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    • 6. 发明授权
    • Apparatus and method for processing substrate
    • 基板处理装置及方法
    • US08864936B2
    • 2014-10-21
    • US12810915
    • 2008-12-10
    • Young Ki HanYoung Soo Seo
    • Young Ki HanYoung Soo Seo
    • C23F1/00H01L21/306C23C16/00H01J37/20H01J37/32
    • H01J37/20H01J37/3244H01J37/32449H01J2237/2002H01J2237/20235
    • There are provided an apparatus and method for processing a substrate. By using the apparatus and method, plasma processing can be individually performed on each of edge and rear regions of a substrate in a single chamber. The apparatus includes a chamber providing a reaction space; a stage installed in the chamber; a plasma shielding unit installed opposite to the stage in the chamber; a support unit for supporting a substrate between the stage and the plasma shielding unit; a first supply pipe provided at the stage to supply a reaction or non-reaction gas to one surface of the substrate; and second and third supply pipes provided at the plasma shielding unit, the second supply pipe supplying a reaction gas to the other surface of the substrate, the third supply pipe supplying a non-reaction gas to the other surface.
    • 提供了一种用于处理基板的装置和方法。 通过使用该装置和方法,可以在单个室中对基板的边缘区域和后部区域各自进行等离子体处理。 该装置包括提供反应空间的室; 安装在室内的舞台; 等离子体屏蔽单元,其安装在所述室中与所述台相对; 支撑单元,用于在所述载物台和所述等离子体屏蔽单元之间支撑基板; 设置在所述阶段以将反应或非反应气体供应到所述基板的一个表面的第一供给管; 以及设置在所述等离子体屏蔽单元处的第二和第三供应管,所述第二供应管向所述基板的另一表面供应反应气体,所述第三供应管向另一表面供应非反应气体。