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1. 发明授权

US07724007B2 Probe apparatus and probing method 有权
标题翻译：探头装置和探测方法
公开(公告)号：US07724007B2
公开(公告)日：2010-05-25
申请号：US12237920
申请日：2008-09-25
申请人： Yasuhito Yamamoto , Kazuhiro Ozawa , Fumito Kagami
发明人： Yasuhito Yamamoto , Kazuhiro Ozawa , Fumito Kagami
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R31/2887
摘要： A probe apparatus includes an imaging unit imaging probes and a first and a second imaging unit imaging the wafer surface. The apparatus further includes a control unit obtaining positions of a mounting table at which focuses of the imaging unit and the first imaging unit are made to coincide with each other and then the focuses of the image unit and the second imaging unit are made to coincide with each other by moving the mounting table; obtaining positions of the mounting table at which the images of the wafer are sequentially taken by the first and the second imaging unit by moving the mounting table; obtaining a position of the mounting table at which the probes are imaged by the imaging unit, and calculating a position of the mounting table at which the wafer contacts with the probes based on the obtained positions of the mounting table.
摘要翻译：探针装置包括成像单元成像探针和成像晶片表面的第一和第二成像单元。该装置还包括控制单元，其获得安装台的位置，使成像单元和第一成像单元的焦点彼此重合，然后使图像单元和第二成像单元的焦点与彼此移动安装台; 通过移动安装台来获得安装台的位置，通过第一和第二成像单元依次取得晶片的图像; 基于所获得的安装台的位置，获得所述安装台的位置，所述安装台在所述位置处由所述成像单元成像，并且计算所述安装台的位置，所述安装台在所述安装台上与所述探针接触。

2. 发明授权

US07701236B2 Each inspection units of a probe apparatus is provided with an imaging unit to take an image of a wafer 失效
标题翻译：探针装置的每个检查单元设置有摄像单元以拍摄晶片的图像
公开(公告)号：US07701236B2
公开(公告)日：2010-04-20
申请号：US12120546
申请日：2008-05-14
申请人： Shuji Akiyama , Tadashi Obikane , Masaru Suzuki , Yasuhito Yamamoto , Kazuya Yano , Yuji Asakawa , Kazumi Yamagata , Shigeki Nakamura , Eiichi Matsuzawa , Kazuhiro Ozawa , Fumito Kagami , Shinji Kojima
发明人： Shuji Akiyama , Tadashi Obikane , Masaru Suzuki , Yasuhito Yamamoto , Kazuya Yano , Yuji Asakawa , Kazumi Yamagata , Shigeki Nakamura , Eiichi Matsuzawa , Kazuhiro Ozawa , Fumito Kagami , Shinji Kojima
IPC分类号： G01R1/073 , G01R31/28
CPC分类号： G01R31/2893
摘要： A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other and disposed in accordance with the arrangement of the loading ports. In this configuration, wafers are directly transferred between the carrier and a wafer chuck of the inspection unit by the wafer transfer mechanism. The wafer transfer mechanism has three arms for unloading two wafers from the carrier. The prove apparatus has a compact size and achieves a high throughput.
摘要翻译：证明装置包括：第一和第二装载端口，用于在其中安装两个彼此面对的载体;晶片传送机构，其具有在装载端口之间的旋转中心;以及第一和第二检查单元，彼此对称并且按照具有装载端口的布置。在这种结构中，通过晶片传送机构将晶片直接传送到检查单元的载体和晶片卡盘之间。晶片传送机构具有用于从载体卸载两个晶片的三个臂。证明设备具有紧凑的尺寸并且实现了高吞吐量。

3. 发明申请

US20090085594A1 PROBE APPARATUS AND PROBING METHOD 有权
标题翻译：探测器和探测方法
公开(公告)号：US20090085594A1
公开(公告)日：2009-04-02
申请号：US12237920
申请日：2008-09-25
申请人： Yasuhito Yamamoto , Kazuhiro Ozawa , Fumito Kagami
发明人： Yasuhito Yamamoto , Kazuhiro Ozawa , Fumito Kagami
IPC分类号： G01R31/26
CPC分类号： G01R31/2891 , G01R31/2887
摘要： A probe apparatus includes an imaging unit imaging probes and a first and a second imaging unit imaging the wafer surface. The apparatus further includes a control unit obtaining positions of a mounting table at which focuses of the imaging unit and the first imaging unit are made to coincide with each other and then the focuses of the image unit and the second imaging unit are made to coincide with each other by moving the mounting table; obtaining positions of the mounting table at which the images of the wafer are sequentially taken by the first and the second imaging unit by moving the mounting table; obtaining a position of the mounting table at which the probes are imaged by the imaging unit, and calculating a position of the mounting table at which the wafer contacts with the probes based on the obtained positions of the mounting table.
摘要翻译：探针装置包括成像单元成像探针和成像晶片表面的第一和第二成像单元。该装置还包括控制单元，其获得安装台的位置，使成像单元和第一成像单元的焦点彼此重合，然后使图像单元和第二成像单元的焦点与彼此移动安装台; 通过移动安装台来获得安装台的位置，通过第一和第二成像单元依次取得晶片的图像; 基于所获得的安装台的位置，获得所述安装台的位置，所述安装台在所述位置处由所述成像单元成像，并且计算所述安装台的位置，所述安装台在所述安装台上与所述探针接触。

