专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080182366A1 Hybrid module and method of manufacturing the same 失效
标题翻译：混合模块及其制造方法
公开(公告)号：US20080182366A1
公开(公告)日：2008-07-31
申请号：US12077486
申请日：2008-03-19
申请人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
发明人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
IPC分类号： H01L21/00
CPC分类号： H01L23/147 , G02B6/43 , H01L21/568 , H01L21/6835 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/16 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/12105 , H01L2224/24195 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/00
摘要： A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.
摘要翻译：混合模块包括具有形成在其中的多个部件安装开口的硅衬底，多个部件安装开口由通孔组成，多个安装部件安装在部件安装开口中，使得输入/输出部分形成表面为基本上与硅衬底的第一主表面齐平;密封层，其由填充到部件安装开口中的密封材料形成，并且覆盖安装部分，其中输入/输出部分形成表面从第一主表面露出硅基板，将安装部件固定在部件安装开口中;以及布线层，其形成在硅基板的第一主表面上，并且具有连接到设置在输入/输出端上的输入/输出部分的布线图案从第一主表面露出的安装部分的形成表面的部分。

2. 发明授权

US07915076B2 Hybrid module and method of manufacturing the same 失效
标题翻译：混合模块及其制造方法
公开(公告)号：US07915076B2
公开(公告)日：2011-03-29
申请号：US12077486
申请日：2008-03-19
申请人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
发明人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
IPC分类号： H01L21/00
CPC分类号： H01L23/147 , G02B6/43 , H01L21/568 , H01L21/6835 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/16 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/12105 , H01L2224/24195 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/00
摘要： A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.
摘要翻译：混合模块包括具有形成在其中的多个部件安装开口的硅衬底，多个部件安装开口由通孔组成，多个安装部件安装在部件安装开口中，使得输入/输出部分形成表面为基本上与硅衬底的第一主表面齐平;密封层，其由填充到部件安装开口中的密封材料形成，并且覆盖安装部分，其中输入/输出部分形成表面从第一主表面露出硅基板，将安装部件固定在部件安装开口中;以及布线层，其形成在硅基板的第一主表面上，并且具有连接到设置在输入/输出端上的输入/输出部分的布线图案从第一主表面露出的安装部分的形成表面的部分。

3. 发明申请

US20070080458A1 Hybrid module and method of manufacturing the same 审中-公开
标题翻译：混合模块及其制造方法
公开(公告)号：US20070080458A1
公开(公告)日：2007-04-12
申请号：US11528965
申请日：2006-09-27
申请人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
发明人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
IPC分类号： H01L23/48
CPC分类号： H01L23/147 , G02B6/43 , H01L21/568 , H01L21/6835 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/16 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/12105 , H01L2224/24195 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/00
摘要： A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.
摘要翻译：混合模块包括具有形成在其中的多个部件安装开口的硅衬底，多个部件安装开口由通孔组成，多个安装部件安装在部件安装开口中，使得输入/输出部分形成表面为基本上与硅衬底的第一主表面齐平;密封层，其由填充到部件安装开口中的密封材料形成，并且覆盖安装部分，其中输入/输出部分形成表面从第一主表面露出硅基板，将安装部件固定在部件安装开口中;以及布线层，其形成在硅基板的第一主表面上，并且具有连接到设置在输入/输出端上的输入/输出部分的布线图案从第一主表面露出的安装部分的形成表面的部分。

4. 发明授权

US06714422B2 High frequency module device and method for its preparation 失效
标题翻译：高频模块装置及其制备方法
公开(公告)号：US06714422B2
公开(公告)日：2004-03-30
申请号：US09951148
申请日：2001-09-13
申请人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
发明人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
IPC分类号： H05K111
CPC分类号： H05K1/16 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H03H3/00 , Y10T29/4913 , Y10T29/49155 , H01L2924/00012 , H01L2224/0401 , H01L2924/01033
摘要： A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.
摘要翻译：一种薄型，高精度和高功能的高频模块装置，其中包装的尺寸和成本可能减小。模块装置包括基底（2）和高频器件层（4）。通过在由耐热性和高频特性的有机材料成型的芯基板（5）的第一主表面（5a）上形成图案化的布线层（9）来形成基底基板（2）。将基底（2）的最上层平坦化，形成高频器件层形成面（3）。高频器件层部分（4）通过薄膜或厚膜形成技术形成在高频器件层形成表面（3）上，并且包括由电阻器（27）和电容器（26）。无源元件由侧基板提供电源或信号。

