the substrate. A gate dielectric layer covers the gate electrode. A source electrode is formed on the gate dielectric layer. A drain electrode is formed on the gate dielectric layer and separated from the source electrode and thereby forming a channel distance. An oxide semiconductor layer is formed on the gate dielectric layer, the source electrode and the drain electrode and between the source electrode and the drain electrode. The oxide semiconductor layer is further electrically connected with the source electrode and the drain electrode. A passivation layer covers the oxide semiconductor layer, the source electrode and the drain electrode. The passivation layer has a groove formed therein, and the groove surrounds the oxide semiconductor layer.
    • 提供了一种基板上的半导体器件结构及其制造方法。 半导体器件结构包括氧化物半导体晶体管和含有游离氢的钝化层。 半导体器件结构通过以下步骤形成。 在基板上形成栅电极。 栅介质层覆盖栅电极。 源极电极形成在栅极电介质层上。 在栅极电介质层上形成漏电极,与源电极分离,形成通道距离。 在栅极电介质层,源电极和漏电极以及源电极和漏电极之间形成氧化物半导体层。 氧化物半导体层进一步与源电极和漏电极电连接。 钝化层覆盖氧化物半导体层,源电极和漏电极。 钝化层在其中形成有凹槽,并且沟槽围绕氧化物半导体层。
    • 2. 发明授权
    • Semiconductor device structure and method for manufacturing the same
    • 半导体器件结构及其制造方法
    • US08395149B2
    • 2013-03-12
    • US12776484
    • 2010-05-10
    • Yih-Chyun KaoChun-Nan LinLi-Kai ChenWen-Ching Tsai
    • Yih-Chyun KaoChun-Nan LinLi-Kai ChenWen-Ching Tsai
    • H01L29/786H01L29/12
    • H01L29/7869
    • A semiconductor device structure on a substrate and a manufacture method thereof is provided. The semiconductor device structure includes an oxide semiconductor transistor and a passivation layer containing free hydrogen. The semiconductor device structure is formed by following steps. A gate electrode is formed on the substrate. A gate dielectric layer covers the gate electrode. A source electrode is formed on the gate dielectric layer. A drain electrode is formed on the gate dielectric layer and separated from the source electrode and thereby forming a channel distance. An oxide semiconductor layer is formed on the gate dielectric layer, the source electrode and the drain electrode and between the source electrode and the drain electrode. The oxide semiconductor layer is further electrically connected with the source electrode and the drain electrode. A passivation layer covers the oxide semiconductor layer, the source electrode and the drain electrode. The passivation layer has a groove formed therein, and the groove surrounds the oxide semiconductor layer.
    • 提供了一种基板上的半导体器件结构及其制造方法。 半导体器件结构包括氧化物半导体晶体管和含有游离氢的钝化层。 半导体器件结构通过以下步骤形成。 在基板上形成栅电极。 栅介质层覆盖栅电极。 源极电极形成在栅极电介质层上。 在栅极电介质层上形成漏电极,与源电极分离,形成通道距离。 在栅极电介质层,源电极和漏电极以及源电极和漏电极之间形成氧化物半导体层。 氧化物半导体层进一步与源电极和漏电极电连接。 钝化层覆盖氧化物半导体层,源电极和漏电极。 钝化层在其中形成有凹槽,并且沟槽围绕氧化物半导体层。
    • 5. 发明申请
    • Display Element and Method of Manufacturing the Same
    • 显示元件及其制造方法
    • US20100038645A1
    • 2010-02-18
    • US12582964
    • 2009-10-21
    • Po-Lin ChenWen-Ching TsaiChun-Nan LinKuo-Yuan Tu
    • Po-Lin ChenWen-Ching TsaiChun-Nan LinKuo-Yuan Tu
    • H01L33/00
    • H01L29/458H01L27/124H01L29/41733
    • A display element and a method of manufacturing the same are provided. The method comprises the following steps: forming a first patterned conducting layer with a gate on a substrate and a dielectric layer thereon; forming a patterned semiconductor layer on the dielectric layer, wherein the patterned semiconductor layer has a channel region, a source and a drain, and wherein the source and the drain lie on the opposite sides of the channel region; selectively depositing a barrier layer, which only wraps the patterned semiconductor layer; forming a second patterned conducting layer on the barrier layer and above the source and the drain. In the display element manufactured by the method, the barrier layer only wraps the patterned semiconductor layer.
