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1. 发明申请

US20090010525A1 METHOD AND APPARATUS FOR DETECTING POSITIONS OF ELECTRODE PADS 有权
标题翻译：用于检测电极垫位置的方法和装置
公开(公告)号：US20090010525A1
公开(公告)日：2009-01-08
申请号：US12017642
申请日：2008-01-22
申请人： Yoshihito MARUMO
发明人： Yoshihito MARUMO
IPC分类号： G06K9/00
CPC分类号： G06T7/73 , G01R31/2891 , G06T2207/30148
摘要： A method for detecting positions of a plurality of electrode pads of semiconductor chips formed on a semiconductor wafer includes: setting an imaging target region greater than a semiconductor chip on the semiconductor wafer; performing split imaging so as to entirely cover the imaging target region; and detecting positions of electrode pads of the semiconductor chip by processing images obtained by the split imaging. The split imaging is performed by using an imaging device which enlarges and images a region smaller than the imaging target region by one imaging.
摘要翻译：用于检测形成在半导体晶片上的多个半导体芯片的电极焊盘的位置的方法包括：在半导体晶片上设置大于半导体芯片的成像目标区域; 执行分割成像以完全覆盖成像目标区域; 以及通过处理通过分割成像获得的图像来检测半导体芯片的电极焊盘的位置。通过使用通过一次成像放大和成像小于成像目标区域的区域的成像装置来进行分割成像。

2. 发明授权

US5777485A Probe method and apparatus with improved probe contact 失效
标题翻译：具有改进的探针接触的探头方法和装置
公开(公告)号：US5777485A
公开(公告)日：1998-07-07
申请号：US617551
申请日：1996-03-19
申请人： Hideaki Tanaka , Shinji Akaike , Yoshihito Marumo
发明人： Hideaki Tanaka , Shinji Akaike , Yoshihito Marumo
IPC分类号： G01R31/28 , G01R1/06
CPC分类号： G01R31/2887 , G01R31/2831 , G01R31/2851
摘要： A probe apparatus in which a wafer having IC chips arrayed with electrode pads is supported by a pedestal, and the pedestal is moved relatively to a probe card in the X, Y, Z directions to bring the electrode pads into contact with probes of the probe card so as to perform an electric measurement of the part to be inspected, the apparatus includes a parameter setting part for setting a distance in the Z direction between the probe and the electrode pad when the pedestal is moved along the X, Y planes to specify the initial position of the chip, a memory unit for storing the distance in the Z direction set by the parameter setting part, and a control unit for moving the pedestal in the Z direction in a manner to be apart from the probe card on the basis of the distance in the Z direction stored in the memory unit to move the chip to the initial position, and moving relatively the pedestal in the Z direction from the position to the probe card so as to contact the electrode pad of the chip with the probe.
摘要翻译：探针装置，其中具有排列有电极焊盘的IC芯片的晶片由基座支撑，并且基座在X，Y，Z方向上相对于探针卡移动以使电极焊盘与探针的探针接触卡，以对要检查的部件执行电测量，该装置包括参数设置部分，用于当基座沿X，Y平面移动时，在探头和电极焊盘之间设置Z方向上的距离，以指定芯片的初始位置，用于存储由参数设定部分设定的在Z方向上的距离的存储单元，以及控制单元，用于以与探针卡分开的方式在Z方向上移动基座沿着存储在存储器单元中的Z方向上的距离将芯片移动到初始位置，并且使Z轴方向上的基座从位置相对于探针卡移动，以便与ch的电极焊盘接触 ip用探针。

3. 发明授权

US07991219B2 Method and apparatus for detecting positions of electrode pads 有权
标题翻译：用于检测电极焊盘位置的方法和装置
公开(公告)号：US07991219B2
公开(公告)日：2011-08-02
申请号：US12017642
申请日：2008-01-22
申请人： Yoshihito Marumo
发明人： Yoshihito Marumo
IPC分类号： G06K9/00
CPC分类号： G06T7/73 , G01R31/2891 , G06T2207/30148
摘要： A method for detecting positions of a plurality of electrode pads of semiconductor chips formed on a semiconductor wafer includes: setting an imaging target region greater than a semiconductor chip on the semiconductor wafer; performing split imaging so as to entirely cover the imaging target region; and detecting positions of electrode pads of the semiconductor chip by processing images obtained by the split imaging. The split imaging is performed by using an imaging device which enlarges and images a region smaller than the imaging target region by one imaging.
摘要翻译：用于检测形成在半导体晶片上的多个半导体芯片的电极焊盘的位置的方法包括：在半导体晶片上设置大于半导体芯片的成像目标区域; 执行分割成像以完全覆盖成像目标区域; 以及通过处理通过分割成像获得的图像来检测半导体芯片的电极焊盘的位置。通过使用通过一次成像放大和成像小于成像目标区域的区域的成像装置来进行分割成像。

4. 发明授权

US5936416A Probe inspection apparatus 失效
标题翻译：探头检查装置
公开(公告)号：US5936416A
公开(公告)日：1999-08-10
申请号：US857852
申请日：1997-05-16
申请人： Hideaki Tanaka , Yoshihito Marumo
发明人： Hideaki Tanaka , Yoshihito Marumo
IPC分类号： G01R31/28 , G01R31/26
CPC分类号： G01R1/025 , G01R31/2851 , G01R31/2887
摘要： A probe inspection apparatus includes a mounting section mounting an inspection target, a loader section having a convey mechanism for conveying the inspection target on the mounting section, a prober section for inspecting the inspection target conveyed by the convey mechanism, a controller for controlling movements of the prober section and the loader section, and a display unit having a display panel for displaying an operation panel for operating the controller. The operation panel has operation touch keys for operating the controller with an operation content displayed in a user country language, and identification symbol touch keys for displaying an operation content corresponding to the operation keys in a language different from the user country language.
摘要翻译：探针检查装置包括安装检查对象的安装部，具有用于将检查对象传送到安装部的传送机构的装载部，检测由传送机构传送的检查对象的检测部，控制器，探测器部分和装载器部分，以及具有用于显示用于操作控制器的操作面板的显示面板的显示单元。操作面板具有用于以用户国家语言显示的操作内容来操作控制器的操作触摸键，以及用于以不同于用户国家语言的语言显示与操作键对应的操作内容的识别符号触摸键。

5. 发明授权

US5124931A Method of inspecting electric characteristics of wafers and apparatus therefor 失效
标题翻译：检查晶圆及其装置的电特性的方法
公开(公告)号：US5124931A
公开(公告)日：1992-06-23
申请号：US420525
申请日：1989-10-12
申请人： Masaaki Iwamatsu , Ryuichi Takebuchi , Yoshihito Marumo , Wataru Karasawa
发明人： Masaaki Iwamatsu , Ryuichi Takebuchi , Yoshihito Marumo , Wataru Karasawa
IPC分类号： G01R31/28
CPC分类号： G01R31/2831
摘要： In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.
摘要翻译：在检查晶片的电特性的方法中，自动执行探针卡的第二次和随后的对准操作的检测。在用于检查晶片的电特性的装置中，可以基于每种类型的晶片的预先存储的对准数据，使用相同的探针卡来连续检查不同类型的晶片。

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