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1. 发明申请

US20090050986A1 Method for Fabricating Sensor Chip, and Sensor Chip 审中-公开
标题翻译：制造传感器芯片和传感器芯片的方法
公开(公告)号：US20090050986A1
公开(公告)日：2009-02-26
申请号：US11795903
申请日：2006-01-23
申请人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
发明人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
IPC分类号： H01L29/00 , H01L21/50
CPC分类号： B01J19/0046 , B01J2219/00518 , B01J2219/00527 , B01J2219/00533 , B01J2219/00621 , B01J2219/00657 , B01J2219/0072 , B01J2219/00725
摘要： A method for fabricating a sensor chip having a substrate, a cover layer, a spacer layer interposed between the substrate and the cover layer, and a hollow reaction section provided in the spacer layer, the method comprising the steps of: affixing two or more adhesive or bonding tapes onto a sheet where a plurality of substrates are to be formed or onto a plurality of substrates, to thus form a spacer layer; and forming a hollow reaction section from one or a plurality of gaps between the tapes, whereby volumetric variations or positional displacements of the hollow reaction section can be reduced. A sensor chip which can be fabricated by this method.
摘要翻译：一种用于制造具有衬底，覆盖层，插入在衬底和覆盖层之间的间隔层的传感器芯片的方法和设置在间隔层中的中空反应部分，该方法包括以下步骤：将两个或更多个粘合剂或将带粘合到要形成多个基底的片上或多个基底上，从而形成间隔层; 并且从带之间的一个或多个间隙形成中空反应部分，从而可以减小中空反应部分的体积变化或位置位移。可通过该方法制造的传感器芯片。

2. 发明申请

US20080248457A1 Sensor Chip and Manufacturing Method Thereof 审中-公开
标题翻译：传感器芯片及其制造方法
公开(公告)号：US20080248457A1
公开(公告)日：2008-10-09
申请号：US11630475
申请日：2005-06-21
申请人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Isao Karube , Masao Gotoh , Hideaki Nakamura , Fumiyo Kurusu , Tomoko Ishikawa
发明人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Isao Karube , Masao Gotoh , Hideaki Nakamura , Fumiyo Kurusu , Tomoko Ishikawa
IPC分类号： C12Q1/00
CPC分类号： G01N27/26
摘要： Provided are a sensor chip and a manufacturing method of this sensor chip, that includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, and a hollow reaction section between the substrate and the cover layer, wherein warping due to changes in the environmental temperature and humidity does not occur.A sensor chip is provided including: a substrate; a cover layer; a spacer layer sandwiched between the substrate and the cover layer; a hollow reaction section provided between the substrate and the cover layer; and a detection section provided in the hollow reaction section, wherein the substrate and the cover layer are made of the same material and have the same thickness, and a material and a shape of the spacer layer are symmetrical with respect to a plane which is parallel to the substrate and located at equal distances from the substrate and from the cover layer, and a manufacturing method of the sensor chip is provided.
摘要翻译：提供了一种传感器芯片和该传感器芯片的制造方法，其包括基板，覆盖层，夹在基板和覆盖层之间的间隔层，以及基板和覆盖层之间的中空反应部，其中翘曲由于环境温度和湿度的变化不会发生。提供一种传感器芯片，包括：基板; 覆盖层; 夹在基板和覆盖层之间的间隔层; 设置在所述基板和所述覆盖层之间的中空反应部; 以及设置在所述中空反应部中的检测部，其中所述基板和所述覆盖层由相同的材料制成并且具有相同的厚度，并且所述间隔层的材料和形状相对于平行的平面对称并且设置在距离基板和覆盖层相等的距离处，并且提供了传感器芯片的制造方法。

3. 发明申请

US20090053105A1 Sensor Chip 审中-公开
标题翻译：传感器芯片
公开(公告)号：US20090053105A1
公开(公告)日：2009-02-26
申请号：US11795893
申请日：2006-01-23
申请人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
发明人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
IPC分类号： B01J19/00
CPC分类号： G01N33/54373 , B01L3/502707 , B01L2300/0645 , B01L2300/0822 , B01L2300/168
摘要： There is provided a sensor chip including: a base plate; a cover layer; a hollow reaction portion provided between the base plate and the cover layer, in which a reaction is performed between a sample and a reagent applied thereinto; a sensing member constructed of an electrode which is exposed to the hollow reaction portion; and a sample inlet for conducting the sample to the hollow reaction portion, wherein entire portions of the base plate and the cover layer, which are located opposite to the sensing member provided with the hollow reaction portion, are made transparent. Otherwise, in the above-described sensor chip, a plate A having a groove A to which a reagent has been applied and a plate B having a groove B are stacked on each other in such a manner that the groove A is coupled with the groove B, so that the hollow reaction portion is formed; and an opening width of the groove B is larger than an opening width of the groove A at a portion of the groove B which is located opposite to a portion with the groove A, to which the reagent has been applied.
摘要翻译：提供了一种传感器芯片，包括：基板; 覆盖层; 设置在基板和覆盖层之间的中空反应部分，其中在样品和施加于其之间的试剂之间进行反应; 由暴露于中空反应部分的电极构成的传感部件; 以及用于将样品导引到中空反应部分的样品入口，其中与设置有中空反应部分的感测构件相对的基板和覆盖层的整个部分被制成透明的。另外，在上述传感器芯片中，将具有涂敷有试剂的槽A的板A和具有槽B的板B彼此堆叠，使得槽A与槽 B，形成中空反应部分; 并且槽B的开口宽度大于槽B的与已经施加有试剂的部分的与槽A相对的部分处的槽A的开口宽度。

