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    • 4. 发明申请
    • COMPONENT MOUNTING METHOD
    • 组件安装方法
    • US20090088888A1
    • 2009-04-02
    • US11995166
    • 2006-08-07
    • Takeyuki KawaseYoshiyuki Hattori
    • Takeyuki KawaseYoshiyuki Hattori
    • G06F19/00B23P19/00
    • H05K13/0813H05K13/0417Y10T29/53174
    • The component mounter (100) includes a component return determination apparatus (503) being a computer device for determining whether the electronic component picked up by a suction nozzle is a component to be returned to the component supply unit based on a component type. The component return determination apparatus (503) has: a data storage unit (506) into which pick-up position information (506a), the number of remaining components (506b), component return flag information (506c) are stored; a reuse judgment unit (507) which judges whether the electronic component currently picked up by the suction nozzle is the component to be returned to the component supply unit for reuse; and a component return control unit (508) which obtains pick-up position information of the picked-up component from the pick-up position information (506a) stored in the data storage unit (506) and controls an XY robot so that the component is returned to the pick-up position.
    • 部件安装器(100)包括作为计算机装置的部件返回确定装置(503),用于基于部件类型来确定由吸嘴吸取的电子部件是否要返回到部件供应部件的部件。 分量返回确定装置(503)具有:拾取位置信息(506a),剩余分量数(506b),分量返回标志信息(506c)被存储到的数据存储单元(506) 判断当前由吸嘴吸取的电子部件是否要返回到部件供给部用于再利用的再生判定部(507) 以及从存储在数据存储单元(506)中的拾取位置信息(506a)中获取拾取组件的拾取位置信息的组件返回控制单元(508),并控制XY机器人,使得组件 返回到拾取位置。
    • 7. 发明申请
    • METHOD OF MOUNTING ELECTRONIC PARTS
    • 安装电子部件的方法
    • US20130129468A1
    • 2013-05-23
    • US13813802
    • 2011-06-21
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • H05K13/02
    • H05K13/02H05K13/0061H05K13/08
    • In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms are arranged, and mounted on substrates. In the method, a first substrate and a second substrate different in type from the first substrate are transported by first and second substrate transport lanes, respectively, and a first component to be mounted on the first substrate and a second component to be mounted on the second substrate are supplied by the first and second tray supply mechanisms, respectively. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.
    • 在电子部件安装方法中,从配置有第一和第二托盘供给机构的部件供给部拾取电子部件,并安装在基板上。 在该方法中,与第一基板不同类型的第一基板和第二基板分别由第一和第二基板输送通道传送,并且第一部件将被安装在第一基板上,第二部件被安装在第一基板 第二基板分别由第一和第二托盘供给机构供应。 如果在一个托盘供给机构中使能表示电子部件的拾取不再被进行的停止设置,则控制器禁止安装头进入一个托盘供给机构,并且允许操作者对操作者进行操作 一个托盘供应机构的托盘容纳单元。