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1. 发明授权

US6033787A Ceramic circuit board with heat sink 失效
标题翻译：陶瓷电路板带散热片
公开(公告)号：US6033787A
公开(公告)日：2000-03-07
申请号：US916258
申请日：1997-08-22
申请人： Toshiyuki Nagase , Yoshirou Kuromitsu , Kunio Sugamura , Yoshio Kanda , Masafumi Hatsushika , Masato Otsuki
发明人： Toshiyuki Nagase , Yoshirou Kuromitsu , Kunio Sugamura , Yoshio Kanda , Masafumi Hatsushika , Masato Otsuki
IPC分类号： B32B15/04 , H01L23/15 , H01L23/373 , H05K1/03 , H05K3/00 , H05K3/38 , B22F3/00 , H01L23/10
CPC分类号： H05K3/0061 , B32B15/04 , H01L23/15 , H01L23/373 , H01L2924/0002 , H05K1/0306 , H05K2201/0355 , H05K3/38 , Y10T428/12007 , Y10T428/12493 , Y10T428/12576 , Y10T428/24926
摘要： A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.
摘要翻译：具有散热片的陶瓷电路板，其热循环寿命长。第一和第二铝板分别通过Al-Si基钎焊焊料层压并结合到陶瓷衬底的两侧。将由AlSiC基复合材料形成的散热片层叠并结合到第一铝板的表面上。陶瓷基板由AlN，Si3N4或Al2O3形成。散热器中的Al合金的Al纯度为80-99重量％，第一或第二铝板的Al纯度不低于99.98重量％。通过散热器中的Al合金将散热片层压并结合到第一铝板上。

2. 发明授权

US06872115B2 Blade with comb teeth coated with a compound layer for forming ribs and its production method 失效
标题翻译：带梳齿的刀片涂有复合层，用于形成肋条及其制造方法
公开(公告)号：US06872115B2
公开(公告)日：2005-03-29
申请号：US10252361
申请日：2002-09-24
申请人： Hideaki Sakurai , Kunio Sugamura , Yoshio Kanda , Ryuji Uesugi , Yoshirou Kuromitsu , Young Cheul Kang , Eun Gi Heo , Young Soo Seo , Seung Jae Chung , Joon Min Kim , Hyun Sub Lee
发明人： Hideaki Sakurai , Kunio Sugamura , Yoshio Kanda , Ryuji Uesugi , Yoshirou Kuromitsu , Young Cheul Kang , Eun Gi Heo , Young Soo Seo , Seung Jae Chung , Joon Min Kim , Hyun Sub Lee
IPC分类号： H01J9/02 , B29C59/02 , H01J9/24 , H01J11/22 , H01J11/34 , H01J11/36 , H01J9/06
CPC分类号： H01J9/242 , B29C59/026 , B29C2059/027 , B29K2995/0087 , H01J2211/36
摘要： One object of the present invention is to provide a blade for forming ribs that is able to improve wear resistance; in order to achieve the object, the present invention provide a blade for forming ribs that forms ribs either on the surface of a substrate or via an undercoating layer on the surface of a substrate by moving a blade body in a fixed direction relative to a paste film in the state in which comb teeth formed on at least a portion of the periphery of said blade body are penetrated into said paste film formed on the surface of said substrate to plasticly deform said paste film; wherein, the surface of said comb teeth formed on said blade body that makes contact with said paste film is coated with a compound layer in which hard particles are dispersed in a metal.
摘要翻译：本发明的一个目的是提供一种用于形成能够改善耐磨性的肋的刀片; 为了实现该目的，本发明提供了一种用于形成肋的刀片，所述刀片在衬底的表面上或通过基板表面上的底涂层形成肋，所述刀片相对于糊料沿固定方向移动刀片体在形成在所述刀片主体的周边的至少一部分上的梳齿穿入所述基板的表面上形成的所述膏膜的状态下，使所述膏膜塑性变形的膜; 其特征在于，形成在所述刀片体上与所述糊状物膜接触的所述梳齿的表面涂覆有硬质粒子分散在金属中的化合物层。

