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1. 发明授权

US5124931A Method of inspecting electric characteristics of wafers and apparatus therefor 失效
标题翻译：检查晶圆及其装置的电特性的方法
公开(公告)号：US5124931A
公开(公告)日：1992-06-23
申请号：US420525
申请日：1989-10-12
申请人： Masaaki Iwamatsu , Ryuichi Takebuchi , Yoshihito Marumo , Wataru Karasawa
发明人： Masaaki Iwamatsu , Ryuichi Takebuchi , Yoshihito Marumo , Wataru Karasawa
IPC分类号： G01R31/28
CPC分类号： G01R31/2831
摘要： In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.
摘要翻译：在检查晶片的电特性的方法中，自动执行探针卡的第二次和随后的对准操作的检测。在用于检查晶片的电特性的装置中，可以基于每种类型的晶片的预先存储的对准数据，使用相同的探针卡来连续检查不同类型的晶片。

2. 发明申请

US20070179751A1 Apparatus productivity improving system and its method 失效
标题翻译：设备生产率提高系统及其方法
公开(公告)号：US20070179751A1
公开(公告)日：2007-08-02
申请号：US11593637
申请日：2006-11-07
申请人： Wataru Karasawa
发明人： Wataru Karasawa
IPC分类号： G06F15/00
CPC分类号： G05B23/0283 , G05B2219/32233 , Y02P90/86
摘要： There is provided a system and method for improving productivity of apparatuses. A vendor-side computer 26 obtains operating state data obtained by a monitoring device 18 provided in an apparatus 10 via a communication line 100, and monitors the operating state of the apparatus 10 from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus 10, and the vendor-side computer 26 that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant 101. The plant 101 feeds the optimal replacement period back to the operation of the apparatus 10, so that productivity can be improved.
摘要翻译：提供了一种用于提高设备的生产率的系统和方法。供应商侧计算机26通过通信线路100获得由设备10中提供的监视设备18获得的操作状态数据，并从远程位置监视设备10的操作状态。从设备10发送部件更换时间的维护数据，并且已经接收到维护数据的供应商侧计算机26基于此计算部件的最佳更换周期。所计算的每个部件的最佳更换周期被发送到设备101.工厂101将最佳更换周期馈送回设备10的操作，从而可以提高生产率。

3. 发明授权

US5086270A Probe apparatus 失效
标题翻译：探头设备
公开(公告)号：US5086270A
公开(公告)日：1992-02-04
申请号：US634814
申请日：1990-12-31
申请人： Wataru Karasawa , Taketoshi Itoyama , Itaru Takao , Tadashi Obikane , Hisashi Koike
发明人： Wataru Karasawa , Taketoshi Itoyama , Itaru Takao , Tadashi Obikane , Hisashi Koike
IPC分类号： H01L21/66 , G01R1/04 , G01R1/067
CPC分类号： G01R1/04 , G01R1/06705
摘要： A probe apparatus having a measuring section with a first system for electrically measuring an object. A loader section has a second system for carrying objects to the measuring section and a marking section has a third system for marking objects. These sections are independent of each other so that a vibration occurring in one section is not transmitted to the other sections.
摘要翻译：一种具有测量部分的探针装置，具有用于电测量物体的第一系统。装载器部分具有用于将物体运送到测量部分的第二系统，并且标记部分具有用于标记物体的第三系统。这些部分彼此独立，使得在一个部分中发生的振动不传递到其它部分。

4. 发明授权

US07454317B2 Apparatus productivity improving system and its method 失效
标题翻译：设备生产率提高系统及其方法
公开(公告)号：US07454317B2
公开(公告)日：2008-11-18
申请号：US11593637
申请日：2006-11-07
申请人： Wataru Karasawa
发明人： Wataru Karasawa
IPC分类号： G06F17/00 , G06F17/40
CPC分类号： G05B23/0283 , G05B2219/32233 , Y02P90/86
摘要： There is provided a system and method for monitoring an apparatus from a remote location. A vendor-side computer obtains operating state data obtained by a monitoring device provided in an apparatus via a communication line, and monitors the operating state of the apparatus from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus, and the vendor-side computer that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant. The plant feeds the optimal replacement period back to the operating of the apparatus.
摘要翻译：提供了一种用于从远程位置监测装置的系统和方法。供应商侧计算机通过通信线路获取由设备中提供的监视装置获得的操作状态数据，并从远程位置监视装置的操作状态。从设备发送部件更换时间的维护数据，并且接收到维护数据的供应商侧计算机基于此计算部件的最佳更换周期。计算出的每个部件的最佳更换周期都会发送到工厂。该设备将最佳的更换周期提供给设备的操作。

