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    • 9. 发明申请
    • Sensor Chip and Sensor Chip Production Method
    • 传感器芯片和传感器芯片生产方法
    • US20090257917A1
    • 2009-10-15
    • US12083694
    • 2006-10-16
    • Hideaki NakamuraMasao GotohTomoko IshikawaIsao KarubeToshifumi HosoyaShingo KaimoriMoriyasu Ichino
    • Hideaki NakamuraMasao GotohTomoko IshikawaIsao KarubeToshifumi HosoyaShingo KaimoriMoriyasu Ichino
    • B01J19/00B32B37/00
    • G01N27/3271Y10T156/1051
    • It is intended to provide a sensor chip which has a small size and is easily produced and capable of determining quantities of at least two components of multiple samples rapidly, conveniently, and correctly as well as to provide a production method capable of producing the sensor chip easily and with high productivity.A sensor chip includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, multiple reaction portions disposed between the substrate and the cover layer, multiple detection units exposed in the hollow reaction portions, and a sample inlet communicated with the hollow reaction portions and a method for producing the sensor chip.A sensor chip includes two substrates opposed to each other, a spacer layer sandwiched between the substrates, and multiple measurement units disposed between the substrates and including two or more hollow reaction portions that share one sample inlet opened on outer surfaces of the substrates and detection electrode units respectively exposed in the hollow reaction portions and a method for producing the sensor chip.
    • 本发明旨在提供一种具有体积小且容易制造且能够快速,方便和正确地确定多个样品的至少两个组分的量的传感器芯片,以及提供能够生产传感器芯片的制造方法 容易和高生产力。 传感器芯片包括衬底,覆盖层,夹在衬底和覆盖层之间的间隔层,设置在衬底和覆盖层之间的多个反应部分,暴露在中空反应部分中的多个检测单元和连通的样品入口 中空反应部分和传感器芯片的制造方法。 传感器芯片包括彼此相对的两个基板,夹在基板之间的间隔层和设置在基板之间的多个测量单元,并且包括两个或更多个中空反应部分,其共享在基板的外表面上开放的一个样品入口和检测电极 分别暴露在中空反应部分中的单元和传感器芯片的制造方法。