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1. 发明授权

US07985806B2 Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same 有权
标题翻译：二缩水甘油基异氰脲基改性的有机聚硅氧烷及其组合物
公开(公告)号：US07985806B2
公开(公告)日：2011-07-26
申请号：US12360652
申请日：2009-01-27
申请人： Toshio Shiobara , Tsutomu Kashiwagi , Miyuki Wakao , Manabu Ueno
发明人： Toshio Shiobara , Tsutomu Kashiwagi , Miyuki Wakao , Manabu Ueno
IPC分类号： C08G77/14 , C08L83/06
CPC分类号： C08G77/388 , C08L83/08
摘要： An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1≦a+b, and c represents an integer of 0 to 10 wherein, R3 represents an alkylene group of 2 to 12 carbon atoms wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.
摘要翻译：由式（1）表示的由下述式（1）表示的有机聚硅氧烷和至少在主链的两个末端具有由式（2）表示的（3,5-二缩水甘油基异氰脲基）烷基：其中，每个R 1独立地表示取代或未取代的一价 1〜20个碳原子的烃基，R2为下述式（2）所示的基团，X为下述式（3）表示的基团，a表示0〜100的整数，b表示0以下的整数至30，条件是1＆nlE; a + b和c表示0至10的整数，其中R 3表示2至12个碳原子的亚烷基，其中R 1和R 2如上所定义，d表示0至 30，e表示0〜30的整数。

2. 发明申请

US20100029887A1 RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT 有权
标题翻译：用于封装光学半导体元件的树脂组合物
公开(公告)号：US20100029887A1
公开(公告)日：2010-02-04
申请号：US12510491
申请日：2009-07-28
申请人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C09D183/04 , C08G77/04
CPC分类号： C08G59/306 , C08G59/3254 , C08L83/06
摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).
摘要翻译：一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2）两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

3. 发明授权

US08133957B2 Resin composition for encapsulating optical semiconductor element 有权
标题翻译：用于封装光学半导体元件的树脂组合物
公开(公告)号：US08133957B2
公开(公告)日：2012-03-13
申请号：US12510491
申请日：2009-07-28
申请人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08G77/14
CPC分类号： C08G59/306 , C08G59/3254 , C08L83/06
摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).
摘要翻译：一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2）两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

4. 发明授权

US08710158B2 Epoxy composition for encapsulating an optical semiconductor element 有权
标题翻译：用于封装光学半导体元件的环氧组合物
公开(公告)号：US08710158B2
公开(公告)日：2014-04-29
申请号：US13080730
申请日：2011-04-06
申请人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08G59/20 , C08G59/42 , C08G59/62 , C08L63/00 , C08L83/08 , C08L83/10 , H01L21/56
CPC分类号： H01L33/56 , C08G59/306 , C08G59/3254 , C08G59/42
摘要： The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.
摘要翻译：本发明的目的是提供一种用于封装光学半导体元件的环氧组合物，该组合物提供具有低透气性的固化产物和薄膜形式的优异的固化性以及良好的透光性和抗裂纹性。本发明提供一种组合物，其包含（A）由式（1）表示的硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇。本发明还提供一种组合物，其包含通过（A）硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇和（D）固化催化剂及其固化产物反应制备的组合物。

5. 发明申请

US20110251305A1 EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT 有权
标题翻译：用于封装光学半导体元件的环氧组合物
公开(公告)号：US20110251305A1
公开(公告)日：2011-10-13
申请号：US13080730
申请日：2011-04-06
申请人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08L63/00 , C08G77/26
CPC分类号： H01L33/56 , C08G59/306 , C08G59/3254 , C08G59/42
摘要： The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.
摘要翻译：本发明的目的是提供一种用于封装光学半导体元件的环氧组合物，该组合物提供具有低透气性的固化产物和薄膜形式的优异的固化性以及良好的透光性和抗裂纹性。本发明提供一种组合物，其包含（A）由式（1）表示的硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇。本发明还提供一种组合物，其包含通过（A）硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇和（D）固化催化剂及其固化产物反应制备的组合物。

6. 发明授权

US08497024B2 Organopolysilmethylene-siloxane and a cured product thereof 有权
标题翻译：有机聚硅氧烷 - 硅氧烷及其固化物
公开(公告)号：US08497024B2
公开(公告)日：2013-07-30
申请号：US12860682
申请日：2010-08-20
申请人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04
CPC分类号： C08G77/50 , C08G77/16 , C08G77/18 , C08G77/24 , C08L83/14 , Y10T428/31663 , C08L83/00
摘要： Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.
摘要翻译：式（1）的有机聚硅氧烷 - 硅氧烷：其中每个R 1彼此独立地是除烯基，烷氧基，羟基和卤素以外的未取代或取代的碳原子数1〜10的一价烃基原子; 每个R 2彼此独立地是除烯基，烷氧基，羟基，卤素原子和（R 1）3 SiCH 2 - 以外具有1至10个碳原子的未取代或取代的一价烃基，其中每个R 3 彼此独立地是氢原子和具有1至4个碳原子的烷基; k为1〜100的整数， n为1〜1000的整数。所述有机聚硅氧烷 - 硅氧烷在分子中具有至少两个烷氧基，羟基和与一个或多个硅原子键合的卤素原子。

