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1. 发明申请

US20100171139A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20100171139A1
公开(公告)日：2010-07-08
申请号：US12652422
申请日：2010-01-05
申请人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
发明人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/52 , H01L33/62 , H01L2224/48247 , H01L2924/181 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.
摘要翻译：发光器件包括：发光元件; 第一引线，其包括在一个端部中的凹部，所述凹部包括与发光元件接合的第一底表面，通孔和凹口中的至少一个以及能够抑制发射光的泄漏的遮光部分所述发光元件来自所述通孔和所述凹口中的一个; 第二个领先者反对第一个领先; 以及填充所述通孔和所述凹口中的一个的成型体，覆盖所述发光元件，包埋所述第一引线的至少一部分和所述第二引线的至少一部分，并且由半透明树脂制成。

2. 发明授权

US08067779B2 Light emitting device with a recess lead portion 有权
标题翻译：具有凹陷引线部分的发光器件
公开(公告)号：US08067779B2
公开(公告)日：2011-11-29
申请号：US12652422
申请日：2010-01-05
申请人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
发明人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
IPC分类号： H01L33/00 , H01R9/00
CPC分类号： H01L33/60 , H01L33/52 , H01L33/62 , H01L2224/48247 , H01L2924/181 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.
摘要翻译：发光器件包括：发光元件; 第一引线，其包括在一个端部中的凹部，所述凹部包括与发光元件接合的第一底表面，通孔和凹口中的至少一个以及能够抑制发射光的泄漏的遮光部分所述发光元件来自所述通孔和所述凹口中的一个; 第二个领先者反对第一个领先; 以及填充所述通孔和所述凹口中的一个的成型体，覆盖所述发光元件，包埋所述第一引线的至少一部分和所述第二引线的至少一部分，并且由半透明树脂制成。

3. 发明申请

US20060220048A1 Semiconductor light emitting device and semiconductor light emitting unit 有权
公开(公告)号：US20060220048A1
公开(公告)日：2006-10-05
申请号：US11390240
申请日：2006-03-28
申请人： Iwao Matsumoto , Tatsuo Tonedachi
发明人： Iwao Matsumoto , Tatsuo Tonedachi
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01322 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： In various aspects, a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead; a light emitting element mounted on the second section of the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire.

4. 发明授权

US5323658A Coriolis mass flowmeter 失效
标题翻译：科里奥利质量流量计
公开(公告)号：US5323658A
公开(公告)日：1994-06-28
申请号：US77606
申请日：1993-06-17
申请人： Hironobu Yao , Iwao Matsumoto , Masami Kishiro
发明人： Hironobu Yao , Iwao Matsumoto , Masami Kishiro
IPC分类号： G01F1/84
CPC分类号： G01F1/8413 , G01F1/8472 , G01F1/849
摘要： A Coriolis mass flowmeter which measures mass flow rate of a fluid flowing in a measuring pipe fixed to a housing, utilizing Coriolis'force generated in proportion to mass flow rate of the fluid, wherein the measuring pipe includes: a fixation portion to be fixed to the housing; a portion near the fixation portion; and a vibration canceling element attached to the housing and associated with the fixation portion, and for dynamically canceling vibration of the fixation portion of the measuring pipe, or the portion near the fixation portion of the measuring pipe. The measuring pipe may be straight, and a reinforcing member may be provided to cancel vibration of the fixation portion of the measuring pipe.
摘要翻译：一种科里奥利质量流量计，其测量在固定到壳体上的测量管中流动的流体的质量流量，利用与流体的质量流量成比例地产生的科里奥利力，其中测量管包括：固定部分，房屋; 靠近固定部分的部分; 以及安装在壳体上并与固定部分相关联并且用于动态地消除测量管的固定部分或测量管的固定部分附近的部分的振动的振动消除元件。测量管可以是直的，并且可以设置加强件以消除测量管的固定部分的振动。

5. 发明申请

US20110186875A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20110186875A1
公开(公告)日：2011-08-04
申请号：US12886124
申请日：2010-09-20
申请人： Hidenori Egoshi , Kazuhiro Tamura , Hiroaki Oshio , Satoshi Shimizu , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto
发明人： Hidenori Egoshi , Kazuhiro Tamura , Hiroaki Oshio , Satoshi Shimizu , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto
IPC分类号： H01L33/48
CPC分类号： H01L33/48 , H01L24/73 , H01L24/97 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.
摘要翻译：根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。（2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。树脂体覆盖（2×n）引线框和n个LED芯片。

6. 发明申请

US20110186868A1 LED PACKAGE 审中-公开
标题翻译： LED封装
公开(公告)号：US20110186868A1
公开(公告)日：2011-08-04
申请号：US12886911
申请日：2010-09-21
申请人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi , Iwao Matsumoto
发明人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi , Iwao Matsumoto
IPC分类号： H01L33/50 , H01L33/62
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/05599 , H01L2224/4554
摘要： According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一和第二引线框彼此分开。 LED芯片设置在第一和第二引线框架的上方，并且具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。线将一个端子连接到第一引线框架。树脂体覆盖第一和第二引线框架，LED芯片和导线。第一引线框架包括基部和多个延伸部分。从上方观察，线的接合位置位于连接两个或更多个延伸部分的根部的多边形区域之一内。树脂体的外观是LED封装的外观的一部分。

