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    • 1. 发明申请
    • METHOD OF MOUNTING ELECTRONIC PARTS
    • 安装电子部件的方法
    • US20130129468A1
    • 2013-05-23
    • US13813802
    • 2011-06-21
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • H05K13/02
    • H05K13/02H05K13/0061H05K13/08
    • In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms are arranged, and mounted on substrates. In the method, a first substrate and a second substrate different in type from the first substrate are transported by first and second substrate transport lanes, respectively, and a first component to be mounted on the first substrate and a second component to be mounted on the second substrate are supplied by the first and second tray supply mechanisms, respectively. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.
    • 在电子部件安装方法中,从配置有第一和第二托盘供给机构的部件供给部拾取电子部件,并安装在基板上。 在该方法中,与第一基板不同类型的第一基板和第二基板分别由第一和第二基板输送通道传送,并且第一部件将被安装在第一基板上,第二部件被安装在第一基板 第二基板分别由第一和第二托盘供给机构供应。 如果在一个托盘供给机构中使能表示电子部件的拾取不再被进行的停止设置,则控制器禁止安装头进入一个托盘供给机构,并且允许操作者对操作者进行操作 一个托盘供应机构的托盘容纳单元。
    • 2. 发明申请
    • ELECTRONIC COMPONENT MOUNTING METHOD
    • 电子元件安装方法
    • US20130129467A1
    • 2013-05-23
    • US13813794
    • 2011-06-21
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • H05K13/02
    • H05K13/02H05K13/0434H05K13/0452Y10T29/4913Y10T29/53174
    • In an electronic component mounting method, electronic components are picked up from a component supply unit in which two tray supply mechanisms are arranged, and mounted on substrates. In the method, both of the tray supply mechanisms are allowed to hold trays storing therein the electronic components to be mounted on the substrates. If shortage of the components occurs in one tray supply mechanism during a component mounting process, a target for picking up the electronic components is switched to the other tray supply mechanism. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.
    • 在电子部件安装方法中,从配置有两个托盘供给机构的部件供给部拾取电子部件,并安装在基板上。 在该方法中,允许托盘供给机构保持在其中存储要安装在基板上的电子部件的托盘。 如果在部件安装处理期间在一个托盘供给机构中发生部件的不足,则用于拾取电子部件的目标切换到另一个托盘供给机构。 如果在一个托盘供给机构中使能表示电子部件的拾取不再被进行的停止设置,则控制器禁止安装头进入一个托盘供给机构,并且允许操作者对操作者进行操作 一个托盘供应机构的托盘容纳单元。
    • 3. 发明授权
    • Electronic component mounting method
    • 电子元件安装方法
    • US09521792B2
    • 2016-12-13
    • US13813794
    • 2011-06-21
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • H05K13/02H05K13/04
    • H05K13/02H05K13/0434H05K13/0452Y10T29/4913Y10T29/53174
    • In an electronic component mounting method, electronic components are picked up from a component supply unit in which two tray supply mechanisms are arranged, and mounted on substrates. In the method, both of the tray supply mechanisms are allowed to hold trays storing therein the electronic components to be mounted on the substrates. If shortage of the components occurs in one tray supply mechanism during a component mounting process, a target for picking up the electronic components is switched to the other tray supply mechanism. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.
    • 在电子部件安装方法中,从配置有两个托盘供给机构的部件供给部拾取电子部件,并安装在基板上。 在该方法中,允许托盘供给机构保持在其中存储要安装在基板上的电子部件的托盘。 如果在部件安装处理期间在一个托盘供给机构中发生部件的不足,则用于拾取电子部件的目标切换到另一个托盘供给机构。 如果在一个托盘供给机构中使能表示电子部件的拾取不再被进行的停止设置,则控制器禁止安装头进入一个托盘供给机构,并且允许操作者对操作者进行操作 一个托盘供应机构的托盘容纳单元。
    • 4. 发明授权
    • Method of mounting electronic parts
    • 安装电子零件的方法
    • US09332682B2
    • 2016-05-03
    • US13813802
    • 2011-06-21
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • Teppei KawaguchiTakahiro NodaTakuya YamazakiToru ChikumaYoshiyuki Hattori
    • H05K13/02H05K13/08H05K13/00
    • H05K13/02H05K13/0061H05K13/08
    • In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms are arranged, and mounted on substrates. In the method, a first substrate and a second substrate different in type from the first substrate are transported by first and second substrate transport lanes, respectively, and a first component to be mounted on the first substrate and a second component to be mounted on the second substrate are supplied by the first and second tray supply mechanisms, respectively. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.
    • 在电子部件安装方法中,从配置有第一和第二托盘供给机构的部件供给部拾取电子部件,并安装在基板上。 在该方法中,与第一基板不同类型的第一基板和第二基板分别由第一和第二基板输送通道传送,并且第一部件将被安装在第一基板上,第二部件被安装在第一基板 第二基板分别由第一和第二托盘供给机构供应。 如果在一个托盘供给机构中使能表示电子部件的拾取不再被进行的停止设置,则控制器禁止安装头进入一个托盘供给机构,并且允许操作者对操作者进行操作 一个托盘供应机构的托盘容纳单元。