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1. 发明授权

US5395474A Apparatus and method for etching semiconductor wafer 失效
标题翻译：用于蚀刻半导体晶片的装置和方法
公开(公告)号：US5395474A
公开(公告)日：1995-03-07
申请号：US268547
申请日：1994-07-06
申请人： Hidenao Suzuki , Tatsuya Nishimura , Yoshio Hatada
发明人： Hidenao Suzuki , Tatsuya Nishimura , Yoshio Hatada
IPC分类号： H01L21/302 , H01J37/02 , H01L21/3065 , H01L21/311 , H01L21/3213 , C23F1/02
CPC分类号： H01L21/3065 , H01J37/026 , H01L21/31116 , H01L21/32136
摘要： A semiconductor wafer etching apparatus is capable of anisotropically etching a large-diameter semiconductor wafer with high accuracy without causing the semiconductor wafer to be charged. First, the apparatus cools the wafer in an atmosphere of a nitrogen or a halogen gas so that the wafer adsorbs and is covered by atoms of the gas. Then, a fast atom beam source of the apparatus generates an electrically neutral fast atom beam of gas atoms or molecules to etch the semiconductor wafer. The etching speed is promoted by an interaction of the adsorbed atoms and the fast atom beam.
摘要翻译：半导体晶片蚀刻装置能够高精度地各向异性地蚀刻大直径半导体晶片，而不会导致半导体晶片被充电。首先，该装置在氮气或卤素气体的气氛中冷却晶片，使得晶片吸附并被气体的原子覆盖。然后，该装置的快速原子束源产生气体原子或分子的电中性的快速原子束以蚀刻半导体晶片。蚀刻速度通过吸附原子和快原子束的相互作用来促进。

2. 发明授权

US5432342A Method of and apparatus for generating low-energy neutral particle beam 失效
标题翻译：用于产生低能量中性粒子束的方法和装置
公开(公告)号：US5432342A
公开(公告)日：1995-07-11
申请号：US229780
申请日：1994-04-19
申请人： Tatsuya Nishimura , Hidenao Suzuki
发明人： Tatsuya Nishimura , Hidenao Suzuki
IPC分类号： H05H3/00 , H05H1/24 , H05H3/02
CPC分类号： H05H3/02
摘要： In a low-energy neutral particle beam generating apparatus having a main discharge chamber, a high-density electron beam generated in an electron beam generating unit is introduced into a main discharge chamber where it is diverged by a positive voltage applied to an anode electrode and a multipolar magnetic field formed by a permanent magnet, a main discharge gas introduced into the main discharge chamber is ionized by collision with the diverged electron beam, thereby generating a uniform plasma in the main discharge chamber, low-energy ions are drawn out from the plasma and electrically neutralized by a perforated electrode having a multiplicity of holes, thereby obtaining a low-energy neutral particle beam of large diameter without the need of using a complicated, large-sized apparatus.
摘要翻译：在具有主放电室的低能量中性粒子束产生装置中，在电子束产生单元中产生的高密度电子束被引入主放电室，在主放电室中，通过施加到阳极的正电压而发散，由永磁体形成的多极磁场，通过与发散的电子束的碰撞而导入主放电室的主放电气体被离子化，从而在主放电室中产生均匀的等离子体，低能离子从通过具有多个孔的穿孔电极等离子体和电中和，从而获得大直径的低能量中性粒子束，而不需要使用复杂的大型装置。

