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    • 1. 发明授权
    • Heat-curable resin composition
    • 热固性树脂组合物
    • US08088856B2
    • 2012-01-03
    • US12617919
    • 2009-11-13
    • Toshio ShiobaraTsutomu KashiwagiYusuke Taguchi
    • Toshio ShiobaraTsutomu KashiwagiYusuke Taguchi
    • C08L83/00C08K3/22C08K3/36C08K3/18C08K3/30
    • C08G59/306C08G59/3245C08G59/42
    • A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).
    • 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分(A)〜(E):(A)在各分子内含有至少一个环氧基的异氰脲酸衍生物,其量为100质量份,(B)有机硅树脂 在各分子内含有至少一个环氧基,其量为10〜1000质量份,(C)酸酐固化剂,其量使得[组分(A)和组分 (C)成分中的(B)/羧基当量]在0.6〜2.2的范围内,(D)固化促进剂的含量为0.05〜5质量份,相对于100质量份 组分(A),(B)和(C)的质量和(E)无机填料的量为每100质量份组分(A),(B )和(C)。
    • 2. 发明申请
    • HEAT-CURABLE RESIN COMPOSITION
    • 热固性树脂组合物
    • US20100125116A1
    • 2010-05-20
    • US12617919
    • 2009-11-13
    • Toshio ShiobaraTsutomu KashiwagiYusuke Taguchi
    • Toshio ShiobaraTsutomu KashiwagiYusuke Taguchi
    • C08L83/00C08K3/22C08K3/36C08K3/18C08K3/30
    • C08G59/306C08G59/3245C08G59/42
    • A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).
    • 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分(A)〜(E):(A)在各分子内含有至少一个环氧基的异氰脲酸衍生物,其量为100质量份,(B)有机硅树脂 在各分子内含有至少一个环氧基,其量为10〜1000质量份,(C)酸酐固化剂,其量使得[组分(A)和组分 (C)成分中的(B)/羧基当量]在0.6〜2.2的范围内,(D)固化促进剂的含量为0.05〜5质量份,相对于100质量份 组分(A),(B)和(C)的质量和(E)无机填料的量为每100质量份组分(A),(B )和(C)。
    • 3. 发明授权
    • Organopolysilmethylene-siloxane and a cured product thereof
    • 有机聚硅氧烷 - 硅氧烷及其固化物
    • US08497024B2
    • 2013-07-30
    • US12860682
    • 2010-08-20
    • Manabu UenoToshio ShiobaraTsutomu Kashiwagi
    • Manabu UenoToshio ShiobaraTsutomu Kashiwagi
    • B32B9/04
    • C08G77/50C08G77/16C08G77/18C08G77/24C08L83/14Y10T428/31663C08L83/00
    • Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.
    • 式(1)的有机聚硅氧烷 - 硅氧烷:其中每个R 1彼此独立地是除烯基,烷氧基,羟基和卤素以外的未取代或取代的碳原子数1〜10的一价烃基 原子; 每个R 2彼此独立地是除烯基,烷氧基,羟基,卤素原子和(R 1)3 SiCH 2 - 以外具有1至10个碳原子的未取代或取代的一价烃基,其中每个R 3 彼此独立地是氢原子和具有1至4个碳原子的烷基; k为1〜100的整数, n为1〜1000的整数。 所述有机聚硅氧烷 - 硅氧烷在分子中具有至少两个烷氧基,羟基和与一个或多个硅原子键合的卤素原子。
    • 6. 发明授权
    • Phosphor-filled curable silicone resin composition and cured product thereof
    • 荧光填充固化性有机硅树脂组合物及其固化物
    • US07705093B2
    • 2010-04-27
    • US11762445
    • 2007-06-13
    • Tsutomu KashiwagiToshio Shiobara
    • Tsutomu KashiwagiToshio Shiobara
    • C08G77/04
    • C08L83/04C08G77/12C08G77/20C08G77/70C08K3/32C08L83/00
    • A phosphor-containing addition-curable silicone resin composition is provided. The composition is capable of forming a cured product which exhibits excellent crack resistance and shock resistance, and minimal surface tackiness. The composition includes (A) an organopolysiloxane including R1SiO1.5 units (T units), R22SiO units (D units), and R3aR4bSiO(4-a-b)/2 units (wherein, R1, R2 and R3 represent a methyl group or the like, R4 represents a vinyl group or allyl group, a represents an integer from 0 to 2, b represents 1 or 2, and a+b is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300; (B) an Si—H-containing polysiloxane including T units, D units, and R3cHdSiO(4-c-d)/2 units (wherein, c represents an integer from 0 to 2, d represents 1 or 2, and c+d is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300, in sufficient quantity that the molar ratio of Si-bonded hydrogen atoms within (B), relative to vinyl groups or allyl groups within (A), is within a range from 0.1 to 4.0; (C) a catalyst; and (D) a phosphor.
