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    • 4. 发明授权
    • Electron beam pattern transfer device and method for aligning mask and
semiconductor wafer
    • 用于对准掩模和半导体晶片的电子束图案转移装置和方法
    • US4469949A
    • 1984-09-04
    • US374724
    • 1982-05-04
    • Ichiro MoriKazuyoshi SugiharaToshiaki ShinozakiToru Tojo
    • Ichiro MoriKazuyoshi SugiharaToshiaki ShinozakiToru Tojo
    • H01L21/027H01J37/304H01L21/30H01J37/00
    • H01L21/30H01J37/3045
    • According to the invention an electron beam pattern transfer device with an improved alignment means is provided.A first and a second mark M.sub.1, M.sub.2 for alignment purposes are formed on the surface of the wafer and the wafer holder, respectively. The first mark M.sub.1 is formed on the wafer by conventional lithographic technique and the second mark M.sub.2 consists of a hole or a heavy metal, such as Ta or Ta.sub.2 O.sub.5. A third alignment mark M.sub.3 is provided on the photocathode mask having a position corresponding to M.sub.2 on the wafer holder and spaced a known distance L.sub.2 from an imaginary reference position M.sub.4 on the mask. The first step of the alignment process requires the detection of a relative distance L.sub.1 between the first and second marks M.sub.1, M.sub.2 by conventional detecting means, such as an optical measuring means. In the next step, the relative position of the photocathode mask and the wafer holder is adjusted so that the distance between the marks M.sub.2 and M.sub.3 is made substantially equal to the difference between the distance L.sub.1 and the known distance L.sub. 2.
    • 根据本发明,提供了具有改进的对准装置的电子束图案转印装置。 分别在晶片和晶片保持器的表面上形成用于对准目的的第一和第二标记M1,M2。 第一标记M1通过常规平版印刷技术在晶片上形成,第二标记M2由孔或重金属如Ta或Ta2O5组成。 第三对准标记M3设置在光电阴极掩模上,其具有对应于晶片保持器上的M2的位置,并且与掩模上的假想参考位置M4隔开已知距离L2。 对准处理的第一步骤需要通过诸如光学测量装置的常规检测装置检测第一和第二标记M1,M2之间的相对距离L1。 在下一步骤中,调整光电阴极掩模和晶片保持器的相对位置,使得标记M2和M3之间的距离基本上等于距离L1和已知距离L 2之间的差。
    • 7. 发明申请
    • PATTERN INSPECTION METHOD
    • 模式检验方法
    • US20080151230A1
    • 2008-06-26
    • US12033599
    • 2008-02-19
    • Toru TojoToshiyuki WatanabeIkunao IsomuraAkihiko Sekine
    • Toru TojoToshiyuki WatanabeIkunao IsomuraAkihiko Sekine
    • G01N21/00
    • G01N21/956
    • A pattern inspection apparatus comprises an illumination optics applying a first inspection light on a predetermined wavelength to a surface opposite to a pattern formed surface of the substrate, and a second inspection light whose wavelength is equal to the wavelength of the first inspection light to the pattern formed surface, a detector independently detecting a transmitted light from the substrate by irradiation of the first inspection light and a reflected light from the substrate by irradiation of the second inspection light, and a space separation mechanism provided in the vicinity of an optical focal plane toward the pattern formed surface, and spatially separates an irradiation area of the first and second inspection lights such that the transmitted and reflected lights from the substrate are imaged in two discrete areas separated on the optical focal plane.
    • 图案检查装置包括将预定波长的第一检查光施加到与基板的图案形成表面相对的表面的照明光学器件以及其波长等于第一检查光的波长与图案的第二检查光 形成表面,检测器,通过照射第一检查光和通过照射第二检查光的来自基板的反射光独立地检测来自基板的透射光;以及空间分离机构,设置在光学焦平面附近,朝向 图案形成表面,并且在空间上分离第一和第二检查光的照射区域,使得来自基板的透射和反射光成像在在光学焦平面上分离的两个离散区域中。
    • 9. 发明申请
    • Pattern defect inspection method and apparatus
    • 图案缺陷检查方法和装置
    • US20060239535A1
    • 2006-10-26
    • US11373501
    • 2006-03-13
    • Akira TakadaToru Tojo
    • Akira TakadaToru Tojo
    • H04N7/18G06K9/00G06K9/62G01N21/00
    • G03F1/84G01N21/95607G06K9/00G06K2209/19G06T7/001G06T2207/30148
    • A method and an apparatus for irradiating a measurement sample with an energy beam, a pattern being formed in the measurement sample, providing an optical system for detecting transmitted energy beam or reflected energy beam from the measurement sample, obtaining a pattern image, and comparing design data of the pattern and an image of the obtained image pattern to inspect a defect of the pattern formed in the measurement sample, wherein the measurement sample is a so-called photomask, a design pattern produced in producing the photomask is used as the design data of the pattern, and, in a procedure of performing inspection by comparing the obtained image and the design data, the design data is converted into an image (hereinafter referred to as wafer image) by a proper method, the wafer image being formed through a stepper used for actually forming the pattern of the photomask on a wafer, the obtained image actually measured is simultaneously converted into a wafer image by a proper method, and the defect is detected by comparing both wafer images to each other.
    • 一种用能量束照射测量样品的方法和装置,在测量样品中形成图案,提供用于检测来自测量样品的透射能量束或反射能量束的光学系统,获得图案图像和比较设计 图案的数据和所获得的图像图案的图像,以检查在测量样品中形成的图案的缺陷,其中测量样本是所谓的光掩模,使用在制备光掩模中产生的设计图案作为设计数据 的图案,并且在通过比较所获得的图像和设计数据进行检查的过程中,通过适当的方法将设计数据转换为图像(以下称为晶片图像),晶片图像通过 用于在晶片上实际形成光掩模的图案的步进器,将所获得的实际测量的图像同时转换成晶片图像通过适当的m 并且通过将两个晶片图像彼此进行比较来检测缺陷。
    • 10. 发明申请
    • Defect inspecting apparatus and defect inspection method
    • 缺陷检查装置和缺陷检查方法
    • US20060087649A1
    • 2006-04-27
    • US11248124
    • 2005-10-13
    • Riki OgawaToru Tojo
    • Riki OgawaToru Tojo
    • G01N21/88
    • G03F1/74G01N21/9501G01N21/95607
    • In a defect inspecting apparatus, an illumination optical system illuminate a mask having a patterned surface, the optical beam passing through the mask is split into two beam components which is guided in first and second image pickup sensors. The pickup sensors has first and second pickup fields on the patterned surface, which pick up first and second parts of the mask image. The first and second pickup fields are parallel to each other and displaced from each other by (2n+1)×d/2 in the longitudinal direction thereof, where d denotes a longitudinal dimension of each pixel image in the first and second pick up fields and n denotes an integer equal to or larger than 0. The first and second parts of the mask image are merged to form a pattern image, and a defect in the mask is detected on the basis of the pattern image.
    • 在缺陷检查装置中,照明光学系统照射具有图案化表面的掩模,通过掩模的光束被分割成在第一和第二图像拾取传感器中被引导的两个光束分量。 拾取传感器在图案化表面上具有第一和第二拾取场,其拾取掩模图像的第一和第二部分。 第一拾取场和第二拾取场彼此平行并且在其纵向彼此相互错位(2n + 1)xd / 2,其中d表示第一和第二拾取场中每个像素图像的纵向尺寸, n表示等于或大于0的整数。掩模图像的第一部分和第二部分被合并以形成图案图像,并且基于图案图像检测掩模中的缺陷。