3. 发明申请

US20050145482A1 Apparatus and method for processing substrate 审中-公开
标题翻译：基板处理装置及方法
公开(公告)号：US20050145482A1
公开(公告)日：2005-07-07
申请号：US10973350
申请日：2004-10-27
申请人： Hidenao Suzuki , Koji Mishima , Hiroyuki Kanda , Kazufumi Nomura , Kunihito Ide , Kazuyuki Yahiro , Hiroshi Toyoda , Tetsuo Matsuda
发明人： Hidenao Suzuki , Koji Mishima , Hiroyuki Kanda , Kazufumi Nomura , Kunihito Ide , Kazuyuki Yahiro , Hiroshi Toyoda , Tetsuo Matsuda
IPC分类号： C25D7/12 , C25D17/00 , C25D17/06 , C25D21/10 , H01L21/288 , H01L21/3205 , H01L21/68 , H01L21/683
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D17/06
摘要： An apparatus and a method for processing substrate are generally used for apparatuses for wet-type process of substrate, such as an electrolytic processing apparatus for use in forming interconnects by embedding a metal such as copper (Cu) or the like in fine interconnect patterns (recesses) that are formed in a substrate such as a semiconductor wafer and for use in forming bumps for electrical connections. The substrate processing apparatus includes: a substrate holder for holding a substrate; a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate; a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder; and a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode, wherein the substrate holder is designed to rotate the substrate during processing in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.
摘要翻译：用于处理衬底的装置和方法通常用于衬底的湿式处理装置，例如通过将金属（例如铜）（Cu）等嵌入到精细互连图案中而形成互连件的电解处理装置凹部），其形成在诸如半导体晶片的基板中，并且用于形成用于电连接的凸块。基板处理装置包括：用于保持基板的基板保持件; 第一电极，用于接触所述衬底以向所述衬底的处理表面供电; 第二电极，其设置成面对由所述基板保持器保持的所述基板的处理表面; 以及处理液体供应部分，用于将处理液体供应到由基板保持器保持的基板的处理表面与第二电极之间的空间中，其中基板保持器设计成在加工期间使基板旋转，重复减速和/或正常旋转和反向旋转。

4. 发明授权

US06269221B1 Liquid feed vaporization system and gas injection device 失效
公开(公告)号：US06269221B1
公开(公告)日：2001-07-31
申请号：US09662897
申请日：2000-09-15
申请人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
发明人： Kuniaki Horie , Hidenao Suzuki , Tsutomu Nakada , Fumio Kuriyama , Takeshi Murakami , Masahito Abe , Yuji Araki , Hiroyuki Ueyama
IPC分类号： F22B2906
CPC分类号： C23C16/45565 , C23C16/448 , C23C16/45561 , C23C16/4557
摘要： A compact vaporizer system is presented to produce a high quality vapor feed from a liquid feed to be delivered to a chemical vapor deposition processing chamber to produce thin film devices based on highly dielectric or ferroelectric materials such as BaTiO3, SrTiO3 and other such materials. The vaporization apparatus comprises a feed tank for storing the liquid feed; feed delivery means for transporting the liquid feed by way of a feed delivery path; a vaporizer section disposed in the delivery path comprising a high temperature heat exchanger having a capillary tube for transporting the liquid feed and a heat source for externally heating the capillary tube; and a vaporization prevention section disposed upstream of the vaporizer section for preventing effects of the vaporizer section to the liquid feed within the vaporization prevention section.

5. 发明授权

US6053265A High ground-clearance hybrid track/wheel drive 失效
标题翻译：高离地间隙混合轨道/车轮驱动
公开(公告)号：US6053265A
公开(公告)日：2000-04-25
申请号：US354116
申请日：1999-07-15
申请人： Hidenao Suzuki , Ryohei Matsumoto
发明人： Hidenao Suzuki , Ryohei Matsumoto
IPC分类号： B62D55/06 , B62D55/075 , B62D55/084 , B62D51/06
CPC分类号： B62D55/0842 , B62D55/06 , B62D55/075
摘要： A rough-terrain vehicle employs separate track drives located on opposite sides of a vehicle body, like the wheels of a car. The tractor drives can revolve the track to permit track-driven travel. The drives can also halt the tracks relative to the drives and rotated the entire track drive that supports the track in which case the track drive rotates like a wheel. The latter mode provides an ability to traverse very rough surfaces. To provide high ground clearance, the support connecting the track drive to the vehicle body is located above the axis of rotation of the track drive. Almost the entire transmission mechanism for the track drive is confined to a volume enclosed by the loop of the track protecting it. The track drive supports the track on a polar array of wheels, each located along the line that divides the track into two loops.
摘要翻译：崎岖地形的车辆采用位于车身相对两侧的独立轨道驱动器，如汽车车轮。拖拉机驱动器可以旋转轨道，以允许轨道驱动的行驶。驱动器还可以相对于驱动器停止轨道并且旋转支撑轨道的整个轨道驱动器，在这种情况下，轨道驱动器像车轮一样旋转。后一种模式提供了穿过非常粗糙表面的能力。为了提供高的离地间隙，将轨道驱动器连接到车身的支撑件位于轨道驱动器的旋转轴线的上方。轨道驱动器的整个传输机构几乎都被限制在由保护它的轨道的环路所包围的体积上。轨道驱动器支持极地阵列阵列上的轨道，每个轨道沿着将轨道分成两个回路的线。