    • 提供含磷光体的可加成固化的有机硅树脂组合物。 该组合物能够形成表现出优异的抗裂性和抗冲击性和最小表面粘性的固化产物。 该组合物包含(A)包含R1SiO1.5单元(T单元),R22SiO单元(D单元)和R3aR4bSiO(4-ab)/ 2单元的有机聚硅氧烷(其中,R1,R2和R3表示甲基等 ,R4表示乙烯基或烯丙基,a表示0〜2的整数,b表示1或2,a + b为2或3),D单元的重复数在 从5到300; (B)包含T单元,D单元和R3cHdSiO(4-cd)/ 2单元的Si-H的聚硅氧烷(其中,c表示0至2的整数,d表示1或2,c + d为 2或3),其中D单元的重复数在5至300的范围内,其量足以使(B)内的与Si键合的氢原子相对于乙烯基或烯丙基的摩尔比 (A)范围内,为0.1〜4.0; (C)催化剂; 和(D)荧光体。
    • 8. 发明授权
    • Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
    • 用于密封光学元件的树脂组合物,其固化产物,以及密封半导体元件的方法
    • US07550204B2
    • 2009-06-23
    • US11586564
    • 2006-10-26
    • Hisashi ShimizuToshio ShiobaraTsutomu Kashiwagi
    • Hisashi ShimizuToshio ShiobaraTsutomu Kashiwagi
    • B32B9/04C08G77/18
    • C08L83/04C08G77/14C08G77/18C08G77/20C08G77/70C08J7/047C08J2483/00C08K5/0091H01L23/296H01L2924/0002Y10T428/31663H01L2924/00
    • The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
    • 本发明提供了一种用于密封光学装置的组合物,其包含(i)聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷,其平均组成式为:<?in-line-formula description =“In- 线形式“end =”lead“→> R1a(OX)bSiO(4-ab)/ 2 <?in-line-formula description =”In-line Formulas“end =”tail“?>(其中,R1表示 烷基,烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团(其中,RE至R 4为一价烃基)和烷基,烯基,烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数,a + b满足1.00 a + b 2),(ii)缩合催化剂,以及由 固化组合物,以及密封半导体元件的方法,其包括施加组合物的步骤 涉及半导体元件,以及固化已经施加到半导体元件上的组合物的步骤。 该组合物可以形成表现出优异的耐热性,耐紫外线性,光学透明性,韧性和粘附性的涂膜。
    • 9. 发明申请
    • Silicone lens and silicone resin composition for molding lens
    • 硅胶透镜和用于成型镜片的硅树脂组合物
    • US20070249790A1
    • 2007-10-25
    • US11785791
    • 2007-04-20
    • Tsutomu KashiwagiToshio Shiobara
    • Tsutomu KashiwagiToshio Shiobara
    • C08L83/04C08G77/00
    • C08L83/04C08G77/12C08G77/16C08G77/20C08G77/70C08G77/80C08K5/56C08L83/00
    • A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.
    • 通过热固化有机硅树脂组合物制得的无色透明硅氧烷透镜,该有机硅树脂组合物包含(A)具有包含R 1 SiO 1/2单元的树脂结构的有机聚硅氧烷,R 2, SiO 2单元和R 3 SiO 2 SiO 2 SiO 2单元和/或SiO 2 其中R 1,R 2和R 3独立地是(4-ab)/ 2单元独立地是甲基 乙基,丙基,环己基或苯基,R 4是乙烯基或烯丙基,a是0,1或2,b是1或2,a + b是 2或3,其中R 2 SiO 2 SiO单元的重复次数为5〜300,(B)具有包含R 2 SiO 2的树脂结构的有机氢聚硅氧烷, 1个SiO 1单元,R 2 O 2 SiO单元和R 3 -S 3单元 其中c为0,1或2,d为1或2,c + d为(4-cd)/ 2单元 2或3,其中R 2 O 2 SiO单元的重复次数 为5〜300,该成分为(C)铂族催化剂。 提供了具有优异的柔性,透明性和成型性以及降低的表面粘性的硅氧烷透镜。