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1. 发明授权

US06428719B1 Etching process to selectively remove copper plating seed layer 失效
标题翻译：蚀刻工艺选择性去除镀铜种子层
公开(公告)号：US06428719B1
公开(公告)日：2002-08-06
申请号：US09487454
申请日：2000-01-19
申请人： Xuehua Wu , Wensen Li , Si-Tuan Lam , Henry C. Chang , Kochan Ju , Jei-Wei Chang
发明人： Xuehua Wu , Wensen Li , Si-Tuan Lam , Henry C. Chang , Kochan Ju , Jei-Wei Chang
IPC分类号： C23F100
CPC分类号： F16B7/025 , C23F1/18 , G11B5/17 , G11B5/313 , G11B5/3163 , H05K1/056 , H05K3/067 , Y10T403/7069
摘要： Write head coils for magnetic disk systems are commonly formed through electroplating onto a seed layer in the presence of a photoresist mask. It is then necessary to remove the seed layer everywhere except under the coil itself. The present invention achieves this through etching in a solution of ammonium persulfate to which has been added the complexing agent 1,4,8,11 tetraazundecane. This suppresses the reduction of Cu++ to Cu, thereby increasing the dissolution rate of copper while decreasing that of nickel-iron. Two ways of implementing this are described—adding the complexing agent directly to the ammonium persulfate and introducing the 1,4,8,11 tetraazundecane through a dipping process that precedes conventional etching in the ammonium persulfate.
摘要翻译：用于磁盘系统的写头线圈通常在光致抗蚀剂掩模的存在下通过电镀到种子层上形成。因此，除了线圈本身以外，还需要除去种子层。本发明通过在已加入络合剂1,4,8,11四氮十烷的过硫酸铵溶液中进行蚀刻来实现。这抑制了Cu ++还原为Cu，从而提高了铜的溶解速度，同时降低了镍铁的溶解速度。描述了实现这一点的两种方法 - 将络合剂直接加入到过硫酸铵中，并通过在过硫酸铵中常规蚀刻之前的浸渍方法引入1,4,8,11四氮杂十一烷。

2. 发明授权

US06767477B2 Etching process to selectively remove copper plating seed layer 有权
标题翻译：蚀刻工艺选择性去除镀铜种子层
公开(公告)号：US06767477B2
公开(公告)日：2004-07-27
申请号：US10170106
申请日：2002-06-12
申请人： Xue Hua Wu , Wensen Li , Si-Tuan Lam , Henry C. Chang , Kochan Ju , Jei-Wei Chang
发明人： Xue Hua Wu , Wensen Li , Si-Tuan Lam , Henry C. Chang , Kochan Ju , Jei-Wei Chang
IPC分类号： C23F100
CPC分类号： F16B7/025 , C23F1/18 , G11B5/17 , G11B5/313 , G11B5/3163 , H05K1/056 , H05K3/067 , Y10T403/7069
摘要： Write head coils for magnetic disk systems are commonly formed through electroplating onto a seed layer in the presence of a photoresist mask. It is then necessary to remove the seed layer everywhere except under the coil itself. The present invention achieves this through etching in a solution of ammonium persulfate to which has been added the complexing agent 1,4,8,11 tetraazundecane. This suppresses the reduction of Cu++ to Cu, thereby increasing the dissolution rate of copper while decreasing that of nickel-iron. Two ways of implementing this are described—adding the complexing agent directly to the ammonium persulfate and introducing the 1,4,8,11 tetraazundecane through a dipping process that precedes conventional etching in the ammonium persulfate.
摘要翻译：用于磁盘系统的写头线圈通常在光刻胶掩模的存在下通过电镀到种子层上形成。因此，除了线圈本身以外，还需要除去种子层。本发明通过在已加入络合剂1,4,8,11四氮十烷的过硫酸铵溶液中进行蚀刻来实现。这抑制了Cu向Cu的还原，从而提高了铜的溶解速率，同时降低了镍铁的溶解速率。描述了实现这一点的两种方法 - 将络合剂直接加入到过硫酸铵中，并通过在过硫酸铵中常规蚀刻之前的浸渍方法引入1,4,8,11四氮杂十一烷。