6. 发明申请

US20100219078A1 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：US20100219078A1
公开(公告)日：2010-09-02
申请号：US12771056
申请日：2010-04-30
申请人： Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
发明人： Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
IPC分类号： C25D21/12 , C25D5/00
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以牢固地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

7. 发明授权

US07736474B2 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US07736474B2
公开(公告)日：2010-06-15
申请号：US11245490
申请日：2005-10-07
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
IPC分类号： C25D17/00 , C25D7/12
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以牢固地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

8. 发明授权

US07479213B2 Plating method and plating apparatus 失效
标题翻译：电镀方法和电镀装置
公开(公告)号：US07479213B2
公开(公告)日：2009-01-20
申请号：US11020068
申请日：2004-12-23
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
IPC分类号： C25D5/10
CPC分类号： C25D17/001 , C25D5/10 , C25D5/18 , C25D7/123 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.
摘要翻译：电镀方法能够根据机械和电化学方法优先将电镀膜完全均匀地沉积在沟槽和通孔中，并且容易地形成具有较高平坦度表面的电镀膜，而不受沟槽形状和通孔形状的变化的影响孔。电镀方法包括第一电镀工艺和第二电镀工艺。通过在阳极和基板之间填充电镀液，将多孔构件放置在电镀液中，反复使多孔构件和基板彼此接触和脱离接触来进行第二电镀工艺，使电流在阳极和衬底，同时多孔构件被保持与衬底接触。

9. 发明申请

US20050139482A1 Plating method and plating apparatus 失效
标题翻译：电镀方法和电镀装置
公开(公告)号：US20050139482A1
公开(公告)日：2005-06-30
申请号：US11020068
申请日：2004-12-23
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima
IPC分类号： C25D5/10 , C25D5/18 , C25D7/12 , H01L21/288 , H01L21/768
CPC分类号： C25D17/001 , C25D5/10 , C25D5/18 , C25D7/123 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.
摘要翻译：电镀方法能够根据机械和电化学方法优先将电镀膜完全均匀地沉积在沟槽和通孔中，并且容易地形成具有较高平坦度表面的电镀膜，而不受沟槽形状和通孔形状的变化的影响孔。电镀方法包括第一电镀工艺和第二电镀工艺。通过在阳极和基板之间填充电镀液，将多孔构件放置在电镀液中，反复使多孔构件和基板彼此接触和脱离接触来进行第二电镀工艺，使电流在阳极和衬底，同时多孔构件被保持与衬底接触。

10. 发明授权

US5979580A High ground-clearance hybrid track/wheel drive 失效
公开(公告)号：US5979580A
公开(公告)日：1999-11-09
申请号：US907409
申请日：1997-08-07
申请人： Hidenao Suzuki , Ryohei Matsumoto
发明人： Hidenao Suzuki , Ryohei Matsumoto
IPC分类号： B62D55/06 , B62D55/075 , B62D55/084 , B62D51/06
CPC分类号： B62D55/0842 , B62D55/06 , B62D55/075
摘要： A rough-terrain vehicle employs separate track drives located on opposite sides of a vehicle body, like the wheels of a car. The tractor drives can revolve the track to permit track-driven travel. The drives can also halt the tracks relative to the drives and rotated the entire track drive that supports the track in which case the track drive rotates like a wheel. The latter mode provides an ability to traverse very rough surfaces. To provide high ground clearance, the support connecting the track drive to the vehicle body is located above the axis of rotation of the track drive. Almost the entire transmission mechanism for the track drive is confined to a volume enclosed by the loop of the track protecting it. The track drive supports the track on a polar array of wheels, each located along the line that divides the track into two loops.

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