7. 发明申请

US20110046319A1 ORGANOPOLYSILMETHYLENE AND A CURED PRODUCT THEREOF 有权
标题翻译：有机聚甲基苯乙烯及其固化产物
公开(公告)号：US20110046319A1
公开(公告)日：2011-02-24
申请号：US12860682
申请日：2010-08-20
申请人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08L83/06 , C08G77/16
CPC分类号： C08G77/50 , C08G77/16 , C08G77/18 , C08G77/24 , C08L83/14 , Y10T428/31663 , C08L83/00
摘要： The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group and a halogen atom; R2 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom and (R1)3SiCH2—, wherein R3 is, independently of each other, a group selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; and having, in a molecule, at least two out of alkoxy groups, hydroxy groups and halogen atoms bonded to one or more silicon atoms.
摘要翻译：本发明提供由以下通式（1）表示的有机聚亚甲硅烷基：其中R 1彼此独立地为选自除烯基以外的未取代或取代的碳原子数1〜10的一价烃基基团，烷氧基，羟基和卤素原子; R2彼此独立地选自除烯基，烷氧基，羟基，卤素原子以外的未取代或取代的碳原子数1〜10的一价烃基和（R1） 3SiCH 2 - ，其中R 3彼此独立地为选自氢原子和具有1至4个碳原子的烷基的基团; k为1〜100的整数， n为1〜1000的整数。并且在一个分子中具有与一个或多个硅原子键合的烷氧基，羟基和卤素原子中的至少两个。

8. 发明授权

US07737194B2 Silicone lens and silicone resin composition for molding lens 有权
标题翻译：硅胶透镜和用于成型镜片的硅树脂组合物
公开(公告)号：US07737194B2
公开(公告)日：2010-06-15
申请号：US11785791
申请日：2007-04-20
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/56 , C08L83/00
摘要： A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.
摘要翻译：通过热固化硅氧烷树脂组合物制得的无色透明硅氧烷透镜，其包含（A）具有包含R1SiO1.5单元，R22SiO单元和R3aR4bSiO（4-ab）/ 2单元的树脂结构的有机聚硅氧烷，其中R1，R2和R3为乙基，丙基，环己基或苯基，R4为乙烯基或烯丙基，a为0,1或2，b为1或2，a + b为2或3，以及其中R22SiO单元的重复数为5〜300，（B）具有包含R1SiO1.5单元，R22SiO单元和R3cHdSiO（4-cd）/ 2单元的树脂结构的有机氢聚硅氧烷，其中c为0,1或 2，d为1或2，c + d为2或3，R22SiO单元的重复数为5〜300，该成分为（C）铂族催化剂。提供了具有优异的柔性，透明性和成型性以及降低的表面粘性的硅氧烷透镜。

9. 发明申请

US20080308828A1 Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet 有权
标题翻译：含有荧光体的粘合性硅酮组合物，由该组合物形成的组合物片材，以及使用该片材的发光装置的制造方法
公开(公告)号：US20080308828A1
公开(公告)日：2008-12-18
申请号：US12078909
申请日：2008-04-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.
摘要翻译：提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。荧光体的分散状态随时间保持稳定。在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材仪器。

10. 发明申请

US20060270808A1 Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device 审中-公开
标题翻译：环氧硅酮类混合树脂组合物，其固化物，发光半导体装置
公开(公告)号：US20060270808A1
公开(公告)日：2006-11-30
申请号：US11438444
申请日：2006-05-23
申请人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
发明人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
IPC分类号： C08L83/05 , C08L63/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08L63/00 , C08L83/00 , C08L2666/14 , C08K5/56 , C08K5/0091
摘要： An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.
摘要翻译：一种环氧硅树脂混合树脂组合物，其包含（A）具有至少一个乙烯基或烯丙基和至少一个羟基的有机聚硅氧烷，（B）具有至少一个环氧基的有机树脂，（C）有机氢聚硅氧烷，（D）铂族金属类催化剂（E）铝化合物和（F）0.1-15％重量的有机脱模剂在金属模具中成型并固化成透明产品，其可以从模子。固化产品对金属框架具有令人满意的粘合强度，并保持耐热性。 LED器件可以通过连续机械成型制造。

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