5. 发明申请

US20060198570A1 Hybrid module and production method for same, and hybrid circuit device 审中-公开
标题翻译：混合模块及其制作方法相同，混合电路装置
公开(公告)号：US20060198570A1
公开(公告)日：2006-09-07
申请号：US11340025
申请日：2006-01-26
申请人： Tsuyoshi Ogawa , Hirokazu Nakayama
发明人： Tsuyoshi Ogawa , Hirokazu Nakayama
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/12004 , G02B6/4214 , G02B2006/12173 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/167 , H01L31/0203 , H01L31/12 , H01L2224/24227 , H01L2224/82039 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/30105 , H01L2924/351 , H05K1/0274 , H05K1/185 , H01L2224/83 , H01L2224/82 , H01L2224/48 , H01L2924/00
摘要： Components can be mounted with an improved accuracy and efficiency, thereby realizing a thin hybrid module in which the components are mounted with a high density. The present invention provides a hybrid module including a silicon substrate having formed therein a plurality of component mounting concavities open to one of main sides of the silicon substrate, a plurality of components inserted in the component mounting concavities, respectively, with their input/output-formed sides being exposed to outside through the openings of the component mounting concavities and buried in the silicon substrate with their perimeters except for at least their input/output-formed sides being fixed by adhesive layers formed in the component mounting concavities, and a wiring layer formed on the main side of the silicon substrate to cover the components and which has a wiring pattern provided on an insulative resin layer included in the wiring layer and which is connected to an input/output provided on the input/output-formed side of each of the components.
摘要翻译：组件可以以提高的精度和效率进行安装，从而实现其中以高密度安装部件的薄混合模块。本发明提供了一种混合模块，其包括：硅基板，其中形成有多个部件安装凹部，该多个部件安装凹部通向硅基板的一个主侧面，多个部件分别插入部件安装凹部中，其输入/ 形成的侧面通过构件安装凹部的开口暴露于外部，并且以其周边方式埋在硅衬底中，除了至少其输入/输出形成的侧面由形成在部件安装凹部中的粘合剂层固定，并且布线层形成在硅基板的主面上以覆盖部件，并且具有设置在布线层中包括的绝缘树脂层上的布线图案，并且连接到设置在每个的输入/输出形成侧上的输入/输出的组件。

6. 发明授权

US06797890B2 High frequency module device and method for its preparation 失效
公开(公告)号：US06797890B2
公开(公告)日：2004-09-28
申请号：US10225800
申请日：2002-08-22
申请人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
发明人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
IPC分类号： H05K116
CPC分类号： H05K1/16 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H03H3/00 , Y10T29/4913 , Y10T29/49155 , H01L2924/00012 , H01L2224/0401 , H01L2924/01033
摘要： A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

7. 发明授权

US08926888B2 Fluorinated silazane release agents in nanoimprint lithography 有权
标题翻译：氟化硅氮烷脱模剂纳米压印光刻
公开(公告)号：US08926888B2
公开(公告)日：2015-01-06
申请号：US13404083
申请日：2012-02-24
申请人： Carlton Grant Willson , Tsuyoshi Ogawa , Michael W. Lin , Daniel J. Hellebusch , B. Michael Jacobsson , William K. Bell
发明人： Carlton Grant Willson , Tsuyoshi Ogawa , Michael W. Lin , Daniel J. Hellebusch , B. Michael Jacobsson , William K. Bell
IPC分类号： G03F7/004 , G03F7/00 , B82Y10/00 , B82Y40/00 , B29C35/08
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： An imprint lithography release agent having general formula (1): where R1 represents H or CH3, n is an integer from 1 to 5, and m is an integer from 1 to 40. Fluorinated silazanes of general formula (1) can be used to form a release layer on an imprint lithography template, added to an imprint lithography resist, or both.
摘要翻译：具有通式（1）的压印光刻剥离剂：其中R 1表示H或CH 3，n是1至5的整数，m是1至40的整数。通式（1）的氟化硅氮烷可用于在压印光刻模板上形成释放层，添加到压印光刻抗蚀剂或两者。

8. 发明授权

US07395225B2 Custom-made product sales system and method 有权
标题翻译：定制产品销售体系和方法
公开(公告)号：US07395225B2
公开(公告)日：2008-07-01
申请号：US10204665
申请日：2001-12-25
申请人： Tetsuji Fuwa , Tsuyoshi Ogawa
发明人： Tetsuji Fuwa , Tsuyoshi Ogawa
IPC分类号： G06Q30/00 , G06F17/30
CPC分类号： G06Q30/06 , G06Q30/0621 , G06Q30/0643
摘要： As a server computer receives, in a communication portion, data on an appearance of a custom-made product, such as a stamp, from a purchaser computer, a preview image creating portion creates smaller-sized preview image data than normal image data to be used when a stamp is produced by a stamp producing device connected to a supplier computer. The created preview image data is transmitted from the communication portion to the purchaser computer and the supplier computer, as required, and displayed on respective browsers. Therefore, the purchaser of the custom-made product can be promptly view the preview image of the custom-made product.
摘要翻译：当服务器计算机在通信部分中接收来自购买者计算机的定制产品（例如邮票）的外观的数据时，预览图像创建部分产生比正常图像数据更小尺寸的预览图像数据当由连接到供应商计算机的印章制作装置制作印章时使用。所创建的预览图像数据根据需要从通信部分发送到购买者计算机和供应商计算机，并且显示在相应的浏览器上。因此，定制产品的购买者可以及时查看定制产品的预览图像。

