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1. 发明授权

US08497521B2 LED package 有权
标题翻译： LED封装
公开(公告)号：US08497521B2
公开(公告)日：2013-07-30
申请号：US12875566
申请日：2010-09-03
申请人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
发明人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
IPC分类号： H01L33/00
CPC分类号： H01L33/48 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.
摘要翻译：根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。线将第一端子连接到第一引线框架。树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向从第一引线框架提取。

2. 发明授权

US07888699B2 Light emitting device including bleed-out preventing notches 有权
标题翻译：发光装置，包括防止漏出的渗漏
公开(公告)号：US07888699B2
公开(公告)日：2011-02-15
申请号：US12155107
申请日：2008-05-29
申请人： Hiroaki Oshio , Kazuhiro Tamura , Masakata Koseki , Hiroko Tsukamoto , Tatsuichiro Maki
发明人： Hiroaki Oshio , Kazuhiro Tamura , Masakata Koseki , Hiroko Tsukamoto , Tatsuichiro Maki
IPC分类号： H01L33/48
CPC分类号： H01L25/167 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.
摘要翻译：发光装置包括：树脂壳体，其具有在壳体的凹部的底部露出的，具有围绕发光元件的反射器部分的凹部，由金属形成的第一引线和第二引线，在预定方向上彼此远离，并且填充在凹部中的树脂密封材料。第一引线包括发光元件安装部分，第一引线连接部分，第一泄漏防止凹口和相对的凹口。第二引线包括保护装置安装部分，第二导线连接部分和第二防止漏出凹口。第一引线和第二引线被布置成使得在预定方向上，发光元件安装部分与第二防止泄漏槽相对，第一引线连接部分与保护装置安装部分相对，并且相对的槽口与第二线连接部分相对。

3. 发明授权

US07884544B2 Semiconductor light emitting device having mixed light emission 有权
标题翻译：具有混合发光的半导体发光器件
公开(公告)号：US07884544B2
公开(公告)日：2011-02-08
申请号：US11216455
申请日：2005-09-01
申请人： Hatsuo Takezawa , Kenji Shimomura , Hiroaki Oshio , Yasuhiro Shirakawa , Tsutomu Ishii
发明人： Hatsuo Takezawa , Kenji Shimomura , Hiroaki Oshio , Yasuhiro Shirakawa , Tsutomu Ishii
IPC分类号： H01J1/62
CPC分类号： H01L33/504 , B29C45/0013 , B29C45/14655 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor light emitting device includes a semiconductor light emitting element that emits light of a first wavelength, at least two kinds of phosphors that absorb the light of the first wavelength and then emit wavelength-converted light, sealing resin in which the at least two kinds of phosphors are dispersed and the semiconductor light emitting element is embedded, and binder resin. Combined bodies in which the at least two kinds of phosphors are combined by the binder resin are dispersed in the sealing resin.
摘要翻译：半导体发光器件包括发射第一波长的光的半导体发光元件，吸收第一波长的光然后发射波长转换的光的至少两种荧光体，其中至少两种的密封树脂的磷光体被分散并且半导体发光元件被嵌入，粘合剂树脂。通过粘合剂树脂将至少两种荧光体组合在一起的组合体分散在密封树脂中。

4. 外观设计

USD578082S1 Light emitting diode 有权
公开(公告)号：USD578082S1
公开(公告)日：2008-10-07
申请号：US29287884
申请日：2007-09-28
申请人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio
设计人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio

5. 发明申请

US20060071591A1 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US20060071591A1
公开(公告)日：2006-04-06
申请号：US11216455
申请日：2005-09-01
申请人： Hatsuo Takezawa , Kenji Shimomura , Hiroaki Oshio , Yasuhiro Shirakawa , Tsutomu Ishii
发明人： Hatsuo Takezawa , Kenji Shimomura , Hiroaki Oshio , Yasuhiro Shirakawa , Tsutomu Ishii
IPC分类号： H01J1/62
CPC分类号： H01L33/504 , B29C45/0013 , B29C45/14655 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor light emitting device comprises: a semiconductor light emitting element that emits light of a first wavelength; at least two kinds of phosphors that absorb the light of the first wavelength and then emit wavelength-converted light; sealing resin in which the at least two kinds of phosphors are dispersed and the semiconductor light emitting element is embedded; and binder resin. Combined bodies in which the at least two kinds of phosphors are combined by the binder resin are dispersed in the sealing resin.
摘要翻译：一种半导体发光器件包括：发射第一波长的光的半导体发光元件; 吸收第一波长的光然后发射波长转换的光的至少两种荧光体; 密封树脂，其中分散有至少两种荧光体和半导体发光元件; 和粘合剂树脂。通过粘合剂树脂将至少两种荧光体组合在一起的组合体分散在密封树脂中。

6. 外观设计

USD471166S1 Light emitting semiconductor device 失效
标题翻译：发光半导体器件
公开(公告)号：USD471166S1
公开(公告)日：2003-03-04
申请号：US29149009
申请日：2001-10-02
申请人： Hiroaki Oshio , Kenji Shimomura , Koichi Nitta
设计人： Hiroaki Oshio , Kenji Shimomura , Koichi Nitta

7. 发明授权

US08525202B2 LED package, method for manufacturing LED package, and packing member for LED package 有权
标题翻译： LED封装，LED封装制造方法，LED封装用包装件
公开(公告)号：US08525202B2
公开(公告)日：2013-09-03
申请号：US12849102
申请日：2010-08-03
申请人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
发明人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
IPC分类号： H01L33/00
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一和第二引线框架彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm或更高的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

8. 发明授权

US08338845B2 LED package and method for manufacturing the same 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08338845B2
公开(公告)日：2012-12-25
申请号：US12868107
申请日：2010-08-25
申请人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
发明人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
IPC分类号： H01L33/00 , H01L27/15 , H01L31/12 , H01L29/04 , H01L31/036
CPC分类号： H01L33/48 , H01L24/97 , H01L33/56 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一引线框架和第二引线框架由金属材料制成，并且彼此分开设置。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。树脂体由肖氏D硬度为25以上的树脂材料制成。此外，树脂体覆盖第一和第二引线框架和LED芯片。并且，树脂体的外观是LED封装的外观。

9. 发明申请

US20110193112A1 LED MODULE 失效
标题翻译： LED模块
公开(公告)号：US20110193112A1
公开(公告)日：2011-08-11
申请号：US12874406
申请日：2010-09-02
申请人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
发明人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
IPC分类号： H01L33/62
CPC分类号： H01L24/97 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.
摘要翻译：根据一个实施例，LED模块包括板，互连和LED封装。互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和边缘表面。并且，树脂体的外观是LED封装的外观。

10. 发明授权

US07719023B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07719023B2
公开(公告)日：2010-05-18
申请号：US11478793
申请日：2006-06-30
申请人： Hiroaki Oshio
发明人： Hiroaki Oshio
IPC分类号： H01L23/043
CPC分类号： H01L25/167 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.
摘要翻译：发光器件包括有效地设置在具有大致椭圆形或细长圆形开口形状的开口的有限空间中的多个芯片。该装置包括：引线，其具有形成在用于将导线接合的部分和用于安装芯片的部分之间的狭缝，从而防止粘合剂的挤出并消除不良接合。

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