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    • 1. 发明授权
    • Optoelectronic component and method for the manufacture thereof
    • 光电子元件及其制造方法
    • US5875205A
    • 1999-02-23
    • US799494
    • 1997-02-12
    • Werner SpaethWolfgang GramannHans-Ludwig AlthausRalf Dietrich
    • Werner SpaethWolfgang GramannHans-Ludwig AlthausRalf Dietrich
    • H01L33/00H01S5/00H01S5/02H01S5/022H01S5/18H01S3/19
    • H01S5/02284H01S5/02292H01S5/0201H01S5/02248H01S5/0683
    • In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.
    • 在具有作为光发射器的激光芯片和用于在激光芯片中产生的辐射的定义发射的透镜耦合光学器件的光电子部件中,透镜耦合光学器件被立即布置在激光器芯片的前面,并且以稳定的方式被调整和固定 一个简单的方法。 该组件在晶片联合中合理制造。 激光芯片布置在两个载体部件之间的公共载体上,其相对于激光芯片的谐振器面的侧表面设置有镜层,并且相对于谐振器面倾斜45度。 因此,在激光芯片中产生的辐射几乎垂直地向上引导到公共载体的表面,并且透镜耦合光学器件被布置在至少一个载体部分上,使得在激光器芯片中产生的辐射几乎垂直地撞击该透镜光学器件。
    • 10. 发明授权
    • Optoelectronic coupling element and method for its manufacture
    • 光电耦合元件及其制造方法
    • US4875750A
    • 1989-10-24
    • US151372
    • 1988-02-02
    • Werner SpaethGuenther WaitlWerner KuhlmannHans-Ludwig AlthausRolf BirkmannWaltraud KlosAxel Schubert
    • Werner SpaethGuenther WaitlWerner KuhlmannHans-Ludwig AlthausRolf BirkmannWaltraud KlosAxel Schubert
    • G02B6/32G02B6/36G02B6/42
    • G02B6/4249G02B6/4204
    • An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.
    • 一种用于制造耦合元件的光电耦合元件和方法。 耦合元件包括光波导,微透镜,第一载体芯片和发光和/或光检测半导体元件。 微透镜的形状优选为球形,并且适于光学耦合光波导和半导体元件。 半导体元件可以是第一载体芯片的一部分,或者根据另一实施例,半导体元件可以是第二载体芯片的一部分。 该耦合元件的目的是便于将微透镜精确地安装在光波导和半导体元件之间的位置,并且还便于微透镜的调节以最佳地执行其光耦合功能。 用于制造耦合元件的方法提供了在载体芯片中形成具有梯形形状侧面的插座。 微透镜用诸如玻璃的连接介质安装在容器内。 容器的尺寸由微透镜的尺寸和微透镜与载体之间的接触点决定。 根据本发明的光电耦合元件的应用尤其在LED发射机结构元件,接收器结构元件和激光模块中。 这种生产方法基本上避免了由于诸如机械变形的影响而导致的载体芯片的损伤。 另外,尽管这些部件的尺寸很小,但是这种类型的联接元件可以经济高效地批量生产。