7. 发明授权

US5649754A Illuminating apparatus and a method of manufacturing an edge light conductor for use therein 失效
标题翻译：照明装置及其制造方法
公开(公告)号：US5649754A
公开(公告)日：1997-07-22
申请号：US372102
申请日：1995-01-13
申请人： Iwao Matsumoto
发明人： Iwao Matsumoto
IPC分类号： F21V8/00 , G02B6/00 , G09F13/18
CPC分类号： G02B6/0038 , G02B6/0036 , G02B6/005 , G02B6/0061 , G02B6/0065 , G09F2013/1813 , G09F2013/1831
摘要： An illuminating apparatus has a transparent or semitransparent optical medium in the form of an acrylic plate, two fluorescent tubes for emitting light into the acrylic plate through opposite end surfaces thereof, and a reflecting plate disposed under a lower surface of the acrylic plate for upwardly reflecting the light. The lower surface of the acrylic plate defines a diffusing plane including a plurality of irregular reflector regions distributed thereon. The irregular reflector regions comprise ship-shape patterns arranged in juxtaposition longitudinally of the fluorescent tubes. The diffusing plane further includes modified irregular reflector regions formed where the irregular reflector regions are absent. The modified irregular reflector regions irregularly reflect a less quantity of light than the irregular reflector regions.
摘要翻译：照明装置具有丙烯酸板形式的透明或半透明光学介质，用于通过其相对端面将光发射到丙烯酸板中的两个荧光管和设置在丙烯酸板下表面下方的反射板，用于向上反射光。丙烯酸板的下表面限定了包括分布在其上的多个不规则反射器区域的漫射平面。不规则反射器区域包括沿着荧光管的纵向并列布置的船形图案。漫射平面还包括不规则反射器区域形成的改进的不规则反射区域。改进的不规则反射区域不规则地反射比不规则反射器区域少的光量。

8. 发明申请

US20150125668A1 LIGHT-REFLECTION/LIGHT-TRANSMISSION IMAGE SHEET AND METHOD FOR FORMING LIGHT-REFLECTION/LIGHT-TRANSMISSION IMAGE SHEET 审中-公开
标题翻译：光反射/光传输图像片和形成光反射/光传输图像片的方法
公开(公告)号：US20150125668A1
公开(公告)日：2015-05-07
申请号：US14349192
申请日：2012-05-02
申请人： Iwao Matsumoto
发明人： Iwao Matsumoto
IPC分类号： B44F1/06 , B44F1/02
CPC分类号： B44F1/06 , B44F1/02 , H04N1/4074 , Y10T428/24802
摘要： In order to enable a natural and clear image to appear in both light reflection and light transmission usage modes of a light-reflection/light-transmission image sheet having front and back-side images (3, 4) overlying each other with a sheet-like base material (2) that is reflective and transmissive interposed therebetween, the density distribution of the back-side image (4) of the light-reflection/light-transmission image sheet is obtained by reducing a high-density portion (N1) that exceeds a set density α in the density distribution of the front-side image (3), to the set density α or a density close in value thereto.
摘要翻译：为了使自然而清晰的图像出现在光反射/透光图像片材的光反射和透光图像片材中，其具有彼此重叠的片材形状的前侧和后侧图像（3,4）通过反射和透射的基板材料（2）插入其间，通过降低高反射透光图像片材的高密度部分（N1），获得光反射/透光图像片材的背面图像（4）的密度分布，超过了正面图像（3）的密度分布中的设定密度α到设定密度α或其值接近的密度。

9. 发明授权

US07531845B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US07531845B2
公开(公告)日：2009-05-12
申请号：US11765077
申请日：2007-06-19
申请人： Hiroaki Oshio , Iwao Matsumoto , Mitsuhiro Nawashiro
发明人： Hiroaki Oshio , Iwao Matsumoto , Mitsuhiro Nawashiro
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/46 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.
摘要翻译：一种半导体发光器件，包括：具有凹部的主体，设置在所述凹部的侧壁上的台阶; 安装在所述凹部中的半导体发光元件; 和树脂层。树脂层覆盖主体的凹部的内表面的至少一部分。树脂层的反射率比身体的凹部的内表面高。

10. 发明授权

US07291866B2 Semiconductor light emitting device and semiconductor light emitting unit 有权
标题翻译：半导体发光器件和半导体发光单元
公开(公告)号：US07291866B2
公开(公告)日：2007-11-06
申请号：US11149461
申请日：2005-06-10
申请人： Hiroaki Oshio , Iwao Matsumoto , Takeshi Miyakawa , Hatsuo Takezawa
发明人： Hiroaki Oshio , Iwao Matsumoto , Takeshi Miyakawa , Hatsuo Takezawa
IPC分类号： H01L29/22
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.
摘要翻译：一种半导体发光器件包括：嵌入树脂; 第一引线，其具有嵌入在嵌入树脂中的第一内部引线部分和从嵌入树脂的一个侧面突出的第一外部引线部分; 第二引线，其具有嵌入在嵌入树脂中的第二内引线部分和从与嵌入树脂的一个侧面相对的侧面突出的第二外引线部分; 半导体发光芯片，安装在所述第一内引线部分的暴露于设置在所述嵌入树脂的上表面上的凹部中的部分上; 以及将半导体发光芯片与第二引线连接的线。第一和第二内部引线部分以及第一和第二外部引线部分各自具有基本共面的后表面。第一内引线部分的后表面的至少一部分和第二内引线部分的后表面的至少一部分未被嵌入树脂覆盖，但是露出。

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