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1. 发明授权

US08067779B2 Light emitting device with a recess lead portion 有权
标题翻译：具有凹陷引线部分的发光器件
公开(公告)号：US08067779B2
公开(公告)日：2011-11-29
申请号：US12652422
申请日：2010-01-05
申请人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
发明人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
IPC分类号： H01L33/00 , H01R9/00
CPC分类号： H01L33/60 , H01L33/52 , H01L33/62 , H01L2224/48247 , H01L2924/181 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.
摘要翻译：发光器件包括：发光元件; 第一引线，其包括在一个端部中的凹部，所述凹部包括与发光元件接合的第一底表面，通孔和凹口中的至少一个以及能够抑制发射光的泄漏的遮光部分所述发光元件来自所述通孔和所述凹口中的一个; 第二个领先者反对第一个领先; 以及填充所述通孔和所述凹口中的一个的成型体，覆盖所述发光元件，包埋所述第一引线的至少一部分和所述第二引线的至少一部分，并且由半透明树脂制成。

2. 发明申请

US20130062643A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20130062643A1
公开(公告)日：2013-03-14
申请号：US13422490
申请日：2012-03-16
申请人： Tetsuya MURANAKA
发明人： Tetsuya MURANAKA
IPC分类号： H01L33/36
CPC分类号： H01L24/32 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2224/92247 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light emitting device includes: a first lead, a recess being provided in the first lead; a light emitting element fixed to a bottom surface of the recess via a conductive paste at a back surface on an opposite side to a light emitting surface of the light emitting element; and a second lead disposed away from the first lead and electrically connected to the light emitting element via a metal wire. An area of the bottom surface is larger than an area of the light emitting surface. The paste is put in with a thickness sufficient to cover at least part of a side surface in contact with the light emitting surface and the back surface of the light emitting element and at least part of a wall surface of the recess in the recess.
摘要翻译：根据一个实施例，发光器件包括：第一引线，设置在第一引线中的凹槽; 发光元件经由与发光元件的发光面相反一侧的背面的导电膏固定在凹部的底面上; 以及第二引线，其远离所述第一引线设置并且经由金属线电连接到所述发光元件。底面的面积大于发光面的面积。该膏体的厚度足以覆盖与发光表面和发光元件的背面接触的侧表面的至少一部分以及凹部中凹部的壁表面的至少一部分。

3. 发明授权

US08258697B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08258697B2
公开(公告)日：2012-09-04
申请号：US12969743
申请日：2010-12-16
申请人： Tetsuya Muranaka , Toshihiro Kuroki , Toshiaki Hosoya
发明人： Tetsuya Muranaka , Toshihiro Kuroki , Toshiaki Hosoya
IPC分类号： H01L33/62 , H01L33/64 , H01L33/52
CPC分类号： H01L33/647 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, a bent portion bent toward above the major surface, and a thermally conductive portion extending outward from the die pad portion. The first lead is provided with a slit at an end of a fold. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, the thermally conductive portion, and the one end portion of the second lead, penetrates through the slit, and is made of a resin.
摘要翻译：根据一个实施例，发光器件包括第一引线，发光元件，第二引线和成型体。第一引线包括具有设置在主表面上的主表面和凹部的芯片焊盘部分，朝向主表面上方弯曲的弯曲部分，以及从芯片焊盘部分向外延伸的导热部分。第一引线在折叠的末端设置有狭缝。发光元件结合到凹部的底面。具有一个端部的第二引线与第一引线的一个端部相对。模制体覆盖发光元件，弯曲部分，芯片焊盘部分，导热部分和第二引线的一个端部穿过狭缝，并且由树脂制成。

4. 发明申请

US20110291541A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20110291541A1
公开(公告)日：2011-12-01
申请号：US12969743
申请日：2010-12-16
申请人： Tetsuya Muranaka , Toshihiro Kuroki , Toshiaki Hosoya
发明人： Tetsuya Muranaka , Toshihiro Kuroki , Toshiaki Hosoya
IPC分类号： H01L33/64
CPC分类号： H01L33/647 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, a bent portion bent toward above the major surface, and a thermally conductive portion extending outward from the die pad portion. The first lead is provided with a slit at an end of a fold. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, the thermally conductive portion, and the one end portion of the second lead, penetrates through the slit, and is made of a resin.
摘要翻译：根据一个实施例，发光器件包括第一引线，发光元件，第二引线和成型体。第一引线包括具有设置在主表面上的主表面和凹部的芯片焊盘部分，朝向主表面上方弯曲的弯曲部分，以及从芯片焊盘部分向外延伸的导热部分。第一引线在折叠的末端设置有狭缝。发光元件结合到凹部的底面。具有一个端部的第二引线与第一引线的一个端部相对。模制体覆盖发光元件，弯曲部分，芯片焊盘部分，导热部分和第二引线的一个端部穿过狭缝，并且由树脂制成。