4. 发明申请

US20080129280A1 Coupled Member Made of a Plurality of Sensor Chips and Manufacturing Method Thereof 审中-公开
标题翻译：传感器芯片制造的耦合构件及其制造方法
公开(公告)号：US20080129280A1
公开(公告)日：2008-06-05
申请号：US11795902
申请日：2006-01-23
申请人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
发明人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
IPC分类号： G01N27/327
CPC分类号： B82Y5/00 , G01N33/4875 , Y10T29/49002
摘要： A coupled member made of a plurality of sensor chips is featured by that adjacent sensor chips are coupled to each other under cuttable condition; the respective sensor chips can be cut and piece-separated from the coupled member in a higher efficiency; and even after the sensor chips are piece-separated, these sensor chips can be readily and quickly stored in containers thereof; and furthermore, the sensor chips can be easily checked and failure chips can be readily removed. More specifically, a method for manufacturing a coupled member made of the plurality of sensor chips is provided in which such sensor chips are coupled to each other under cuttable conditions, while each of these sensor chips includes: a base plate; a cover layer; a hollow reaction portion provided between the base plate and the cover layer; a sensing member provided in the hollow reaction portion; an output terminal for outputting a signal sensed by the sensing member to the outside; and a sample introducing port for introducing a sample to the hollow reaction portion.
摘要翻译：由多个传感器芯片制成的耦合构件的特征在于相邻的传感器芯片在可切割的状态下彼此耦合; 相应的传感器芯片可以以更高的效率从耦合部件切割和分离; 并且即使在传感器芯片被分离之后，这些传感器芯片也可以容易且快速地存储在容器中; 此外，可以容易地检测传感器芯片，并且可以容易地去除故障芯片。更具体地说，提供了一种用于制造由多个传感器芯片制成的耦合构件的方法，其中这些传感器芯片在可切割的条件下彼此耦合，而这些传感器芯片中的每一个包括：基板; 覆盖层; 设置在所述基板和所述覆盖层之间的中空反应部; 设置在所述中空反应部中的检测部件; 输出端子，用于将由感测构件感测的信号输出到外部; 以及用于将样品引入中空反应部的样品引入口。

5. 发明申请

US20090123335A1 Sensor Chip and Sensor System 审中-公开
标题翻译：传感器芯片和传感器系统
公开(公告)号：US20090123335A1
公开(公告)日：2009-05-14
申请号：US11885945
申请日：2006-10-25
申请人： Hideaki Nakamura , Masao Gotoh , Tomoko Ishikawa , Isao Karube , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino
发明人： Hideaki Nakamura , Masao Gotoh , Tomoko Ishikawa , Isao Karube , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino
IPC分类号： G01N31/22
CPC分类号： C12Q1/001 , G01N27/3272 , G01N33/5438
摘要： It is intended to provide a sensor chip that enables detection of a deterioration state of a reagent applied on a reaction portion when measuring a concentration of a measurement object substance and a sensor system that enables a correct measurement by using the sensor chip for detecting the reagent deterioration state. A sensor chip including two substrates opposed to each other, a spacer layer sandwiched between the substrates, a multiple reaction portions provided in the spacer layer, and detection electrode units disposed on surfaces of the substrates facing to the spacer layer and exposed to the reaction portions, wherein an identical reagent A is applied on two or more of the reaction portions, and another reagent B that reacts with the reagent A is applied on at least one of the two reaction portions and a sensor system including the sensor chip and a measurement unit for comparing current values from the two or more reaction portions on which the identical reagent A is applied.
摘要翻译：本发明旨在提供一种传感器芯片，其能够检测在测量对象物质的浓度的反应部分上施加的试剂的劣化状态，以及能够通过使用用于检测试剂的传感器芯片进行正确测量的传感器系统劣化状态。一种传感器芯片，包括彼此相对的两个基板，夹在基板之间的间隔层，设置在间隔层中的多个反作用部分和设置在面向间隔层的基板的表面上并暴露于反应部分的检测电极单元其中相同的试剂A施加在两个或更多个反应部分上，另一个与试剂A反应的试剂B施加在两个反应部分中的至少一个上，以及包括传感器芯片和测量单元的传感器系统用于比较来自施加相同试剂A的两个或更多个反应部分的电流值。