3. 发明授权

US5096768A Substrate used for fabrication of thick film circuit 失效
标题翻译：用于制造厚膜电路的基板
公开(公告)号：US5096768A
公开(公告)日：1992-03-17
申请号：US474904
申请日：1990-02-05
申请人： Yoshirou Kuromitsu , Hideaki Yoshida , Toshiyuki Nagase , Hiroto Uchida , Tadaharu Tanaka , Yoshio Kanda , Kenji Morinaga
发明人： Yoshirou Kuromitsu , Hideaki Yoshida , Toshiyuki Nagase , Hiroto Uchida , Tadaharu Tanaka , Yoshio Kanda , Kenji Morinaga
IPC分类号： H01L23/15 , H01L23/31
CPC分类号： H01L23/3135 , H01L23/15 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L24/45 , H01L24/48 , H01L2924/01014 , H01L2924/0102 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , Y10S428/901 , Y10T428/24917
摘要： An insulating substrate is used for fabrication of a thick film circuit and comprises a foundation of aluminum nitride and a surface film structure provided on the foundation, in which the foundation contains at least one oxidizing agent selected from the group consisting of an yttrium oxide and a calcium oxide ranging from 0.1% to 10% by weight for enhancing a stiffness of the foundation, and in which the surface film structure is of the multi-level surface film structure having a lower surface film of an aluminum oxide rapidly grown on the foundation in the presence of the oxidizing agent and an upper surface film containing a silicon oxide and a substance selected from the group consisting of a zirconium oxide, a titanium oxide and a boron oxide for enhancing the resistivity against a firing operation.

4. 发明授权

US5087509A Substrate used for fabrication of thick film circuit 失效
公开(公告)号：US5087509A
公开(公告)日：1992-02-11
申请号：US524936
申请日：1990-05-18
申请人： Yoshirou Kuromitsu , Hideaki Yoshida , Toshiyuki Nagase , Tadaharu Tanaka , Yoshio Kanda
发明人： Yoshirou Kuromitsu , Hideaki Yoshida , Toshiyuki Nagase , Tadaharu Tanaka , Yoshio Kanda
IPC分类号： H01L23/15 , H01L25/16 , H05K3/38
CPC分类号： H01L23/15 , H01L25/16 , H05K3/38 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/19105 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926
摘要： An insulating substrate is used for fabrication of a thick film circuit provided with a conductive pattern made from a paste containing glass frits, and comprises a foundation containing an aluminum nitride and incidental impurities, and a multi-level surface film structure provided between the foundation and the conductive pattern and having a lower surface film of an aluminum oxide provided on a surface of the foundation, an intermediate surface film provided on the lower surface film and formed of a substance having a relatively small acidity and an upper surface film provided on the intermediate surface film and formed of a substance having a relatively large acidity, in which the substance with the large acidity rapidly reacts with the frits in a firing stage for enhancing the adhesion of the conductive pattern but the substance with the relatively small acidity restricts the consumption thereof, so that the total thickness of the multi-level film structure is decrased and, accordingly, the heat radiation capability is improved.

5. 发明授权

US5675474A Highly heat-radiating ceramic package 失效
标题翻译：高散热陶瓷包装
公开(公告)号：US5675474A
公开(公告)日：1997-10-07
申请号：US503243
申请日：1995-07-17
申请人： Toshiyuki Nagase , Yoshio Kanda , Yoshiro Kuromitu , Masafumi Hatsushika , Hirokazu Tanaka
发明人： Toshiyuki Nagase , Yoshio Kanda , Yoshiro Kuromitu , Masafumi Hatsushika , Hirokazu Tanaka
IPC分类号： H01L23/367 , H01L23/373 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/3675 , H01L23/3677 , H01L23/3735 , H01L2023/405 , H01L2023/4056 , H01L2224/32188 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01012 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/16195
摘要： Highly heat-radiating ceramic packages comprising a multi-layer ceramic wiring board 11 to one surface of which is bonded a heat-radiating ceramic base plate 13 with first and second aluminum plates 31 and 32 bonded to both surfaces thereof, via the first aluminum plate 31 are free from warping and cracking, and have improved heat-radiation performance and lower weight and manufacturing cost. The ceramic base plate 13 and the multi-layer ceramic wiring board 11 may be constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide. The two aluminum plates 31 and 32 are bonded to the ceramic base plate 13 with an Al-Si brazing material. Improved levels of heat radiation performance are accomplished by bonding a heat-radiating ceramic base plate with an aluminum plate bonded thereto, to a multi-layer wiring board prepared even by low-temperature sintering.
摘要翻译：高散热陶瓷封装包括多层陶瓷布线板11，其一面被散热陶瓷基板13与第一和第二铝板31和32通过第一铝板 31没有翘曲和开裂，并且具有改善的散热性能和更低的重量和制造成本。陶瓷基板13和多层陶瓷布线板11可以由选自氧化铝，玻璃陶瓷，氮化铝，莫来石和碳化硅的相同或不同类型的陶瓷构成。两个铝板31和32用Al-Si钎焊材料结合到陶瓷基板13上。散热性能的提高通过将散热陶瓷基板与其上粘接的铝板接合到甚至通过低温烧结制备的多层布线板来实现。