    • 提供了一种显示元件及其制造方法。 该方法包括以下步骤:在衬底上形成具有栅极的第一图案化导电层和其上的电介质层; 在所述电介质层上形成图案化的半导体层,其中所述图案化半导体层具有沟道区,源极和漏极,并且其中所述源极和漏极位于所述沟道区的相对侧上; 选择性地沉积仅包裹图案化半导体层的阻挡层; 在阻挡层上和源极和漏极之上形成第二图案化导电层。 在通过该方法制造的显示元件中,阻挡层仅包裹图案化的半导体层。
    • 7. 发明授权
    • Display panel structure and manufacture method thereof
    • 显示面板结构及其制造方法
    • US08062917B2
    • 2011-11-22
    • US12855837
    • 2010-08-13
    • Chun-Nan LinKuo-Yuan TuShu-Feng WuWen-Ching Tsai
    • Chun-Nan LinKuo-Yuan TuShu-Feng WuWen-Ching Tsai
    • H01L21/00
    • H01L29/4908H01L29/458H01L29/66757H01L29/66765
    • A display panel structure having a circuit element disposed thereon and method of manufacture are provided. The display panel includes a substrate and the circuit element disposed on the substrate. The circuit element has a first interface layer and a first conductive layer. Both the first interface layer and the first conductive layer have cooper materials. The material which makes the first interface layer includes a reactant or a compound of the material which makes the first conductive layer. The method for manufacturing includes the following steps: forming a first interface layer on the substrate; forming a first conductive layer on the first interface layer; and etching the first conductive and interface layers to form a pattern. The existence of the first interface reduces the penetration of the first conductive layer on the substrate and improves the adhesive force between the first conductive layer and the substrate.
    • 提供一种其上设置有电路元件的显示面板结构及其制造方法。 显示面板包括基板和设置在基板上的电路元件。 电路元件具有第一界面层和第一导电层。 第一界面层和第一导电层都具有铜材料。 制造第一界面层的材料包括制成第一导电层的反应物或材料的化合物。 制造方法包括以下步骤:在基板上形成第一界面层; 在所述第一界面层上形成第一导电层; 并蚀刻第一导电层和界面层以形成图案。 第一界面的存在减少了第一导电层在衬底上的穿透,并改善了第一导电层和衬底之间的粘合力。
    • 8. 发明授权
    • Display element and method of manufacturing the same
    • 显示元件及其制造方法
    • US07625788B2
    • 2009-12-01
    • US12115855
    • 2008-05-06
    • Po-Lin ChenWen-Ching TsaiChun-Nan LinKuo-Yuan Tu
    • Po-Lin ChenWen-Ching TsaiChun-Nan LinKuo-Yuan Tu
    • H01L21/00H01L21/44
    • H01L29/458H01L27/124H01L29/41733
    • A display element and a method of manufacturing the same are provided. The method comprises the following steps: forming a first patterned conducting layer with a gate on a substrate and a dielectric layer thereon; forming a patterned semiconductor layer on the dielectric layer, wherein the patterned semiconductor layer has a channel region, a source and a drain, and wherein the source and the drain lie on the opposite sides of the channel region; selectively depositing a barrier layer, which only wraps the patterned semiconductor layer; forming a second patterned conducting layer on the barrier layer and above the source and the drain. In the display element manufactured by the method, the barrier layer only wraps the patterned semiconductor layer.
    • 提供了一种显示元件及其制造方法。 该方法包括以下步骤:在衬底上形成具有栅极的第一图案化导电层和其上的电介质层; 在所述电介质层上形成图案化的半导体层,其中所述图案化半导体层具有沟道区,源极和漏极,并且其中所述源极和漏极位于所述沟道区的相对侧上; 选择性地沉积仅包裹图案化半导体层的阻挡层; 在阻挡层上和源极和漏极之上形成第二图案化导电层。 在通过该方法制造的显示元件中,阻挡层仅包裹图案化的半导体层。
    • 10. 发明申请
    • PIXEL STRUCTURE, DISPLAY PANEL, ELETRO-OPTICAL APPARATUS, AND METHOD THEREROF
    • 像素结构,显示面板,ELETRO-OPTICAL设备及其方法
    • US20090153056A1
    • 2009-06-18
    • US12060873
    • 2008-04-02
    • Po-Lin ChenChun-Nan LinShu-Feng WuWen-Ching Tsai
    • Po-Lin ChenChun-Nan LinShu-Feng WuWen-Ching Tsai
    • H01J7/44H01L21/04H01J9/00
    • H01L29/458H01L27/124H01L27/1255
    • A pixel structure disposed on a substrate including a thin film transistor (TFT), a bottom capacitor electrode, a dielectric layer, an upper capacitor electrode, a passivation layer, and a pixel electrode is provided. The TFT having a source/drain and the bottom capacitor electrode are disposed on the substrate. The dielectric layer is disposed on the bottom capacitor electrode. The upper capacitor electrode has a semiconductor layer, a barrier layer, and a metal layer. The semiconductor layer is disposed on the dielectric layer above the bottom capacitor electrode. The barrier layer is disposed on the semiconductor layer. The metal layer whose material includes copper, a copper alloy, or a combination thereof is disposed on the barrier layer. The passivation layer covers the TFT and the upper capacitor electrode and has a first opening exposing the source/drain. The pixel electrode is electrically connected to the TFT through the first opening.
    • 提供了一种设置在包括薄膜晶体管(TFT),底部电容器电极,电介质层,上部电容器电极,钝化层和像素电极的基板上的像素结构。 具有源极/漏极和底部电容器电极的TFT设置在衬底上。 电介质层设置在底部电容器电极上。 上部电容器电极具有半导体层,阻挡层和金属层。 半导体层设置在底部电容器电极上方的电介质层上。 阻挡层设置在半导体层上。 其材料包括铜,铜合金或其组合的金属层设置在阻挡层上。 钝化层覆盖TFT和上电容器电极,并且具有暴露源极/漏极的第一开口。 像素电极通过第一开口与TFT电连接。