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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110309439A1
    • 2011-12-22
    • US13052254
    • 2011-03-21
    • Tomoko MatsudaiKoichi EndoKumiko SatoNorio Yasuhara
    • Tomoko MatsudaiKoichi EndoKumiko SatoNorio Yasuhara
    • H01L29/78H01L21/336
    • H01L29/66659H01L21/26586H01L29/0623H01L29/1045H01L29/7835
    • According to one embodiment, a semiconductor device includes a semiconductor substrate, a first conductivity-type region, a second conductivity-type source region, a gate insulating film and a gate electrode. The first conductivity-type region is provided in an upper layer portion of the semiconductor substrate. The second conductivity-type source region and a second conductivity-type drain region are arranged by being separated from each other in an upper layer portion of the first conductivity-type region. The gate insulating film is provided on the semiconductor substrate. The gate electrode is provided on the gate insulating film. An effective concentration of impurities in a channel region corresponding to a region directly below the gate electrode in the first conductivity-type region has a maximum at an interface between the gate insulating film and the channel region, and decreases toward a lower part of the channel region.
    • 根据一个实施例,半导体器件包括半导体衬底,第一导电类型区域,第二导电型源极区域,栅极绝缘膜和栅极电极。 第一导电型区域设置在半导体衬底的上层部分中。 第二导电型源极区域和第二导电型漏极区域通过在第一导电类型区域的上层部分中彼此分离而布置。 栅极绝缘膜设置在半导体衬底上。 栅电极设置在栅极绝缘膜上。 与第一导电型区域中的栅电极正下方的区域对应的沟道区域中的杂质的有效浓度在栅极绝缘膜与沟道区域之间的界面处具有最大值,并且朝向沟道的下部逐渐减小 地区。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110095369A1
    • 2011-04-28
    • US12878979
    • 2010-09-09
    • Tomoko MatsudaiNorio YasuharaTakashi TsurugaiKumiko Sato
    • Tomoko MatsudaiNorio YasuharaTakashi TsurugaiKumiko Sato
    • H01L29/772
    • H01L29/0692H01L29/1087H01L29/66659H01L29/7835
    • According to one embodiment, a semiconductor device includes a drain region, a source region, a channel region, an insulating film, a gate electrode, a first semiconductor region, and a second semiconductor region. The source region includes a source layer of the first conductivity type, a first back gate layer of the second conductivity type, and a second back gate layer of the second conductivity type. The first back gate layer is adjacent to the second semiconductor region on one side in a channel length direction, and is adjacent to the source layer on one other side in the channel length direction. The second back gate layer is adjacent to the source layer on the one side in the channel length direction, and is adjacent to the second semiconductor region on the one other side in the channel length direction.
    • 根据一个实施例,半导体器件包括漏极区,源极区,沟道区,绝缘膜,栅电极,第一半导体区和第二半导体区。 源极区包括第一导电类型的源极层,第二导电类型的第一背栅极层和第二导电类型的第二背栅极层。 第一背栅层在沟道长度方向的一侧与第二半导体区相邻,并且在沟道长度方向的另一侧与源极相邻。 第二背栅层在沟道长度方向的一侧与源极层相邻,并且与沟道长度方向的另一侧的第二半导体区域相邻。