4. 发明申请

US20080290886A1 PROBE APPARATUS 失效
标题翻译：探测器
公开(公告)号：US20080290886A1
公开(公告)日：2008-11-27
申请号：US12120546
申请日：2008-05-14
申请人： Shuji Akiyama , Tadashi Obikane , Masaru Suzuki , Yasuhito Yamamoto , Kazuya Yano , Yuji Asakawa , Kazumi Yamagata , Shigeki Nakamura , Eiichi Matsuzawa , Kazuhiro Ozawa , Fumito Kagami , Shinji Kojima
发明人： Shuji Akiyama , Tadashi Obikane , Masaru Suzuki , Yasuhito Yamamoto , Kazuya Yano , Yuji Asakawa , Kazumi Yamagata , Shigeki Nakamura , Eiichi Matsuzawa , Kazuhiro Ozawa , Fumito Kagami , Shinji Kojima
IPC分类号： G01R1/073
CPC分类号： G01R31/2893
摘要： A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other and disposed in accordance with the arrangement of the loading ports. In this configuration, wafers are directly transferred between the carrier and a wafer chuck of the inspection unit by the wafer transfer mechanism. The wafer transfer mechanism has three arms for unloading two wafers from the carrier. The prove apparatus has a compact size and achieves a high throughput.
摘要翻译：证明装置包括：第一和第二装载端口，用于在其中安装两个彼此面对的载体;晶片传送机构，其具有在装载端口之间的旋转中心;以及第一和第二检查单元，彼此对称并且按照具有装载端口的布置。在这种结构中，通过晶片传送机构将晶片直接传送到检查单元的载体和晶片卡盘之间。晶片传送机构具有用于从载体卸载两个晶片的三个臂。证明设备具有紧凑的尺寸并且实现了高吞吐量。

5. 发明授权

US08098412B2 Method for detecting the center of wafer and storage medium storing a program for executing the method 失效
标题翻译：用于检测晶片中心的方法和存储用于执行该方法的程序的存储介质
公开(公告)号：US08098412B2
公开(公告)日：2012-01-17
申请号：US11857790
申请日：2007-09-19
申请人： Fumito Kagami
发明人： Fumito Kagami
IPC分类号： G01B11/14
CPC分类号： H01L21/681
摘要： A method detects a center of a wafer having a notch when aligning the wafer mounted on a movable mounting table. The method includes capturing an image of the wafer by using an imaging unit, the image including the notch; extracting an edge line from the image of the wafer; detecting a shape of the notch from the edge line; and calculating the center of the wafer based on the shape of the notch.
摘要翻译：当对准安装在可移动安装台上的晶片时，方法检测具有凹口的晶片的中心。该方法包括使用成像单元捕获晶片的图像，该图像包括凹口; 从晶片的图像中提取边缘线; 从边缘线检测凹口的形状; 以及基于所述凹口的形状计算所述晶片的中心。

6. 发明授权

US07583099B2 Method for re-registering an object to be aligned by re-capturing images using previously registered conditions and storage medium storing a program for executing the method 有权
标题翻译：通过使用先前注册的条件重新捕获图像来重新注册要对齐的对象的方法以及存储用于执行该方法的程序的存储介质
公开(公告)号：US07583099B2
公开(公告)日：2009-09-01
申请号：US11857912
申请日：2007-09-19
申请人： Fumito Kagami
发明人： Fumito Kagami
IPC分类号： G01R31/00
CPC分类号： G01R31/2891 , G03F7/70633
摘要： A method for re-registering at least one set of image information of an object to be aligned to align the object by an imaging unit, the image information including photographing conditions and position data of the object which have been previously registered by capturing an image of the object with the imaging unit. The method includes automatically moving at least one of the object and the imaging unit based on the position data of the image information and re-capture the image of the object with the imaging unit by using the previously registered photographing conditions of the image information and re-registering the image information by using the re-captured image of the object.
摘要翻译：一种用于重新登记待对准的对象的至少一组图像信息以通过成像单元对准该对象的图像信息，所述图像信息包括通过拍摄图像的先前登记的对象的拍摄条件和位置数据对象与成像单元。该方法包括基于图像信息的位置数据自动移动对象和成像单元中的至少一个，并且通过使用先前登记的图像信息的拍摄条件并且使用成像单元重新捕获对象的图像，并且re - 通过使用对象的重新捕获的图像来注册图像信息。

7. 发明授权

US5264918A Method and device for detecting the center of a wafer 失效
标题翻译：用于检测晶片中心的方法和装置
公开(公告)号：US5264918A
公开(公告)日：1993-11-23
申请号：US850811
申请日：1992-03-13
申请人： Fumito Kagami
发明人： Fumito Kagami
IPC分类号： H01L21/66 , H01L21/00 , H01L21/68
CPC分类号： H01L21/67259 , H01L21/681
摘要： A wafer center detecting method comprises steps of giving turn to a wafer held by a holder, optically detecting two points at which the true rim line of the wafer crosses the fictitious rim line thereof obtained when the center of the wafer is in accord with the rotation center of the holder, and measuring an angle formed by these two intersecting points relative to a reference point, obtaining from the angle formed by the two intersecting points a direction in which the center of the wafer is shifted from the rotation center of the holder, obtaining a central angle formed by the two intersecting points relative to the rotation center of the holder, and obtaining, on the basis of the central angle and a previously-measured wafer radius, the extent to which the center of the wafer is shifted from the rotation center of the holder.
摘要翻译：晶片中心检测方法包括以下步骤：转动由保持器保持的晶片，光学地检测两个点，当晶片的中心与旋转的中心一致时，晶片的真实边缘线与虚构的边缘线交叉并且测量由这两个相交点相对于参考点形成的角度，从由两个相交点形成的角度获得晶片的中心从保持器的旋转中心偏移的方向，获得由相对于保持器的旋转中心的两个相交点形成的中心角度，并且基于中心角度和预先测量的晶片半径获得晶片的中心从支架的旋转中心。

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