6. 发明授权

US5143612A Hollow fiber filter module 失效
标题翻译：中空纤维过滤器模块
公开(公告)号：US5143612A
公开(公告)日：1992-09-01
申请号：US774980
申请日：1991-10-15
申请人： Katsuhiko Hamanaka , Yoshio Kanda
发明人： Katsuhiko Hamanaka , Yoshio Kanda
IPC分类号： B01D63/02 , B01D65/00
CPC分类号： B01D65/00 , B01D63/02 , B01D2313/08 , B01D2313/20
摘要： Disclosed is a hollow fiber filter module comprising a cylindrical casing having a liquid introducing nozzle at least at one end portion thereof and having a bundle of hollow fibers disposed in the casing, and wherein one end portion of the bundle is enclosed by a hollow, liquid flow control member, and the liquid introducing nozzle has a specific unique structure in which the inlet opening has a larger diameter than that of the hollow of the nozzle at any portion thereof. This hollow fiber filter module can advantageously be used in the so-called external pressure type filtration on a large scale. By the use of this filter module, the external pressure type filtration of a liquid can advantageously be stably performed for a prolonged period of time with a high filtration efficiency.
摘要翻译：本发明公开了一种中空纤维过滤器模块，其包括在至少其一个端部处具有液体引入喷嘴的圆柱形壳体，并且具有设置在壳体中的一束中空纤维，并且其中束的一个端部被中空液体流动控制构件，并且液体引入喷嘴具有特定的唯一结构，其中入口开口的直径大于其任何部分处的喷嘴中空部的直径。该中空纤维过滤器模块可以有利地用于大规模的所谓的外部压力型过滤。通过使用该过滤器模块，液体的外部压力型过滤可以有利地以较高的过滤效率稳定地进行长时间。

7. 发明授权

US5124311A Structure of ceramic superconductive wiring and process of fabrication thereof 失效
标题翻译：陶瓷超导布线结构及其制造工艺
公开(公告)号：US5124311A
公开(公告)日：1992-06-23
申请号：US362466
申请日：1989-05-30
申请人： Satoru Mori , Hideaki Yoshida , Takuo Takeshita , Yoshio Kanda
发明人： Satoru Mori , Hideaki Yoshida , Takuo Takeshita , Yoshio Kanda
IPC分类号： H01L23/498 , H01L39/24
CPC分类号： H01L39/247 , H01L23/49888 , H01L2924/0002 , Y10S428/901 , Y10S428/93 , Y10S505/701 , Y10S505/702 , Y10S505/703 , Y10S505/704 , Y10T428/24917 , Y10T428/31678 , Y10T428/31692
摘要： There is disclosed the structure of a superconductive wiring fabricated on an insulating substrate comprising a conductive pattern having at least one wiring strip of a superconductive ceramic formed on the insulating substrate and a protective film covering the wiring pattern and formed of a basic oxide, the basic oxide hardly reacts with the superconductive ceramic because of the fact that most of the superconductive ceramics are bases, then the wiring strip is allowed to stay in the superconductive state for a prolonged period of time.

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