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1. 发明申请

US20060229408A1 Curable resin composition for sealing LED element 审中-公开
标题翻译：用于密封LED元件的可固化树脂组合物
公开(公告)号：US20060229408A1
公开(公告)日：2006-10-12
申请号：US11399434
申请日：2006-04-07
申请人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/06 , C08G77/08
CPC分类号： H01L23/293 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , C08L2666/52 , C08L2666/54 , H01L2924/00
摘要： A curable resin composition for sealing an LED element is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. It is suited to formation of a coating film or the like with excellent heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and is ideal for applications such as the sealing of LED elements.
摘要翻译：提供一种用于密封LED元件的可固化树脂组合物。组合物包括（i）聚苯乙烯当量重均分子量为至少5×10 3的有机聚硅氧烷，（ii）缩合催化剂，（iii）溶剂和（iv）细粉末状无机物填料。适合于形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘合性的涂膜等，并且是诸如LED元件的密封等应用的理想选择。

2. 发明授权

US07563854B2 Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof 有权
标题翻译：生产高分子量有机聚硅氧烷的方法，包含高分子量有机聚硅氧烷的组合物和用其固化产物密封的光学半导体器件
公开(公告)号：US07563854B2
公开(公告)日：2009-07-21
申请号：US11586525
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08G77/06
CPC分类号： C08G77/04 , C08G77/06 , C08G77/08 , C08G77/14 , Y10T428/31663
摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
摘要翻译：本发明提供一种聚苯乙烯换算重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有水解性基团的硅烷化合物进行第一次水解缩合而制造有机聚硅氧烷的工序，该有机聚硅氧烷再次进行水解和缩合。高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

3. 发明授权

US07550204B2 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
标题翻译：用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法
公开(公告)号：US07550204B2
公开(公告)日：2009-06-23
申请号：US11586564
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04 , C08G77/18
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08J7/047 , C08J2483/00 , C08K5/0091 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
摘要翻译：本发明提供了一种用于密封光学装置的组合物，其包含（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为：<？in-line-formula description =“In- 线形式“end =”lead“→> R1a（OX）bSiO（4-ab）/ 2 <？in-line-formula description =”In-line Formulas“end =”tail“？>（其中，R1表示烷基，烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团（其中，RE至R 4为一价烃基）和烷基，烯基，烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数，a + b满足1.00 a + b 2），（ii）缩合催化剂，以及由固化组合物，以及密封半导体元件的方法，其包括施加组合物的步骤涉及半导体元件，以及固化已经施加到半导体元件上的组合物的步骤。该组合物可以形成表现出优异的耐热性，耐紫外线性，光学透明性，韧性和粘附性的涂膜。

4. 发明申请

US20060035092A1 Resin composition for sealing LED elements and cured product generated by curing the composition 审中-公开
标题翻译：用于密封LED元件的树脂组合物和通过固化组合物产生的固化产物
公开(公告)号：US20060035092A1
公开(公告)日：2006-02-16
申请号：US11199175
申请日：2005-08-09
申请人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B27/04 , C08L83/04 , H01L21/00
CPC分类号： C09D183/04 , H01L33/56 , Y10T428/31663
摘要： Provided is a resin composition for sealing LED elements, including (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, represented by an average composition formula (1): R1a(OX)bSiO(4-a-b)/2, in which, each R1 represents, independently, an alkyl group, alkenyl group or aryl group of 1 to 6 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.05 to 1.5, b represents a number that satisfies 0
摘要翻译：提供一种用于密封LED元件的树脂组合物，其包含（i）由平均组成式（1）表示的聚苯乙烯换算重均分子量为至少5×10 3的有机聚硅氧烷：R

5. 发明申请

US20070099008A1 Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof 有权
标题翻译：生产高分子量有机聚硅氧烷的方法，包含高分子量有机聚硅氧烷的组合物和用其固化产物密封的光学半导体器件
公开(公告)号：US20070099008A1
公开(公告)日：2007-05-03
申请号：US11586525
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B27/00 , C08G77/04 , C08L83/04
CPC分类号： C08G77/04 , C08G77/06 , C08G77/08 , C08G77/14 , Y10T428/31663
摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
摘要翻译：本发明提供一种聚苯乙烯换算的重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有可水解基团的硅烷化合物经受水解性基团的有机聚硅氧烷首先水解和缩合，然后使该有机聚硅氧烷再次进行水解和缩合。高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