9. 发明授权

US07244656B2 Thin film circuit board device and method for manufacturing the same 失效
标题翻译：薄膜电路板装置及其制造方法
公开(公告)号：US07244656B2
公开(公告)日：2007-07-17
申请号：US10965071
申请日：2004-10-14
申请人： Tsuyoshi Ogawa
发明人： Tsuyoshi Ogawa
IPC分类号： H01L21/20
CPC分类号： H01L23/49894 , H01L23/3121 , H01L23/3677 , H01L23/498 , H01L23/49822 , H01L24/48 , H01L25/16 , H01L2224/16 , H01L2224/48227 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12042 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H05K1/16 , H05K1/162 , H05K1/167 , H05K3/062 , H05K3/067 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K2201/0317 , H05K2201/0338 , H05K2201/09509 , H05K2203/0315 , H05K2203/0361 , H05K2203/1453 , Y10S438/957 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a thin film circuit board device having passive elements in wiring layers. The thin film circuit board device includes a base board (2) and a circuit part (3) including insulating layers (11) and (16) and pattern wiring (14) and (17) formed on a build-up forming surface (2a). On the first insulating layer (11), a receiving electrode part (21) is formed and the passive elements electrically connected to the receiving electrode part (21) are formed. In the circuit part (3), a substrate titanium film and a substrate film are laminated so as to cover the receiving electrode part (21) and the passive elements respectively. The substrate film and the substrate titanium film in areas in which a metallic film is not formed are etched through the metallic film serving as the first pattern wiring (14) formed on the substrate film as a mask. Thus, a substrate layer (23) and a substrate titanium layer (22) are formed. Consequently, the substrate titanium film serving as the substrate titanium layer (22) prevents the corrosion of the receiving electrode part and the respective passive elements due to etching liquid to form the passive elements with high performance.
摘要翻译：本发明涉及一种在布线层中具有无源元件的薄膜电路板器件。薄膜电路板装置包括基板（2）和包括绝缘层（11）和（16）的电路部分（3）和形成在积层形成表面（2）上的图案布线（14）和（17）一个）。在第一绝缘层（11）上，形成接收电极部（21），并且形成与接收电极部（21）电连接的无源元件。在电路部分（3）中，层叠基板钛膜和基板膜以覆盖接收电极部分（21）和无源元件。通过作为形成在基板膜上的第一图案布线（14）的金属膜作为掩模，蚀刻在未形成金属膜的区域中的基板膜和基板钛膜。因此，形成基板层（23）和基板钛层（22）。因此，用作基板钛层（22）的基板钛膜防止由于蚀刻液体而导致的接收电极部分和各个无源元件的腐蚀，从而形成具有高性能的无源元件。

10. 发明授权

US07167608B2 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical interconnects and manufacturing methods thereof 有权
标题翻译：具有光和电互连的混合电路基板，具有光学互连的混合电路模块及其制造方法
公开(公告)号：US07167608B2
公开(公告)日：2007-01-23
申请号：US11322710
申请日：2005-12-30
申请人： Tsuyoshi Ogawa
发明人： Tsuyoshi Ogawa
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/42 , G02B6/4214 , H01L2224/16225 , H01L2924/00014 , H01L2924/15192 , H01L2924/19105 , H05K1/0274 , H05K3/007 , H05K3/4602 , H05K3/4682 , H05K3/4694 , H05K2201/09972 , H05K2203/016 , H05K2203/061 , H01L2224/0401
摘要： Transmission of electric and optical signal, realization of high-speed and high capacity of transmission of information signals. A base substrate section having an interconnect layer formed on an insulating substrate by a printed circuit process; a micro interconnect circuit section having a micro electrical interconnect layer which is finer than the interconnect layer of the base substrate section, formed on an insulating resin layer by a semiconductor process; and an optical interconnect circuit section adapted to transfer and/or receive an optical signal and provided with an optical wave-guide having an input section and an output section of a optical signal at opposite ends thereof; and at least a pair of optical elements composed of a light emitting device with a light emitting section thereof facing the input section and a photo detecting device with a photo detecting section thereof facing the output section are provided and the micro interconnect circuit section and the optical interconnect circuit section are mounted on the base substrate section.
摘要翻译：传输电光信号，实现高速，高容量的信号传输信号。具有通过印刷电路工艺在绝缘基板上形成的互连层的基底部分; 微型互连电路部分，具有通过半导体工艺在绝缘树脂层上形成的比基底部分的互连层细的微电连接层; 以及光学互连电路部分，其适于传送和/或接收光信号并且设置有光波导，其具有在其相对端的光信号的输入部分和输出部分; 并且至少一对光学元件由其发光部分面向输入部分的发光器件和具有面向输出部分的光电检测部分的光检测器件组成，并且微型互连电路部分和光学器件互连电路部分安装在基底部分上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式