6. 发明申请

US20090257917A1 Sensor Chip and Sensor Chip Production Method 审中-公开
标题翻译：传感器芯片和传感器芯片生产方法
公开(公告)号：US20090257917A1
公开(公告)日：2009-10-15
申请号：US12083694
申请日：2006-10-16
申请人： Hideaki Nakamura , Masao Gotoh , Tomoko Ishikawa , Isao Karube , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino
发明人： Hideaki Nakamura , Masao Gotoh , Tomoko Ishikawa , Isao Karube , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino
IPC分类号： B01J19/00 , B32B37/00
CPC分类号： G01N27/3271 , Y10T156/1051
摘要： It is intended to provide a sensor chip which has a small size and is easily produced and capable of determining quantities of at least two components of multiple samples rapidly, conveniently, and correctly as well as to provide a production method capable of producing the sensor chip easily and with high productivity.A sensor chip includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, multiple reaction portions disposed between the substrate and the cover layer, multiple detection units exposed in the hollow reaction portions, and a sample inlet communicated with the hollow reaction portions and a method for producing the sensor chip.A sensor chip includes two substrates opposed to each other, a spacer layer sandwiched between the substrates, and multiple measurement units disposed between the substrates and including two or more hollow reaction portions that share one sample inlet opened on outer surfaces of the substrates and detection electrode units respectively exposed in the hollow reaction portions and a method for producing the sensor chip.
摘要翻译：本发明旨在提供一种具有体积小且容易制造且能够快速，方便和正确地确定多个样品的至少两个组分的量的传感器芯片，以及提供能够生产传感器芯片的制造方法容易和高生产力。传感器芯片包括衬底，覆盖层，夹在衬底和覆盖层之间的间隔层，设置在衬底和覆盖层之间的多个反应部分，暴露在中空反应部分中的多个检测单元和连通的样品入口中空反应部分和传感器芯片的制造方法。传感器芯片包括彼此相对的两个基板，夹在基板之间的间隔层和设置在基板之间的多个测量单元，并且包括两个或更多个中空反应部分，其共享在基板的外表面上开放的一个样品入口和检测电极分别暴露在中空反应部分中的单元和传感器芯片的制造方法。

7. 发明申请

US20090152127A1 Biosensor Measurement Machine , Biosensor Measurement System and Biosensor Measurement Method 有权
标题翻译：生物传感器测量机，生物传感器测量系统和生物传感器测量方法
公开(公告)号：US20090152127A1
公开(公告)日：2009-06-18
申请号：US11992102
申请日：2006-09-08
申请人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Takahiko Kitamura , Isao Karube , Masao Gotoh , Hideaki Nakamura , Tomoko Ishikawa
发明人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Takahiko Kitamura , Isao Karube , Masao Gotoh , Hideaki Nakamura , Tomoko Ishikawa
IPC分类号： G01N27/327 , G01N27/26 , G01N27/04 , G01N27/416
CPC分类号： G01N27/3273
摘要： Provided are a biosensor chip measurement machine that can obtain accurate measurement results within a short period of time by employing only a tiny amount as a sample, and a measurement method therefor.A biosensor measurement machine 20 includes a power source 21, which is connected to a voltage regulator 22, a measurement instrument 23, and a controller 24 for supplying power. When a biosensor chip 1 is connected to the biosensor measurement machine 20 and a voltage is applied, the measurement instrument begins the measurement of a current value for a biosensor. When a measured current value or a measured charge value is greater than a reference value, the measurement is ended in accordance with an instruction issued by the controller 24, and when the value is smaller than the reference value, the measurement is continued in accordance with a controller instruction.
摘要翻译：提供一种生物传感器芯片测量机，其可以通过仅使用微量作为样品而在短时间内获得准确的测量结果及其测量方法。生物传感器测量机20包括连接到电压调节器22的电源21，测量仪器23和用于供电的控制器24。当生物传感器芯片1连接到生物传感器测量机20并施加电压时，测量仪器开始测量生物传感器的当前值。当测量的电流值或测量的电荷值大于参考值时，根据控制器24发出的指令结束测量，并且当该值小于参考值时，根据控制器指令。