3. 发明授权

US06291138B1 Masking frame plating method for forming masking frame plated layer 失效
标题翻译：用于形成掩蔽框架镀层的掩模框架电镀方法
公开(公告)号：US06291138B1
公开(公告)日：2001-09-18
申请号：US09360121
申请日：1999-07-23
申请人： Xuehua Wu , Yi-Chun Liu , Yining Hu , Jei-Wei Chang , Kochan Ju
发明人： Xuehua Wu , Yi-Chun Liu , Yining Hu , Jei-Wei Chang , Kochan Ju
IPC分类号： G03C500
CPC分类号： G11B5/3163 , G11B5/3116 , G11B5/3967 , Y10T29/49032
摘要： A method for forming a plated layer. There is first provided a substrate. There is then formed over the substrate a masking frame employed for masking frame plating a masking frame plated layer within the masking frame, where the masking frame is fabricated to provide an overhang of an upper portion of the masking frame spaced further from the substrate with respect to a lower portion of the masking frame spaced closer to the substrate. Finally, there is then plated the masking frame plated layer within the masking frame. The method is useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.
摘要翻译：一种形成镀层的方法。首先提供基板。然后在衬底上形成掩蔽框架，用于掩蔽在屏蔽框架内对屏蔽框架镀层进行屏蔽电镀，其中制造掩模框架以提供与衬底间隔开的掩蔽框架的上部的突出部分，到掩蔽框架的较靠近衬底间隔的部分。最后，然后将屏蔽框架镀层电镀在屏蔽框架内。该方法对于在磁换能器元件内形成具有增强的平面度尺寸控制的掩模框架电镀磁极尖端堆叠层是有用的。

4. 发明授权

US06387599B2 Corrosion inhibitor of NiCu for high performance writers 失效
标题翻译： NiCu防腐剂用于高性能作者
公开(公告)号：US06387599B2
公开(公告)日：2002-05-14
申请号：US09756013
申请日：2001-01-08
申请人： Xuehua Wu , Yi-Chun Liu , Jei-Wei Chang , Kochan Ju
发明人： Xuehua Wu , Yi-Chun Liu , Jei-Wei Chang , Kochan Ju
IPC分类号： G03F730
CPC分类号： G03F7/322 , C23F1/02 , G11B5/3163 , H05K3/064
摘要： The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
摘要翻译：通过保护所有暴露的铜轴承表面免受攻击，已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。描述实现这一点的两种方式。在第一种方法中，将苯并三唑（BTA）加入显影液中，然后以正常方式使用，显影时间不受该改性的影响。在第二种方法中，首先将待接收光致抗蚀剂的表面浸入BTA的溶液中，随后立即施加光致抗蚀剂，并且包括显影在内的处理正常进行。对于这两种方法，结果是在开发过程中消除了所有的铜腐蚀。

