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    • 1. 发明授权
    • Optical sensing head and method for fabricating the sensing head
    • 光学感测头及其制造方法
    • US07223952B2
    • 2007-05-29
    • US10667717
    • 2003-09-22
    • Ulrich SteegmüllerWolfgang GramannFrank SingerJürgen DachsMathias Kämpf
    • Ulrich SteegmüllerWolfgang GramannFrank SingerJürgen DachsMathias Kämpf
    • G01B7/00
    • G11B7/1263G02B6/4214G11B7/123G11B7/22
    • An optical sensing head, which is for reading out an optical data memory, has a substrate with a main surface. An edge-emitting laser component is configured on the main surface of the substrate and has irradiation axis oriented essentially parallel to the first main plane. A deflection device is arranged on the main surface of the substrate and deflects the laser radiation in a direction that is essentially perpendicular to the main surface. At least one signal detector is provided for sensing the laser radiation that is reflected by the optical data memory. An optical element guides the deflected laser radiation to the optical data memory and guides reflected laser radiation to the signal detector. The optical element is connected to the substrate by at least one supporting element. The invention also includes a method for fabricating such a sensing head.
    • 用于读出光学数据存储器的光学检测头具有具有主表面的基板。 边缘发射激光器部件被构造在基板的主表面上,并具有基本上平行于第一主平面定向的照射轴。 偏转装置设置在基板的主表面上,并使激光辐射沿基本垂直于主表面的方向偏转。 提供至少一个信号检测器用于感测由光学数据存储器反射的激光辐射。 光学元件将偏转的激光辐射引导到光学数据存储器并将反射的激光辐射引导到信号检测器。 光学元件通过至少一个支撑元件连接到基板。 本发明还包括一种用于制造这种感测头的方法。
    • 8. 发明授权
    • Optoelectronic component and method for the manufacture thereof
    • 光电子元件及其制造方法
    • US5875205A
    • 1999-02-23
    • US799494
    • 1997-02-12
    • Werner SpaethWolfgang GramannHans-Ludwig AlthausRalf Dietrich
    • Werner SpaethWolfgang GramannHans-Ludwig AlthausRalf Dietrich
    • H01L33/00H01S5/00H01S5/02H01S5/022H01S5/18H01S3/19
    • H01S5/02284H01S5/02292H01S5/0201H01S5/02248H01S5/0683
    • In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.
    • 在具有作为光发射器的激光芯片和用于在激光芯片中产生的辐射的定义发射的透镜耦合光学器件的光电子部件中,透镜耦合光学器件被立即布置在激光器芯片的前面,并且以稳定的方式被调整和固定 一个简单的方法。 该组件在晶片联合中合理制造。 激光芯片布置在两个载体部件之间的公共载体上,其相对于激光芯片的谐振器面的侧表面设置有镜层,并且相对于谐振器面倾斜45度。 因此,在激光芯片中产生的辐射几乎垂直地向上引导到公共载体的表面,并且透镜耦合光学器件被布置在至少一个载体部分上,使得在激光器芯片中产生的辐射几乎垂直地撞击该透镜光学器件。