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    • 1. 发明专利
    • Semiconductor light emitting element and manufacturing method of the same
    • 半导体发光元件及其制造方法
    • JP2013008817A
    • 2013-01-10
    • JP2011140244
    • 2011-06-24
    • Toshiba Corp株式会社東芝
    • NITTA KOICHI
    • H01L33/32H01L33/42
    • H01L33/385H01L33/405H01L33/42H01L33/44H01L2933/0016
    • PROBLEM TO BE SOLVED: To realize a semiconductor light emitting element achieving high light extraction efficiency.SOLUTION: According to one embodiment, a semiconductor light emitting element is provided with a substrate, a conductive reflection film, an active region, a first electrode, a transparent conductive film, and a second electrode. The conductive reflection film is provided on the substrate. In the active region, a first conductive type transparent electrode, a first conductive type contact layer, a light emitting layer, a second conductive type contact layer, and a second conductive type transparent electrode are formed on the conductive reflection film in the laminated state. The first electrode is provided on the conductive reflection film, separating from the active region. One end of the transparent conductive film is provided so as to cover an upper part of the second conductive type transparent electrode and the other end of the transparent conductive film is provided on the conductive reflection film through an insulation film. The transparent conductive film contacts with a side surface of the active region through the insulation film. The second electrode is provided on the other end of the transparent conductive film.
    • 要解决的问题:实现获得高光提取效率的半导体发光元件。 解决方案:根据一个实施例,半导体发光元件设置有基板,导电反射膜,有源区,第一电极,透明导电膜和第二电极。 导电反射膜设置在基板上。 在有源区域中,在层叠状态的导电性反射膜上形成有第一导电型透明电极,第一导电型接触层,发光层,第二导电型接触层和第二导电型透明电极。 第一电极设置在导电反射膜上,与有源区分离。 透明导电膜的一端设置成覆盖第二导电型透明电极的上部,透明导电膜的另一端通过绝缘膜设置在导电性反射膜上。 透明导电膜通过绝缘膜与有源区的侧表面接触。 第二电极设置在透明导电膜的另一端上。 版权所有(C)2013,JPO&INPIT
    • 2. 发明专利
    • Semiconductor light emitting device
    • 半导体发光器件
    • JP2007281529A
    • 2007-10-25
    • JP2007196158
    • 2007-07-27
    • Toshiba Corp株式会社東芝
    • NITTA KOICHIABE HIROHISAKONNO KUNIAKIIDEI YASUO
    • H01L33/06H01L33/08H01L33/10H01L33/12H01L33/32H01L33/36H01L33/60
    • PROBLEM TO BE SOLVED: To provide a white light emitting device having high brightness. SOLUTION: The semiconductor light emitting device includes a semiconductor light emitting chip including an active layer which emits light with first wavelength by current injection, and a light emitting layer which is adhered to the surface of the substrate of the semiconductor light emitting chip and emits light with second wavelength by being exited by the light with first wavelength. The light emitting layer is formed separately in a plurality of areas of 1/3 to 2/3 of the surface of the substrate, and the light emitting layer is interposed between a pair of n-type and p-type cladding layers each having a band gap larger than that of the light emitting layer. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种具有高亮度的白色发光器件。 解决方案:半导体发光器件包括:半导体发光芯片,其包括通过电流注入发射具有第一波长的光的有源层;以及发光层,其粘附到半导体发光芯片的基板的表面 并通过被第一波长的光排出而发射具有第二波长的光。 发光层分别形成在基板的表面的1/3〜2/3的多个区域中,并且发光层插入在一对n型和p型覆盖层之间,每层具有 带隙大于发光层的带隙。 版权所有(C)2008,JPO&INPIT
    • 3. 发明专利
    • Semiconductor luminous element
    • 半导体元器件
    • JP2006032837A
    • 2006-02-02
    • JP2004212885
    • 2004-07-21
    • Toshiba Corp株式会社東芝
    • NITTA KOICHINAKAMURA TAKAFUMIISOMOTO KENJI
    • H01L33/06H01L33/14H01L33/30H01L33/40
    • PROBLEM TO BE SOLVED: To obtain a semiconductor luminous element that never shows thyristor characteristics. SOLUTION: The semiconductor luminous element is provided with a first trap relaxing layer 1 adhered onto a GaP substrate 100 through a first adhesive layer 101, a first clad layer 103 laminated and formed on the first trap relaxing layer 102, a luminous layer 104 laminated and formed on the first clad layer 103, a second clad layer 105 laminated and formed on the luminous layer 104, a second trap relaxing layer 106 laminated and formed on the second clad layer 105, a GaP window layer 108 which adheres to the second trap relaxing layer 106 through a second adhesive layer 107 and is provided on the surface side of the luminous layer 104, and electrodes 109, 110. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:获得从不显示晶闸管特性的半导体发光元件。 解决方案:半导体发光元件设置有通过第一粘合层101粘合到GaP基板100上的第一陷阱缓和层1,层叠并形成在第一陷阱缓和层102上的第一覆盖层103,发光层 104层叠并形成在第一包层103上,层叠并形成在发光层104上的第二包覆层105,层叠并形成在第二包层105上的第二陷阱缓和层106,GaP窗口层108, 第二陷阱缓和层106穿过第二粘合剂层107并且设置在发光层104的表面侧以及电极109,110上。(C)2006,JPO和NCIPI