5. 发明授权

US06239948B1 Non-magnetic nickel containing conductor alloys for magnetic transducer element fabrication 失效
标题翻译：用于磁换能器元件制造的非磁性含镍导体合金
公开(公告)号：US06239948B1
公开(公告)日：2001-05-29
申请号：US09360120
申请日：1999-07-23
申请人： Xuehua Wu , Kochan Ju , Jei-Wei Chang
发明人： Xuehua Wu , Kochan Ju , Jei-Wei Chang
IPC分类号： G11B5235
CPC分类号： G11B5/235 , G11B5/3109 , G11B5/313 , G11B5/3903 , G11B5/3967
摘要： A non-magnetic conductor material, a magnetic transducer element having formed therein a non-magnetic conductor layer formed of the non-magnetic conductor material and a method for forming a magnetic transducer element having formed therein the non-magnetic conductor layer formed of the non-magnetic conductor material. The non-magnetic conductor material comprises an alloy comprising nickel and at least one non-magnetic conductor metal selected from the group consisting of copper at a weight percent of from about 45 to about 90, zinc at a weight percent of from about 20 to about 75, cadmium at a weight percent of from about 35 to about 85, platinum at a weight percent of from about 55 to about 90 and palladium at a weight percent of from about 75 to about 95. The non-magnetic conductor material contemplates the magnetic transducer element and the method for forming the magnetic transducer element. The non-magnetic conductor material has physical properties, chemical properties and electrochemical properties, but not magnetic properties, analogous to the physical properties, chemical properties and electrochemical properties exhibited by magnetic layers employed within magnetic transducer elements.
摘要翻译：一种非磁性导体材料，其中形成有由非磁性导体材料形成的非磁性导体层的磁性换能器元件以及形成其中形成有非磁性导体材料的非磁性导体层的磁性换能器元件的方法，磁导体材料。非磁性导体材料包括合金，其包含镍和至少一种选自重量百分比约为45至约90的铜的非磁性导体金属，重量百分比约为20至约20的锌 75，重量百分比为约35至约85的镉，以重量百分比为约55至约90的铂，以及重量百分比为约75至约95的钯。非磁性导体材料考虑了磁性换能器元件和形成磁换能器元件的方法。非磁性导体材料具有物理性质，化学性质和电化学性质，但不具有类似于在磁换能器元件内使用的磁性层所表现的物理性能，化学性质和电化学性能的磁性能。

6. 发明授权

US06218080B1 Plated flat metal gap for very narrow recording heads 失效
标题翻译：用于非常窄的记录头的镀金属间隙
公开(公告)号：US06218080B1
公开(公告)日：2001-04-17
申请号：US09519610
申请日：2000-03-06
申请人： Xuehua Wu , Kochan Ju , Jei-Wei Chang
发明人： Xuehua Wu , Kochan Ju , Jei-Wei Chang
IPC分类号： G11B523
CPC分类号： C25D1/10 , G11B5/232 , G11B5/3116 , G11B5/3163 , Y10T29/49032
摘要： It has been observed that plated structures grown inside molds for small objects, such as a gap structure in a magnetic read head, often have curved rather than planar surfaces. This problem has been overcome as follows. Prior to laying down photoresist for the mold, a layer of copper is deposited on the substrate on which the head structure is to be grown (normally the shared pole). After the photoresist is patterned to form the mold, all exposed copper is selectively removed from the substrate a key feature being that the copper is over-etched so that some undercutting of the photoresist occurs. Then, when the layers making up the gap structure are electrodeposited inside the mold they grow away from the substrate as planar surfaces.
摘要翻译：已经观察到，用于小物体的模具内生长的电镀结构，例如磁读头中的间隙结构，通常具有弯曲而不是平面。这个问题已被克服如下。在为模具铺设光致抗蚀剂之前，在要在其上生长头部结构的基底（通常是共享极）上沉积一层铜。在光致抗蚀剂被图案化以形成模具之后，从衬底中选择性地去除所有暴露的铜，其关键特征是铜被过度蚀刻，使得发生光刻胶的一些底切。然后，当构成间隙结构的层电沉积在模具内部时，它们作为平面表面从衬底生长。

7. 发明授权

US06395458B2 Corrosion inhibitor of NiCu for high performance writers 失效
标题翻译： NiCu防腐剂用于高性能作者
公开(公告)号：US06395458B2
公开(公告)日：2002-05-28
申请号：US09756015
申请日：2001-01-08
申请人： Xuehua Wu , Yi-Chun Liu , Jei-Wei Chang , Kochan Ju
发明人： Xuehua Wu , Yi-Chun Liu , Jei-Wei Chang , Kochan Ju
IPC分类号： G03F732
CPC分类号： G03F7/322 , C23F1/02 , G11B5/3163 , H05K3/064
摘要： The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
摘要翻译：通过保护所有暴露的铜轴承表面免受攻击，已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。描述实现这一点的两种方式。在第一种方法中，将苯并三唑（BTA）加入显影液中，然后以正常方式使用，显影时间不受该改性的影响。在第二种方法中，首先将待接收光致抗蚀剂的表面浸入BTA溶液中，随后立即施加光刻胶并进行处理，包括正常进行。对于这两种方法，结果是在开发过程中消除了所有的铜腐蚀。