5. 发明授权

US4965515A Apparatus and method of testing a semiconductor wafer 失效
标题翻译：测试半导体晶片的装置和方法
公开(公告)号：US4965515A
公开(公告)日：1990-10-23
申请号：US343370
申请日：1989-04-26
申请人： Wataru Karasawa
发明人： Wataru Karasawa
IPC分类号： G01R31/28 , G01R31/311
CPC分类号： G01R31/2851 , G01R31/311
摘要： An apparatus and method of testing semiconductor wafer, which are capable of properly processing inking errors caused in the process of determining whether the chips are good or bad. The apparatus comprises an inker for markings those chips which have been found defective by probing test, a TV camera for imaging the chips including those which have been found defective and marked, a computer system for comparing an image-signal with a reference-signal, and determining that the chip has no marking when the signals coincide and that the chip has a marking when the signals do not coincide, and a counter for counting those chips which have been determined to have markings or no marking by the computer system.
摘要翻译：一种测试半导体晶片的装置和方法，其能够适当地处理在确定芯片是好还是坏的过程中引起的墨迹错误。该装置包括用于通过探测测试发现有缺陷的芯片的标记的墨水器，用于对已经发现有缺陷和标记的那些芯片进行成像的电视摄像机，用于将图像信号与参考信号进行比较的计算机系统，并且当所述信号一致时确定所述芯片没有标记，并且当所述信号不一致时确定所述芯片没有标记，以及用于计数已被确定具有所述计算机系统的标记或不标记的所述芯片的计数器。

6. 发明授权

US4812901A Probe apparatus 失效
标题翻译：探头设备
公开(公告)号：US4812901A
公开(公告)日：1989-03-14
申请号：US100199
申请日：1987-09-23
申请人： Wataru Karasawa
发明人： Wataru Karasawa
IPC分类号： G05B19/18 , G01R1/073 , G05B19/404 , H01L21/66 , H01L21/68 , H04N7/00
CPC分类号： G01R1/073
摘要： A probe apparatus is disclosed, in which, when performing a predetermined processing on an object having a pattern recurring at a predetermined pitch by moving the object at a pitch equal to the predetermined pitch, the difference between the pitch of actual movement of the object and the pitch of the recurrence of pattern is detected by pattern recognition, and the pitch of movement of the object is corrected according to the detected difference.
摘要翻译：本发明公开了一种探针装置，其中，通过以与预定间距相等的间距移动物体，对具有以预定间距重复出现的图案的物体执行预定处理时，物体的实际运动的间距与通过模式识别来检测图案再现的间距，并且根据检测到的差异校正对象的移动间距。

7. 发明授权

US5404111A Probe apparatus with a swinging holder for an object of examination 失效
标题翻译：具有用于检查对象的摆动支架的探头装置
公开(公告)号：US5404111A
公开(公告)日：1995-04-04
申请号：US77392
申请日：1993-06-17
申请人： Shigeoki Mori , Wataru Karasawa , Hitoshi Fujihara , Masaru Suzuki , Keiichi Yokota
发明人： Shigeoki Mori , Wataru Karasawa , Hitoshi Fujihara , Masaru Suzuki , Keiichi Yokota
IPC分类号： G01R1/073 , G01R31/265 , G01R31/02
CPC分类号： G01R1/07314 , G01R31/2656
摘要： A probe apparatus which has a probe card having a plurality of probes, a wafer holder located above or beside the probe card, for holding a wafer to be examined, a tester head electrically connected to the probes of the probe card, a tester electrically connected to the tester head, for detecting electrical characteristics of the wafer from the data output from the wafer, and a CCD camera arranged to oppose the object, for detecting the position of the wafer.
摘要翻译：一种具有探针卡的探针装置，具有多个探针，位于探针卡上方或旁边的晶片保持器，用于保持要检查的晶片，电连接到探针卡的探针的测试器头，电连接的测试仪用于从晶片输出的数据检测晶片的电特性，以及配置成与物体相对的CCD照相机，用于检测晶片的位置。