6. 发明申请

US20060270786A1 Resin composition for sealing optical device and cured product thereof 审中-公开
标题翻译：用于密封光学装置的树脂组合物及其固化产物
公开(公告)号：US20060270786A1
公开(公告)日：2006-11-30
申请号：US11441099
申请日：2006-05-26
申请人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04 , B32B27/00
CPC分类号： C08L83/04 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L2666/52 , C08L2666/54
摘要： A resin composition for sealing an optical device is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 3×103, having an average composition formula: R1a(OX)bSiO(4-a-b)/2 wherein, R1 represents an alkyl, alkenyl or aryl group of 1 to 8 carbon atoms, X represents a hydrogen atom, or an alkyl, alkenyl, alkoxyalkyl or acyl group of 1 to 8 carbon atoms, a is a number within a range from 1.05 to 1.5, b is a number that satisfies 0
摘要翻译：提供一种用于密封光学装置的树脂组合物。该组合物包括（i）聚苯乙烯换算的重均分子量为至少3×10 3的有机聚硅氧烷，其平均组成式为：<？in-line-formula description =“In-Line Formulas” （4-ab）/ 2（a-b）/（b-1）其中，R 1表示1〜8个碳原子的烷基，链烯基或芳基，X表示在式氢原子或碳原子数为1〜8的烷基，烯基，烷氧基烷基或酰基，a为1.05〜1.5的数，b为满足0

7. 发明申请

US20070099009A1 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
标题翻译：用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法
公开(公告)号：US20070099009A1
公开(公告)日：2007-05-03
申请号：US11586564
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04 , C08G77/08
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08J7/047 , C08J2483/00 , C08K5/0091 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0
摘要翻译：本发明提供了一种用于密封光学器件的组合物，该组合物可以形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘附性的涂膜，并且还提供了该组合物的固化产物，以及密封方法使用组合。一种用于密封光学器件的树脂组合物，其包含：（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为： -formulae description =“In-line Formulas”end =“lead”？> R＆lt; 1＆lt;＆lt;＆gt;（OX）b 4-ab）/ 2 <？in-line-formula description =“In-line Formulas”end =“tail”？>（其中，R 1表示烷基，烯基基团或芳基; X表示由下式表示的基团的组合：R 1，R 2，R 3，R 4， O 2〜R 4为一价烃基），烷基，烯基，烷氧基烷基或酰基; a表示1.00〜1.5的数; b 表示满足0

8. 发明授权

US07737194B2 Silicone lens and silicone resin composition for molding lens 有权
标题翻译：硅胶透镜和用于成型镜片的硅树脂组合物
公开(公告)号：US07737194B2
公开(公告)日：2010-06-15
申请号：US11785791
申请日：2007-04-20
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/56 , C08L83/00
摘要： A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.
摘要翻译：通过热固化硅氧烷树脂组合物制得的无色透明硅氧烷透镜，其包含（A）具有包含R1SiO1.5单元，R22SiO单元和R3aR4bSiO（4-ab）/ 2单元的树脂结构的有机聚硅氧烷，其中R1，R2和R3为乙基，丙基，环己基或苯基，R4为乙烯基或烯丙基，a为0,1或2，b为1或2，a + b为2或3，以及其中R22SiO单元的重复数为5〜300，（B）具有包含R1SiO1.5单元，R22SiO单元和R3cHdSiO（4-cd）/ 2单元的树脂结构的有机氢聚硅氧烷，其中c为0,1或 2，d为1或2，c + d为2或3，R22SiO单元的重复数为5〜300，该成分为（C）铂族催化剂。提供了具有优异的柔性，透明性和成型性以及降低的表面粘性的硅氧烷透镜。

9. 发明申请

US20080308828A1 Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet 有权
标题翻译：含有荧光体的粘合性硅酮组合物，由该组合物形成的组合物片材，以及使用该片材的发光装置的制造方法
公开(公告)号：US20080308828A1
公开(公告)日：2008-12-18
申请号：US12078909
申请日：2008-04-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.
摘要翻译：提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。荧光体的分散状态随时间保持稳定。在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材仪器。

10. 发明申请

US20060270808A1 Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device 审中-公开
标题翻译：环氧硅酮类混合树脂组合物，其固化物，发光半导体装置
公开(公告)号：US20060270808A1
公开(公告)日：2006-11-30
申请号：US11438444
申请日：2006-05-23
申请人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
发明人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
IPC分类号： C08L83/05 , C08L63/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08L63/00 , C08L83/00 , C08L2666/14 , C08K5/56 , C08K5/0091
摘要： An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.
摘要翻译：一种环氧硅树脂混合树脂组合物，其包含（A）具有至少一个乙烯基或烯丙基和至少一个羟基的有机聚硅氧烷，（B）具有至少一个环氧基的有机树脂，（C）有机氢聚硅氧烷，（D）铂族金属类催化剂（E）铝化合物和（F）0.1-15％重量的有机脱模剂在金属模具中成型并固化成透明产品，其可以从模子。固化产品对金属框架具有令人满意的粘合强度，并保持耐热性。 LED器件可以通过连续机械成型制造。

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