8. 发明授权

US06207350B1 Corrosion inhibitor for NiCu for high performance writers 失效
标题翻译： NiCu用于高性能作者的防腐蚀剂
公开(公告)号：US06207350B1
公开(公告)日：2001-03-27
申请号：US09483931
申请日：2000-01-18
申请人： Xuehua Wu , Yi-Chun Liu , Jei-Wei Chang , Kochan Ju
发明人： Xuehua Wu , Yi-Chun Liu , Jei-Wei Chang , Kochan Ju
IPC分类号： G03F732
CPC分类号： G03F7/322 , C23F1/02 , G11B5/3163 , H05K3/064
摘要： The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
摘要翻译：通过保护所有暴露的铜轴承表面免受攻击，已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。描述实现这一点的两种方式。在第一种方法中，将苯并三唑（BTA）加入显影液中，然后以正常方式使用，显影时间不受该改性的影响。在第二种方法中，首先将待接收光致抗蚀剂的表面浸入BTA的溶液中，随后立即施加光致抗蚀剂，并且包括显影在内的处理正常进行。对于这两种方法，结果是在开发过程中消除了所有的铜腐蚀。

9. 发明申请

US20070041124A1 Narrow track CPP head with bias cancellation 有权
标题翻译：窄轨CPP头偏置消除
公开(公告)号：US20070041124A1
公开(公告)日：2007-02-22
申请号：US11588564
申请日：2006-10-27
申请人： Jei-Wei Chang , Koichi Terunuma , Youfeng Zheng , Kochan Ju
发明人： Jei-Wei Chang , Koichi Terunuma , Youfeng Zheng , Kochan Ju
IPC分类号： G11B5/09
CPC分类号： B82Y25/00 , B82Y10/00 , G11B5/3932 , G11B2005/3996 , Y10T29/49021 , Y10T29/49032 , Y10T29/49039 , Y10T29/49041 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： The problem of increased edge sensitivity associated with the reduction of the spacing between bias magnets in a CPP head has been solved by limiting the width of the bias cancellation layer and by adding an extra layer of insulation to ensure that current through the device flows only through its central area, thereby minimizing its edge reading sensitivity.
摘要翻译：通过限制偏置消除层的宽度并添加额外的绝缘层来解决与CPP头中的偏置磁体之间的间隔减小相关联的增加的边缘灵敏度的问题，以确保通过器件的电流仅流过其中心区域，从而最小化其边缘读取灵敏度。

10. 发明授权

US07118680B2 Self-alignment scheme for enhancement of CPP-GMR 失效
标题翻译：用于增强CPP-GMR的自对准方案
公开(公告)号：US07118680B2
公开(公告)日：2006-10-10
申请号：US10718372
申请日：2003-11-20
申请人： Jei-Wei Chang , Chao-Peng Chen , Min Li , Kochan Ju
发明人： Jei-Wei Chang , Chao-Peng Chen , Min Li , Kochan Ju
IPC分类号： G11B5/39
CPC分类号： G11B5/1278 , Y10T29/49052
摘要： A method for fabricating a current-perpendicular-to-plane (CPP) giant magnetoresistive (GMR) sensor of the synthetic spin valve type is provided, the method including an electron-beam lithographic process employing both primary and secondary electron absorption and first and second self-aligned lift-off processes for patterning the capped ferromagnetic free layer and the conducting, non-magnetic spacer layer. The sensor so fabricated has reduced resistance and increased sensitivity.
摘要翻译：提供了一种用于制造合成自旋阀类型的电流垂直平面（CPP）巨磁阻（GMR）传感器的方法，该方法包括采用初级和次级电子吸收的电子束光刻工艺，第一和第二用于对封装的铁磁自由层和导电的非磁性间隔层进行图案化的自对准剥离工艺。所制造的传感器具有降低的电阻和增加的灵敏度。

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