5. 发明申请

US20130062613A1 LIGHT EMITTING DEVICE 失效
标题翻译：发光装置
公开(公告)号：US20130062613A1
公开(公告)日：2013-03-14
申请号：US13432955
申请日：2012-03-28
申请人： Atsushi Takeshita , Yuichi Ikedo , Tetsuya Muranaka
发明人： Atsushi Takeshita , Yuichi Ikedo , Tetsuya Muranaka
IPC分类号： H01L33/62 , H01L33/58
CPC分类号： H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The light emitting element is fixed on the first lead. The second lead is provided away from the first lead and electrically connected to the light emitting element via a metal wire. The, molded body made of a sealing resin covers the light emitting element, end portions of the first lead and the second lead, the light emitting element being fixed on the end portion of the first read, and the metal wire being bonded on the end portion of the second lead. The first groove is provided between first and second portions in a front surface of the second lead, the first portion being in contact with an outer edge of the molded body and the metal wire being bonded on the second portion.
摘要翻译：根据一个实施例，发光器件包括第一引线，发光元件，第二引线和成型体。发光元件固定在第一引线上。远离第一引线提供第二引线，并通过金属线与发光元件电连接。由密封树脂制成的成型体覆盖发光元件，第一引线和第二引线的端部，发光元件固定在第一读取的端部，并且金属线被接合在端部第二引线的一部分。所述第一槽设置在所述第二引线的前表面中的第一和第二部分之间，所述第一部分与所述成型体的外边缘接触，并且所述金属线被接合在所述第二部分上。

6. 发明授权

US08258698B2 Light emitting device having a molded body with a specific barycenter 有权
标题翻译：具有具有特定重心的成型体的发光装置
公开(公告)号：US08258698B2
公开(公告)日：2012-09-04
申请号：US12969752
申请日：2010-12-16
申请人： Tetsuya Muranaka , Yasunori Nagahata
发明人： Tetsuya Muranaka , Yasunori Nagahata
IPC分类号： H01J1/62 , H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2924/19107 , H01L2924/00014
摘要： According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and is made of a resin. A position of barycenter of the molded body is set between a lower surface of the die pad portion and a plane including an upper end of the bent portion.
摘要翻译：根据一个实施例，发光器件包括第一引线，发光元件，第二引线和成型体。第一引线包括具有设置在主表面中的主表面和凹部的芯片焊盘部分和朝向主表面的上方弯曲的弯曲部分。发光元件结合到凹部的底面。具有一个端部的第二引线与第一引线的一个端部相对。模制体覆盖发光元件，弯曲部分，芯片焊盘部分和第二引线的一个端部，并且由树脂制成。成型体的重心的位置设置在模片垫部的下表面和包括弯曲部的上端的平面之间。

7. 发明申请

US20110309736A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20110309736A1
公开(公告)日：2011-12-22
申请号：US12969752
申请日：2010-12-16
申请人： Tetsuya Muranaka , Yasunori Nagahata
发明人： Tetsuya Muranaka , Yasunori Nagahata
IPC分类号： H01L33/58 , H01L33/62
CPC分类号： H01L33/62 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2924/19107 , H01L2924/00014
摘要： According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and is made of a resin. A position of barycenter of the molded body is set between a lower surface of the die pad portion and a plane including an upper end of the bent portion.
摘要翻译：根据一个实施例，发光器件包括第一引线，发光元件，第二引线和成型体。第一引线包括具有设置在主表面中的主表面和凹部的芯片焊盘部分和朝向主表面的上方弯曲的弯曲部分。发光元件结合到凹部的底面。具有一个端部的第二引线与第一引线的一个端部相对。模制体覆盖发光元件，弯曲部分，芯片焊盘部分和第二引线的一个端部，并且由树脂制成。成型体的重心的位置设置在模片垫部的下表面和包括弯曲部的上端的平面之间。

8. 发明申请

US20100171139A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20100171139A1
公开(公告)日：2010-07-08
申请号：US12652422
申请日：2010-01-05
申请人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
发明人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/52 , H01L33/62 , H01L2224/48247 , H01L2924/181 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.
摘要翻译：发光器件包括：发光元件; 第一引线，其包括在一个端部中的凹部，所述凹部包括与发光元件接合的第一底表面，通孔和凹口中的至少一个以及能够抑制发射光的泄漏的遮光部分所述发光元件来自所述通孔和所述凹口中的一个; 第二个领先者反对第一个领先; 以及填充所述通孔和所述凹口中的一个的成型体，覆盖所述发光元件，包埋所述第一引线的至少一部分和所述第二引线的至少一部分，并且由半透明树脂制成。

9. 发明授权

US08610166B2 Light emitting device 失效
标题翻译：发光装置
公开(公告)号：US08610166B2
公开(公告)日：2013-12-17
申请号：US13432955
申请日：2012-03-28
申请人： Atsushi Takeshita , Yuichi Ikedo , Tetsuya Muranaka
发明人： Atsushi Takeshita , Yuichi Ikedo , Tetsuya Muranaka
IPC分类号： H01L33/54
CPC分类号： H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The light emitting element is fixed on the first lead. The second lead is provided away from the first lead and electrically connected to the light emitting element via a metal wire. The, molded body made of a sealing resin covers the light emitting element, end portions of the first lead and the second lead, the light emitting element being fixed on the end portion of the first read, and the metal wire being bonded on the end portion of the second lead. The first groove is provided between first and second portions in a front surface of the second lead, the first portion being in contact with an outer edge of the molded body and the metal wire being bonded on the second portion.
摘要翻译：根据一个实施例，发光器件包括第一引线，发光元件，第二引线和成型体。发光元件固定在第一引线上。远离第一引线提供第二引线，并通过金属线与发光元件电连接。由密封树脂制成的成型体覆盖发光元件，第一引线和第二引线的端部，发光元件固定在第一读取的端部，并且金属线被接合在端部第二引线的一部分。所述第一槽设置在所述第二引线的前表面中的第一和第二部分之间，所述第一部分与所述成型体的外边缘接触，并且所述金属线被接合在所述第二部分上。

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