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    • 7. 发明申请
    • Biosensor Chip and Biosensor Chip Production Method
    • 生物传感器芯片和生物传感器芯片生产方法
    • US20090020420A1
    • 2009-01-22
    • US11921166
    • 2006-10-16
    • Takahiko KitamuraToshifumi HosoyaShingo KaimoriMoriyasu IchinoHideaki NakamuraIsao KarubeMasao GotohTomoko Ishikawa
    • Takahiko KitamuraToshifumi HosoyaShingo KaimoriMoriyasu IchinoHideaki NakamuraIsao KarubeMasao GotohTomoko Ishikawa
    • G01N27/327B05D5/00
    • C12Q1/002
    • It is intended to provide a biosensor chip capable of rapid and correct measurement, including a reaction chamber that enables a measurement of a very small amount of a measurement sample and has a small capacity and potassium ferricyanide having a very small crystal particle size disposed in the reaction chamber.In a biosensor chip 1, electrodes 3 and 4 are disposed on the lower substrate 2, and lower spacer 5 (7 and 8) is adhered on the electrodes 3 and 4. An upper spacer 11 (12 and 13) is adhered to an upper substrate 15, and a lower spacer 5 is attached to the upper spacer 11 by and adhesive agent 10. A lower groove 9 is formed between long and short lower spacers 7 and 8, and an upper groove 14 is formed between long and short spacers 12 and 13, so that a reaction chamber 17 is formed by the upper and lower grooves 9 and 14. A capacity of the reaction chamber is 0.3 μL, and an enzyme 18 and potassium ferricyanide are disposed in the reaction chamber 17 in such a fashion as to oppose to each other with a gap being defined therebetween. A crystal particle diameter of the potassium ferricyanide is 100 μm or less, and amount of the potassium ferricyanide is V×0.1 mg or more when the capacity of the reaction chamber 17 is V.
    • 旨在提供能够快速且正确测量的生物传感器芯片,其包括能够测量非常少量的测量样品并且具有小容量的反应室和具有非常小的晶粒度的铁氰化钾 反应室。 在生物传感器芯片1中,电极3和4设置在下基板2上,下隔片5(7和8)粘附在电极3和4上。上间隔件11(12和13) 基板15和下隔板5通过粘合剂10附接到上间隔件11.下槽9形成在长和短下隔板7和8之间,并且上槽14形成在长间隔件12和短间隔件12之间 和13,使得反应室17由上下槽9和14形成。反应室的容量为0.3微米,酶18和铁氰化钾以如下方式设置在反应室17中: 彼此相对,在其间限定间隙。 当反应室17的容量为V时,铁氰化钾的晶粒直径为100μm以下,铁氰化钾的量为Vx0.1mg以上。
    • 8. 发明申请
    • Sensor Chip and Sensor System
    • 传感器芯片和传感器系统
    • US20090123335A1
    • 2009-05-14
    • US11885945
    • 2006-10-25
    • Hideaki NakamuraMasao GotohTomoko IshikawaIsao KarubeToshifumi HosoyaShingo KaimoriMoriyasu Ichino
    • Hideaki NakamuraMasao GotohTomoko IshikawaIsao KarubeToshifumi HosoyaShingo KaimoriMoriyasu Ichino
    • G01N31/22
    • C12Q1/001G01N27/3272G01N33/5438
    • It is intended to provide a sensor chip that enables detection of a deterioration state of a reagent applied on a reaction portion when measuring a concentration of a measurement object substance and a sensor system that enables a correct measurement by using the sensor chip for detecting the reagent deterioration state. A sensor chip including two substrates opposed to each other, a spacer layer sandwiched between the substrates, a multiple reaction portions provided in the spacer layer, and detection electrode units disposed on surfaces of the substrates facing to the spacer layer and exposed to the reaction portions, wherein an identical reagent A is applied on two or more of the reaction portions, and another reagent B that reacts with the reagent A is applied on at least one of the two reaction portions and a sensor system including the sensor chip and a measurement unit for comparing current values from the two or more reaction portions on which the identical reagent A is applied.
    • 本发明旨在提供一种传感器芯片,其能够检测在测量对象物质的浓度的反应部分上施加的试剂的劣化状态,以及能够通过使用用于检测试剂的传感器芯片进行正确测量的传感器系统 劣化状态。 一种传感器芯片,包括彼此相对的两个基板,夹在基板之间的间隔层,设置在间隔层中的多个反作用部分和设置在面向间隔层的基板的表面上并暴露于反应部分的检测电极单元 其中相同的试剂A施加在两个或更多个反应部分上,另一个与试剂A反应的试剂B施加在两个反应部分中的至少一个上,以及包括传感器芯片和测量单元的传感器系统 用于比较来自施加相同试剂A的两个或更多个反应部分的电流值。
    • 10. 发明申请
    • Sensor Chip and Manufacturing Method Thereof
    • 传感器芯片及其制造方法
    • US20080248457A1
    • 2008-10-09
    • US11630475
    • 2005-06-21
    • Toshifumi HosoyaShingo KaimoriMoriyasu IchinoIsao KarubeMasao GotohHideaki NakamuraFumiyo KurusuTomoko Ishikawa
    • Toshifumi HosoyaShingo KaimoriMoriyasu IchinoIsao KarubeMasao GotohHideaki NakamuraFumiyo KurusuTomoko Ishikawa
    • C12Q1/00
    • G01N27/26
    • Provided are a sensor chip and a manufacturing method of this sensor chip, that includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, and a hollow reaction section between the substrate and the cover layer, wherein warping due to changes in the environmental temperature and humidity does not occur.A sensor chip is provided including: a substrate; a cover layer; a spacer layer sandwiched between the substrate and the cover layer; a hollow reaction section provided between the substrate and the cover layer; and a detection section provided in the hollow reaction section, wherein the substrate and the cover layer are made of the same material and have the same thickness, and a material and a shape of the spacer layer are symmetrical with respect to a plane which is parallel to the substrate and located at equal distances from the substrate and from the cover layer, and a manufacturing method of the sensor chip is provided.
    • 提供了一种传感器芯片和该传感器芯片的制造方法,其包括基板,覆盖层,夹在基板和覆盖层之间的间隔层,以及基板和覆盖层之间的中空反应部,其中翘曲 由于环境温度和湿度的变化不会发生。 提供一种传感器芯片,包括:基板; 覆盖层; 夹在基板和覆盖层之间的间隔层; 设置在所述基板和所述覆盖层之间的中空反应部; 以及设置在所述中空反应部中的检测部,其中所述基板和所述覆盖层由相同的材料制成并且具有相同的厚度,并且所述间隔层的材料和形状相对于平行的平面对称 并且设置在距离基板和覆盖层相等的距离处,并且提供了传感器芯片的制造方法。