8. 发明授权

US5321453A Probe apparatus for probing an object held above the probe card 失效
标题翻译：用于探测探针卡上方的物体的探针装置
公开(公告)号：US5321453A
公开(公告)日：1994-06-14
申请号：US923539
申请日：1992-08-03
申请人： Shigeoki Mori , Wataru Karasawa
发明人： Shigeoki Mori , Wataru Karasawa
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R1/07314
摘要： A probe apparatus having a probe card having plurality of probes, a member arranged above the probe card to hold an object to be probed, and a test head electrically connected to the probes of the probe card.
摘要翻译：一种探针装置，具有具有多个探针的探针卡，设置在探针卡上方的用于保持要探测的物体的构件，以及电连接到探针卡的探针的测试头。

9. 发明申请

US20070004051A1 Processing method and device 审中-公开
标题翻译：处理方法和装置
公开(公告)号：US20070004051A1
公开(公告)日：2007-01-04
申请号：US10539246
申请日：2003-12-17
申请人： Yasuhiro Okumoto , Wataru Karasawa
发明人： Yasuhiro Okumoto , Wataru Karasawa
IPC分类号： H01L21/00
CPC分类号： H01L21/67271 , G05B19/41875 , G05B2219/32209 , H01J37/32935 , H01L21/67253 , Y02P90/22
摘要： A processing system has a processing section for continuously processing a member to be processed; an inspection section for inspecting a processed state of the member processed by the processing section; a processed state determination section for determining whether the processed state is defective/nondefective, on the basis of a result of inspection performed by the inspection section; a continuity determination section for determining whether or not a defective determination is continuously made when the processed state is determined to be defective by the processed state determination section; and a processing control section for controlling processing so as to stop processing of the member continuously performed by the processing section when the continuity determination section determines that the defective determination is continuously made.
摘要翻译：处理系统具有用于连续处理要处理的部件的处理部分; 检查部，检查由处理部处理的部件的处理状态; 处理状态判定部，其根据检查部的检查结果，判断处理状态是否有缺陷/无效; 连续性确定部分，用于当处理状态确定部分确定处理状态有缺陷时，确定是否连续地进行故障判定; 以及处理控制部分，用于当连续性确定部分确定连续进行了缺陷判定时，控制处理以停止处理部件连续执行的部件的处理。

10. 发明授权

US06839603B2 Semiconductor manufacturing system and control method thereof 失效
标题翻译：半导体制造系统及其控制方法
公开(公告)号：US06839603B2
公开(公告)日：2005-01-04
申请号：US10275647
申请日：2001-05-08
申请人： Wataru Karasawa
发明人： Wataru Karasawa
IPC分类号： H01L21/02 , G05B19/418 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32254 , G05B2219/32256 , G05B2219/32266 , G05B2219/32297 , G05B2219/32349 , G05B2219/45031 , Y02P90/20 , Y02P90/26
摘要： In a semiconductor manufacturing system, operations of a plurality of processing apparatuses are controlled so as to efficiently manufacture semiconductor devices. The semiconductor manufacturing system having at least one processing apparatus for applying a process to semiconductor substrates. A memory part (5) stores priority-level data which indicates a priority level of the process to be applied to each of the semiconductor substrates on an individual semiconductor substrate basis. A control part (3, 7) controls the processing apparatus to apply the process to a newly supplied one of the semiconductor substrates by determining an order of processing the newly supplied one of the semiconductor substrates being supplied to the processing apparatus based on a comparison of new priority-level data with the priority-level data stored in the memory part with respect to the semiconductor substrates of which process has been scheduled, the new priority-level data being supplied in response to the newly supplied one of the semiconductor substrates being supplied to the processing apparatus.
摘要翻译：在半导体制造系统中，控制多个处理装置的动作，以有效地制造半导体装置。半导体制造系统具有至少一个用于将工艺应用于半导体衬底的处理装置。存储器部分（5）存储优先级数据，该优先级数据指示在各个半导体衬底上施加到每个半导体衬底的处理的优先级。控制部件（3,7）控制处理装置，通过基于对提供给处理装置的新提供的一个半导体基板的处理顺序，基于比较相对于已经调度了处理的半导体衬底存储在存储器部分中的优先级数据的新的优先级数据，响应于提供的新提供的一个半导体衬底被提供的新的优先级数据到处理装置。

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