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    • 2. 发明授权
    • Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
    • 用于密封光学元件的树脂组合物,其固化产物,以及密封半导体元件的方法
    • US07550204B2
    • 2009-06-23
    • US11586564
    • 2006-10-26
    • Hisashi ShimizuToshio ShiobaraTsutomu Kashiwagi
    • Hisashi ShimizuToshio ShiobaraTsutomu Kashiwagi
    • B32B9/04C08G77/18
    • C08L83/04C08G77/14C08G77/18C08G77/20C08G77/70C08J7/047C08J2483/00C08K5/0091H01L23/296H01L2924/0002Y10T428/31663H01L2924/00
    • The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
    • 本发明提供了一种用于密封光学装置的组合物,其包含(i)聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷,其平均组成式为:<?in-line-formula description =“In- 线形式“end =”lead“→> R1a(OX)bSiO(4-ab)/ 2 <?in-line-formula description =”In-line Formulas“end =”tail“?>(其中,R1表示 烷基,烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团(其中,RE至R 4为一价烃基)和烷基,烯基,烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数,a + b满足1.00 a + b 2),(ii)缩合催化剂,以及由 固化组合物,以及密封半导体元件的方法,其包括施加组合物的步骤 涉及半导体元件,以及固化已经施加到半导体元件上的组合物的步骤。 该组合物可以形成表现出优异的耐热性,耐紫外线性,光学透明性,韧性和粘附性的涂膜。
    • 8. 发明授权
    • Organopolysilmethylene-siloxane and a cured product thereof
    • 有机聚硅氧烷 - 硅氧烷及其固化物
    • US08497024B2
    • 2013-07-30
    • US12860682
    • 2010-08-20
    • Manabu UenoToshio ShiobaraTsutomu Kashiwagi
    • Manabu UenoToshio ShiobaraTsutomu Kashiwagi
    • B32B9/04
    • C08G77/50C08G77/16C08G77/18C08G77/24C08L83/14Y10T428/31663C08L83/00
    • Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.
    • 式(1)的有机聚硅氧烷 - 硅氧烷:其中每个R 1彼此独立地是除烯基,烷氧基,羟基和卤素以外的未取代或取代的碳原子数1〜10的一价烃基 原子; 每个R 2彼此独立地是除烯基,烷氧基,羟基,卤素原子和(R 1)3 SiCH 2 - 以外具有1至10个碳原子的未取代或取代的一价烃基,其中每个R 3 彼此独立地是氢原子和具有1至4个碳原子的烷基; k为1〜100的整数, n为1〜1000的整数。 所述有机聚硅氧烷 - 硅氧烷在分子中具有至少两个烷氧基,羟基和与一个或多个硅原子键合的卤素原子。