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    • 3. 发明授权
    • Method and apparatus for a self-aligned heterojunction bipolar transistor using dielectric assisted metal liftoff process
    • 使用介质辅助金属剥离工艺的自对准异质结双极晶体管的方法和装置
    • US06894362B2
    • 2005-05-17
    • US10402714
    • 2003-03-28
    • Roger J. Malik
    • Roger J. Malik
    • H01L21/331H01L29/00
    • H01L29/66318H01L2224/0401H01L2224/06102H01L2224/1403H01L2924/1305H01L2924/00
    • Disclosed is a manufacturing method to fabricate Heterojunction Bipolar Transistors (HBTs) that enables self-alignment of emitter and base metal contact layers with precise sub-micron spacing using a dielectric-assisted metal lift-off process. Such an HBT process relies on the formation of an “H-shaped” dielectric (i.e., Si3N4/SiO2) mask conformally deposited on top of the emitter contact metallization that is used to remove excess base metal through lift-off by a wet chemical HF-based etch. This HBT process also uses a thin selective etch-stop layer buried within the emitter layer to prevent wet chemical over-etching to the base and improves HBT reliability by forming a non-conducting, depleted ledge above the extrinsic base layer. The geometry of the self-aligned emitter and base metal contacts in the HBT insures conformal coverage of dielectric encapsulation films, preferably Si3N4 and/or SiO2, for reliable HBT emitter p-n junction passivation. Thus, the disclosed HBT process enables scaling of narrow emitter stripe widths down to sub-micron dimensions producing transistors with cut-off frequencies in the range of several hundred GigaHertz.
    • 公开了一种制造异质结双极晶体管(HBT)的制造方法,其使用介电辅助金属剥离工艺使得发射极和母材接触层能够以精确的亚微米间距自对准。 这种HBT工艺依赖于形成“H形”电介质(即,Si 3 N 4 N 2 O 3 / SiO 2)掩模 沉积在用于通过湿化学HF基蚀刻通过剥离去除多余的基体金属的发射极接触金属化的顶部。 该HBT工艺还使用掩埋在发射极层内的薄的选择性蚀刻停止层,以防止对基底的湿化学过度蚀刻,并通过在外部基极层之上形成非导电的耗尽凸缘来提高HBT的可靠性。 HBT中的自对准发射极和母体金属触点的几何形状确保电介质封装膜的适形覆盖,优选Si 3 N 4 N 2和/或SiO 2 ,用于可靠的HBT发射极pn结钝化。 因此,所公开的HBT工艺能够将窄发射极条宽度缩小到亚微米尺寸,从而产生截止频率在几百千兆赫兹范围内的晶体管。
    • 9. 发明授权
    • Monolithic planar doped barrier subharmonic mixer
    • 单片平面掺杂阻挡次谐波混频器
    • US4563773A
    • 1986-01-07
    • US588612
    • 1984-03-12
    • Samuel Dixon, Jr.Roger J. Malik
    • Samuel Dixon, Jr.Roger J. Malik
    • H03D9/06H04B1/26
    • H03D9/0641H03D2200/0017
    • A single planar doped barrier diode is grown by the selective deposition of gallium arsenide using molecular beam epitaxy (MBE) in the center of a gallium arsenide dielectric waveguide member mounted on a ground plane. The waveguide member includes two portions which extend in opposite directions and terminating in respective metal to dielectric waveguide transition sections which are coupled to an RF input signal and local oscillator signal, respectively. The planar doped barrier diode operates as an intrinsic subharmonic mixer and accordingly the local oscillator signal has frequency of one half the input signal frequency. An IF output signal is coupled from the mixer diode to a microstrip transmission line formed on an insulating layer fabricated on the ground plane. Dielectric waveguide isolators are additionally included on the dielectric waveguide segments to mutually isolate the input signal and local oscillator signal. A monolithic form of circuit fabrication is thus provided which allows the planar doped barrier mixer circuit to be extremely small and the cost of mass producing such a circuit to be very economical.
    • 通过使用分子束外延(MBE)在安装在接地平面上的砷化镓电介质波导部件的中心选择性沉积砷化镓来生长单个平面掺杂势垒二极管。 波导构件包括两个部分,这两个部分在相反的方向上延伸并终止于分别与RF输入信号和本地振荡器信号耦合的电介质波导过渡部分的相应金属。 平面掺杂势垒二极管作为内部次谐波混频器工作,因此本地振荡器信号具有输入信号频率的一半的频率。 IF输出信号从混频器二极管耦合到形成在制造在接地平面上的绝缘层上的微带传输线。 电介质波导隔离器还包括在电介质波导段上,以相互隔离输入信号和本地振荡器信号。 因此,提供了一种单片形式的电路制造,其允许平面掺杂阻挡混合器电路非常小,并且大量生产这种电路的成本非常经济。
    • 10. 发明授权
    • Planar doped barrier transferred electron oscillator
    • 平面掺杂势垒转移电子振荡器
    • US4539581A
    • 1985-09-03
    • US397340
    • 1982-07-12
    • Roger J. MalikGerald J. Iafrate
    • Roger J. MalikGerald J. Iafrate
    • H01L47/02H01L27/26H01L29/12
    • H01L47/026
    • A transferred electron semiconductor device in the form of an oscillator, for example, is fabricated by a molecular beam epitaxy growth process wherein a plurality of semiconductor layers are sequentially grown on a planar substrate. A pair of ohmic contacts are formed on the outer surface of the substrate and the uppermost layer with the resulting structure including two distinct intermediate semiconductor regions, the first being a drift region adapted to exhibit a differential negative resistance due to the transferred electron effect, and the second being a planar doped barrier region for accelerating electrons into the upper valley and injecting them into the drift region. By the use of a planar doped barrier a more uniform electric field is obtained along with a controlled lower barrier height whereby the transfer of electrons to the upper conduction band satellite valley can be made to occur over much shorter times and distances thus extending the upper frequency range of operation.
    • 例如通过分子束外延生长工艺制造振荡器形式的转移电子半导体器件,其中多个半导体层在平面衬底上顺序生长。 在基板的外表面和最上层形成一对欧姆接触,所得到的结构包括两个不同的中间半导体区域,第一个是由于转移的电子效应而表现出差分负电阻的漂移区域,以及 第二个是用于将电子加速到上部谷中并将它们注入到漂移区域中的平面掺杂阻挡区域。 通过使用平面掺杂阻挡层,获得更均匀的电场以及受控的较低势垒高度,由此可以使电子向上导带卫星谷的转移发生在更短的时间和距离上,从而延长上部频率 操作范围。