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    • 1. 发明授权
    • Corrosion inhibitor of NiCu for high performance writers
    • NiCu防腐剂用于高性能作者
    • US06387599B2
    • 2002-05-14
    • US09756013
    • 2001-01-08
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • G03F730
    • G03F7/322C23F1/02G11B5/3163H05K3/064
    • The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
    • 通过保护所有暴露的铜轴承表面免受攻击,已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中,将苯并三唑(BTA)加入显影液中,然后以正常方式使用,显影时间不受该改性的影响。 在第二种方法中,首先将待接收光致抗蚀剂的表面浸入BTA的溶液中,随后立即施加光致抗蚀剂,并且包括显影在内的处理正常进行。 对于这两种方法,结果是在开发过程中消除了所有的铜腐蚀。
    • 3. 发明授权
    • Corrosion inhibitor of NiCu for high performance writers
    • NiCu防腐剂用于高性能作者
    • US06395458B2
    • 2002-05-28
    • US09756015
    • 2001-01-08
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • G03F732
    • G03F7/322C23F1/02G11B5/3163H05K3/064
    • The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
    • 通过保护所有暴露的铜轴承表面免受攻击,已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中,将苯并三唑(BTA)加入显影液中,然后以正常方式使用,显影时间不受该改性的影响。 在第二种方法中,首先将待接收光致抗蚀剂的表面浸入BTA溶液中,随后立即施加光刻胶并进行处理,包括正常进行。 对于这两种方法,结果是在开发过程中消除了所有的铜腐蚀。
    • 4. 发明授权
    • Corrosion inhibitor for NiCu for high performance writers
    • NiCu用于高性能作者的防腐蚀剂
    • US06207350B1
    • 2001-03-27
    • US09483931
    • 2000-01-18
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • G03F732
    • G03F7/322C23F1/02G11B5/3163H05K3/064
    • The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
    • 通过保护所有暴露的铜轴承表面免受攻击,已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中,将苯并三唑(BTA)加入显影液中,然后以正常方式使用,显影时间不受该改性的影响。 在第二种方法中,首先将待接收光致抗蚀剂的表面浸入BTA的溶液中,随后立即施加光致抗蚀剂,并且包括显影在内的处理正常进行。 对于这两种方法,结果是在开发过程中消除了所有的铜腐蚀。
    • 5. 发明授权
    • Non-magnetic nickel containing conductor alloys for magnetic transducer element fabrication
    • 用于磁换能器元件制造的非磁性含镍导体合金
    • US06239948B1
    • 2001-05-29
    • US09360120
    • 1999-07-23
    • Xuehua WuKochan JuJei-Wei Chang
    • Xuehua WuKochan JuJei-Wei Chang
    • G11B5235
    • G11B5/235G11B5/3109G11B5/313G11B5/3903G11B5/3967
    • A non-magnetic conductor material, a magnetic transducer element having formed therein a non-magnetic conductor layer formed of the non-magnetic conductor material and a method for forming a magnetic transducer element having formed therein the non-magnetic conductor layer formed of the non-magnetic conductor material. The non-magnetic conductor material comprises an alloy comprising nickel and at least one non-magnetic conductor metal selected from the group consisting of copper at a weight percent of from about 45 to about 90, zinc at a weight percent of from about 20 to about 75, cadmium at a weight percent of from about 35 to about 85, platinum at a weight percent of from about 55 to about 90 and palladium at a weight percent of from about 75 to about 95. The non-magnetic conductor material contemplates the magnetic transducer element and the method for forming the magnetic transducer element. The non-magnetic conductor material has physical properties, chemical properties and electrochemical properties, but not magnetic properties, analogous to the physical properties, chemical properties and electrochemical properties exhibited by magnetic layers employed within magnetic transducer elements.
    • 一种非磁性导体材料,其中形成有由非磁性导体材料形成的非磁性导体层的磁性换能器元件以及形成其中形成有非磁性导体材料的非磁性导体层的磁性换能器元件的方法, 磁导体材料。 非磁性导体材料包括合金,其包含镍和至少一种选自重量百分比约为45至约90的铜的非磁性导体金属,重量百分比约为20至约20的锌 75,重量百分比为约35至约85的镉,以重量百分比为约55至约90的铂,以及重量百分比为约75至约95的钯。非磁性导体材料考虑了磁性 换能器元件和形成磁换能器元件的方法。 非磁性导体材料具有物理性质,化学性质和电化学性质,但不具有类似于在磁换能器元件内使用的磁性层所表现的物理性能,化学性质和电化学性能的磁性能。
    • 6. 发明授权
    • Plated flat metal gap for very narrow recording heads
    • 用于非常窄的记录头的镀金属间隙
    • US06218080B1
    • 2001-04-17
    • US09519610
    • 2000-03-06
    • Xuehua WuKochan JuJei-Wei Chang
    • Xuehua WuKochan JuJei-Wei Chang
    • G11B523
    • C25D1/10G11B5/232G11B5/3116G11B5/3163Y10T29/49032
    • It has been observed that plated structures grown inside molds for small objects, such as a gap structure in a magnetic read head, often have curved rather than planar surfaces. This problem has been overcome as follows. Prior to laying down photoresist for the mold, a layer of copper is deposited on the substrate on which the head structure is to be grown (normally the shared pole). After the photoresist is patterned to form the mold, all exposed copper is selectively removed from the substrate a key feature being that the copper is over-etched so that some undercutting of the photoresist occurs. Then, when the layers making up the gap structure are electrodeposited inside the mold they grow away from the substrate as planar surfaces.
    • 已经观察到,用于小物体的模具内生长的电镀结构,例如磁读头中的间隙结构,通常具有弯曲而不是平面。 这个问题已被克服如下。 在为模具铺设光致抗蚀剂之前,在要在其上生长头部结构的基底(通常是共享极)上沉积一层铜。 在光致抗蚀剂被图案化以形成模具之后,从衬底中选择性地去除所有暴露的铜,其关键特征是铜被过度蚀刻,使得发生光刻胶的一些底切。 然后,当构成间隙结构的层电沉积在模具内部时,它们作为平面表面从衬底生长。