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    • 2. 发明授权
    • Monolithic planar doped barrier limiter
    • 单片平面掺杂势垒限制器
    • US4654609A
    • 1987-03-31
    • US705267
    • 1985-02-25
    • Samuel Dixon, Jr.Thomas R. AuCoinRoger J. Malik
    • Samuel Dixon, Jr.Thomas R. AuCoinRoger J. Malik
    • H01L29/36H01L29/861H03G11/02H01P1/22
    • H03G11/025H01L29/365H01L29/8618
    • A passive millimeter wave image guide power limiter comprising a length ofielectric transmission line or waveguide for millimeter wave frequencies located on a relatively thin conductive ground plane forming thereby an image guide and including a planar doped barrier diode structure formed in the dielectric transmission line with the planar doped barrier structure being integrally grown in a slot milled in the constituent material, i.e. gallium arsenide, of the waveguide transversely across the width dimension thereof so as to be oriented perpendicular to the flow of RF power being propagated along its length dimension. The planar doped barrier structure becomes conductive at a predetermined power level to reflect any further incident RF power back toward the power source.
    • 一种无源毫米波图像引导功率限制器,其包括位于相对薄的导电接地平面上的毫米波频率的介电传输线或波导的长度,从而形成图像引导件,并且包括形成在电介质传输线中的平面掺杂阻挡二极管结构, 平面掺杂阻挡结构整体生长在波导管的构成材料(即砷化镓)中铣削的槽中,横向穿过其宽度尺寸,以便垂直于沿着其长度尺寸传播的RF功率的流动。 平面掺杂阻挡结构以预定的功率电平变为导通,以将进一步的入射RF功率反射回电源。
    • 3. 发明授权
    • Planar doped barrier gate field effect transistor
    • 平面掺杂栅极场效应晶体管
    • US4442445A
    • 1984-04-10
    • US323858
    • 1981-11-23
    • Roger J. MalikThomas R. AuCoin
    • Roger J. MalikThomas R. AuCoin
    • H01L29/10H01L29/80H01L27/12H01L29/12
    • H01L29/80H01L29/10
    • Disclosed is an epitaxial layer field effect transistor having a planar dd barrier gate formed on an n-type semiconductor planar channel region between drain and source terminals formed on the surface of the channel region. The semiconductor channel region is fabricated on a semiconductor substrate, preferably GaAs and being separated therefrom by one or more semiconductor planar buffer regions. The planar doped barrier gate comprises an n.sup.+ -.pi.-p.sup.+ -.pi. structure grown by molecular beam epitaxy over the n-type channel region. Application of an electrical potential to the gate modulates the channel charge depletion in the semiconductor channel region underlying the gate causing a variation in the channel conductance laterally between the source and drain terminals.
    • 公开了一种外延层场效应晶体管,其具有形成在沟道区域表面上形成的漏极和源极端子之间的n型半导体平面沟道区上的平面掺杂势垒栅。 半导体沟道区域制造在半导体衬底上,优选地是GaAs,并由一个或多个半导体平面缓冲区与其分离。 平面掺杂阻挡栅极包括通过n型沟道区域上的分子束外延生长的n + -pi-p +-π结构。 向栅极施加电势调制栅极下方的半导体沟道区域中的沟道电荷耗尽,导致源极和漏极端子之间的沟道电导的横向变化。
    • 4. 发明授权
    • Method and apparatus for a self-aligned heterojunction bipolar transistor using dielectric assisted metal liftoff process
    • 使用介质辅助金属剥离工艺的自对准异质结双极晶体管的方法和装置
    • US06894362B2
    • 2005-05-17
    • US10402714
    • 2003-03-28
    • Roger J. Malik
    • Roger J. Malik
    • H01L21/331H01L29/00
    • H01L29/66318H01L2224/0401H01L2224/06102H01L2224/1403H01L2924/1305H01L2924/00
    • Disclosed is a manufacturing method to fabricate Heterojunction Bipolar Transistors (HBTs) that enables self-alignment of emitter and base metal contact layers with precise sub-micron spacing using a dielectric-assisted metal lift-off process. Such an HBT process relies on the formation of an “H-shaped” dielectric (i.e., Si3N4/SiO2) mask conformally deposited on top of the emitter contact metallization that is used to remove excess base metal through lift-off by a wet chemical HF-based etch. This HBT process also uses a thin selective etch-stop layer buried within the emitter layer to prevent wet chemical over-etching to the base and improves HBT reliability by forming a non-conducting, depleted ledge above the extrinsic base layer. The geometry of the self-aligned emitter and base metal contacts in the HBT insures conformal coverage of dielectric encapsulation films, preferably Si3N4 and/or SiO2, for reliable HBT emitter p-n junction passivation. Thus, the disclosed HBT process enables scaling of narrow emitter stripe widths down to sub-micron dimensions producing transistors with cut-off frequencies in the range of several hundred GigaHertz.
    • 公开了一种制造异质结双极晶体管(HBT)的制造方法,其使用介电辅助金属剥离工艺使得发射极和母材接触层能够以精确的亚微米间距自对准。 这种HBT工艺依赖于形成“H形”电介质(即,Si 3 N 4 N 2 O 3 / SiO 2)掩模 沉积在用于通过湿化学HF基蚀刻通过剥离去除多余的基体金属的发射极接触金属化的顶部。 该HBT工艺还使用掩埋在发射极层内的薄的选择性蚀刻停止层,以防止对基底的湿化学过度蚀刻,并通过在外部基极层之上形成非导电的耗尽凸缘来提高HBT的可靠性。 HBT中的自对准发射极和母体金属触点的几何形状确保电介质封装膜的适形覆盖,优选Si 3 N 4 N 2和/或SiO 2 ,用于可靠的HBT发射极pn结钝化。 因此,所公开的HBT工艺能够将窄发射极条宽度缩小到亚微米尺寸,从而产生截止频率在几百千兆赫兹范围内的晶体管。