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    • 1. 发明申请
    • Apparatus productivity improving system and its method
    • 设备生产率提高系统及其方法
    • US20070179751A1
    • 2007-08-02
    • US11593637
    • 2006-11-07
    • Wataru Karasawa
    • Wataru Karasawa
    • G06F15/00
    • G05B23/0283G05B2219/32233Y02P90/86
    • There is provided a system and method for improving productivity of apparatuses. A vendor-side computer 26 obtains operating state data obtained by a monitoring device 18 provided in an apparatus 10 via a communication line 100, and monitors the operating state of the apparatus 10 from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus 10, and the vendor-side computer 26 that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant 101. The plant 101 feeds the optimal replacement period back to the operation of the apparatus 10, so that productivity can be improved.
    • 提供了一种用于提高设备的生产率的系统和方法。 供应商侧计算机26通过通信线路100获得由设备10中提供的监视设备18获得的操作状态数据,并从远程位置监视设备10的操作状态。 从设备10发送部件更换时间的维护数据,并且已经接收到维护数据的供应商侧计算机26基于此计算部件的最佳更换周期。 所计算的每个部件的最佳更换周期被发送到设备101.工厂101将最佳更换周期馈送回设备10的操作,从而可以提高生产率。
    • 3. 发明授权
    • Apparatus productivity improving system and its method
    • 设备生产率提高系统及其方法
    • US07454317B2
    • 2008-11-18
    • US11593637
    • 2006-11-07
    • Wataru Karasawa
    • Wataru Karasawa
    • G06F17/00G06F17/40
    • G05B23/0283G05B2219/32233Y02P90/86
    • There is provided a system and method for monitoring an apparatus from a remote location. A vendor-side computer obtains operating state data obtained by a monitoring device provided in an apparatus via a communication line, and monitors the operating state of the apparatus from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus, and the vendor-side computer that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant. The plant feeds the optimal replacement period back to the operating of the apparatus.
    • 提供了一种用于从远程位置监测装置的系统和方法。 供应商侧计算机通过通信线路获取由设备中提供的监视装置获得的操作状态数据,并从远程位置监视装置的操作状态。 从设备发送部件更换时间的维护数据,并且接收到维护数据的供应商侧计算机基于此计算部件的最佳更换周期。 计算出的每个部件的最佳更换周期都会发送到工厂。 该设备将最佳的更换周期提供给设备的操作。
    • 4. 发明授权
    • Apparatus and method of testing a semiconductor wafer
    • 测试半导体晶片的装置和方法
    • US4965515A
    • 1990-10-23
    • US343370
    • 1989-04-26
    • Wataru Karasawa
    • Wataru Karasawa
    • G01R31/28G01R31/311
    • G01R31/2851G01R31/311
    • An apparatus and method of testing semiconductor wafer, which are capable of properly processing inking errors caused in the process of determining whether the chips are good or bad. The apparatus comprises an inker for markings those chips which have been found defective by probing test, a TV camera for imaging the chips including those which have been found defective and marked, a computer system for comparing an image-signal with a reference-signal, and determining that the chip has no marking when the signals coincide and that the chip has a marking when the signals do not coincide, and a counter for counting those chips which have been determined to have markings or no marking by the computer system.
    • 一种测试半导体晶片的装置和方法,其能够适当地处理在确定芯片是好还是坏的过程中引起的墨迹错误。 该装置包括用于通过探测测试发现有缺陷的芯片的标记的墨水器,用于对已经发现有缺陷和标记的那些芯片进行成像的电视摄像机,用于将图像信号与参考信号进行比较的计算机系统, 并且当所述信号一致时确定所述芯片没有标记,并且当所述信号不一致时确定所述芯片没有标记,以及用于计数已被确定具有所述计算机系统的标记或不标记的所述芯片的计数器。
    • 9. 发明申请
    • Processing method and device
    • 处理方法和装置
    • US20070004051A1
    • 2007-01-04
    • US10539246
    • 2003-12-17
    • Yasuhiro OkumotoWataru Karasawa
    • Yasuhiro OkumotoWataru Karasawa
    • H01L21/00
    • H01L21/67271G05B19/41875G05B2219/32209H01J37/32935H01L21/67253Y02P90/22
    • A processing system has a processing section for continuously processing a member to be processed; an inspection section for inspecting a processed state of the member processed by the processing section; a processed state determination section for determining whether the processed state is defective/nondefective, on the basis of a result of inspection performed by the inspection section; a continuity determination section for determining whether or not a defective determination is continuously made when the processed state is determined to be defective by the processed state determination section; and a processing control section for controlling processing so as to stop processing of the member continuously performed by the processing section when the continuity determination section determines that the defective determination is continuously made.
    • 处理系统具有用于连续处理要处理的部件的处理部分; 检查部,检查由处理部处理的部件的处理状态; 处理状态判定部,其根据检查部的检查结果,判断处理状态是否有缺陷/无效; 连续性确定部分,用于当处理状态确定部分确定处理状态有缺陷时,确定是否连续地进行故障判定; 以及处理控制部分,用于当连续性确定部分确定连续进行了缺陷判定时,控制处理以停止处理部件连续执行的部件的处理。
    • 10. 发明授权
    • Semiconductor manufacturing system and control method thereof
    • 半导体制造系统及其控制方法
    • US06839603B2
    • 2005-01-04
    • US10275647
    • 2001-05-08
    • Wataru Karasawa
    • Wataru Karasawa
    • H01L21/02G05B19/418G06F19/00
    • G05B19/41865G05B2219/32254G05B2219/32256G05B2219/32266G05B2219/32297G05B2219/32349G05B2219/45031Y02P90/20Y02P90/26
    • In a semiconductor manufacturing system, operations of a plurality of processing apparatuses are controlled so as to efficiently manufacture semiconductor devices. The semiconductor manufacturing system having at least one processing apparatus for applying a process to semiconductor substrates. A memory part (5) stores priority-level data which indicates a priority level of the process to be applied to each of the semiconductor substrates on an individual semiconductor substrate basis. A control part (3, 7) controls the processing apparatus to apply the process to a newly supplied one of the semiconductor substrates by determining an order of processing the newly supplied one of the semiconductor substrates being supplied to the processing apparatus based on a comparison of new priority-level data with the priority-level data stored in the memory part with respect to the semiconductor substrates of which process has been scheduled, the new priority-level data being supplied in response to the newly supplied one of the semiconductor substrates being supplied to the processing apparatus.
    • 在半导体制造系统中,控制多个处理装置的动作,以有效地制造半导体装置。 半导体制造系统具有至少一个用于将工艺应用于半导体衬底的处理装置。 存储器部分(5)存储优先级数据,该优先级数据指示在各个半导体衬底上施加到每个半导体衬底的处理的优先级。 控制部件(3,7)控制处理装置,通过基于对提供给处理装置的新提供的一个半导体基板的处理顺序,基于比较 相对于已经调度了处理的半导体衬底存储在存储器部分中的优先级数据的新的优先级数据,响应于提供的新提供的一个半导体衬底被提供的新的优先级数据 到处理装置。