8. 发明申请

US20090020420A1 Biosensor Chip and Biosensor Chip Production Method 审中-公开
标题翻译：生物传感器芯片和生物传感器芯片生产方法
公开(公告)号：US20090020420A1
公开(公告)日：2009-01-22
申请号：US11921166
申请日：2006-10-16
申请人： Takahiko Kitamura , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Hideaki Nakamura , Isao Karube , Masao Gotoh , Tomoko Ishikawa
发明人： Takahiko Kitamura , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Hideaki Nakamura , Isao Karube , Masao Gotoh , Tomoko Ishikawa
IPC分类号： G01N27/327 , B05D5/00
CPC分类号： C12Q1/002
摘要： It is intended to provide a biosensor chip capable of rapid and correct measurement, including a reaction chamber that enables a measurement of a very small amount of a measurement sample and has a small capacity and potassium ferricyanide having a very small crystal particle size disposed in the reaction chamber.In a biosensor chip 1, electrodes 3 and 4 are disposed on the lower substrate 2, and lower spacer 5 (7 and 8) is adhered on the electrodes 3 and 4. An upper spacer 11 (12 and 13) is adhered to an upper substrate 15, and a lower spacer 5 is attached to the upper spacer 11 by and adhesive agent 10. A lower groove 9 is formed between long and short lower spacers 7 and 8, and an upper groove 14 is formed between long and short spacers 12 and 13, so that a reaction chamber 17 is formed by the upper and lower grooves 9 and 14. A capacity of the reaction chamber is 0.3 μL, and an enzyme 18 and potassium ferricyanide are disposed in the reaction chamber 17 in such a fashion as to oppose to each other with a gap being defined therebetween. A crystal particle diameter of the potassium ferricyanide is 100 μm or less, and amount of the potassium ferricyanide is V×0.1 mg or more when the capacity of the reaction chamber 17 is V.
摘要翻译：旨在提供能够快速且正确测量的生物传感器芯片，其包括能够测量非常少量的测量样品并且具有小容量的反应室和具有非常小的晶粒度的铁氰化钾反应室。在生物传感器芯片1中，电极3和4设置在下基板2上，下隔片5（7和8）粘附在电极3和4上。上间隔件11（12和13）基板15和下隔板5通过粘合剂10附接到上间隔件11.下槽9形成在长和短下隔板7和8之间，并且上槽14形成在长间隔件12和短间隔件12之间和13，使得反应室17由上下槽9和14形成。反应室的容量为0.3微米，酶18和铁氰化钾以如下方式设置在反应室17中：彼此相对，在其间限定间隙。当反应室17的容量为V时，铁氰化钾的晶粒直径为100μm以下，铁氰化钾的量为Vx0.1mg以上。

9. 发明授权

US08282813B2 Biosensor measurement machine, biosensor measurement system and biosensor measurement method 有权
标题翻译：生物传感器测量机，生物传感器测量系统和生物传感器测量方法
公开(公告)号：US08282813B2
公开(公告)日：2012-10-09
申请号：US11992102
申请日：2006-09-08
申请人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Takahiko Kitamura , Isao Karube , Masao Gotoh , Hideaki Nakamura , Tomoko Ishikawa
发明人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Takahiko Kitamura , Isao Karube , Masao Gotoh , Hideaki Nakamura , Tomoko Ishikawa
IPC分类号： G01N27/416
CPC分类号： G01N27/3273
摘要： A biosensor measurement device for providing accurate measurement results within a short period of time by using only a very small amount of sample. The biosensor measurement device includes a power source, which is connected to a voltage regulator, a measurement instrument, and a controller for supplying power. When the biosensor chip is connected to the biosensor measurement device and a voltage is applied, the measurement instrument begins the measurement of a current value for the biosensor. When the measured current value or a measured charge value is greater than a reference value, the measurement is terminated in accordance with an instruction issued by the controller, and when the value is smaller than the reference value, the measurement is continued in accordance with a controller instruction.
摘要翻译：一种生物传感器测量装置，其通过仅使用非常少量的样品在短时间内提供精确的测量结果。生物传感器测量装置包括连接到电压调节器的电源，测量仪器和用于供电的控制器。当生物传感器芯片连接到生物传感器测量装置并施加电压时，测量仪器开始测量生物传感器的当前值。当测量的电流值或测量的电荷值大于参考值时，根据控制器发出的指令来终止测量，并且当该值小于参考值时，根据a 控制器指令。

10. 外观设计

USD548347S1 Device for measuring constituents in the blood 有权
标题翻译：用于测量血液中成分的装置
公开(公告)号：USD548347S1
公开(公告)日：2007-08-07
申请号：US29253418
申请日：2006-02-07
申请人： Moriyasu Ichino , Toshifumi Hosoya , Kazuhiro Kuwa , Nobuyuki Matsumura , Isao Karube , Masao Gotoh , Hideaki Nakamura , Tomoko Ishikawa
设计人： Moriyasu Ichino , Toshifumi Hosoya , Kazuhiro Kuwa , Nobuyuki Matsumura , Isao Karube , Masao Gotoh , Hideaki Nakamura , Tomoko Ishikawa

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