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1. 发明授权

US09545045B2 Component mounting device and product-type switching method 有权
标题翻译：组件安装装置和产品型切换方式
公开(公告)号：US09545045B2
公开(公告)日：2017-01-10
申请号：US13579717
申请日：2011-11-29
申请人： Satoshi Yamauchi , Takeyuki Kawase
发明人： Satoshi Yamauchi , Takeyuki Kawase
IPC分类号： H05K7/14 , H05K13/08 , H05K13/00
CPC分类号： H05K13/08 , H05K13/0061 , H05K13/085
摘要： In the operation execution step wherein the operation switches are clicked to execute the operation related to product-type switching, if the substrate presence/absence detecting sensors S1, S2 that detect the presence/absence of substrates in the front-side substrate transporting mechanism 11A and rear-side substrate transporting mechanism 11B detect the presence of substrates, it is judged that the manufacturing operation of the corresponding substrate type has not ended, and the input control processing is executed so that the input operation by the operation switch for executing the operation related to product-type switching is prohibited. As a result, it is possible to prevent the problems related to reloading of the mounting program before the manufacturing has ended.
摘要翻译：在操作执行步骤中，单击操作开关以执行与产品型切换相关的操作，如果检测前侧基板传送机构11A中的基板的存在/不存在的基板存在/不存在检测传感器S1，S2 并且后侧基板输送机构11B检测基板的存在，判断对应的基板型的制造操作尚未结束，并且执行输入控制处理，使得通过操作开关执行操作的输入操作与产品类型切换相关是禁止的。结果，可以防止在制造结束之前与安装程序的重新加载有关的问题。

2. 发明申请

US20130247370A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US20130247370A1
公开(公告)日：2013-09-26
申请号：US13992462
申请日：2011-12-07
申请人： Takeyuki Kawase , Kazuhiko Itose
发明人： Takeyuki Kawase , Kazuhiko Itose
IPC分类号： H05K13/04
CPC分类号： H05K13/04 , H05K13/0452 , H05K13/0469 , H05K13/085 , Y10T29/4913 , Y10T29/53174
摘要： An electronic component mounting system configured by linking together a plurality of inspecting-coating machines (M1) and a plurality of electronic component mounting apparatuses (M2) to (M4), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out processing pertinent to any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the inspecting-coating machine (M1) equipped with an inspection head (15) and a coating head (16) is brought into the second operation mode.
摘要翻译：一种电子部件安装系统，其通过将多个检查涂布机（M1）和多个电子部件安装装置（M2）〜（M4）连接在一起而构成，所述电子部件安装装置具有第一安装通道（L1）和第二安装车道（L2）被构造成能够执行与从使一个操作执行机构执行操作性能的第一操作模式中选择的任何一个相关的处理，同时仅将基板输送机构的基板作为对象操作性能机构和第二操作模式，其中一个操作执行机构可以在以多个基板输送机构输送的多个基板作为目标的同时执行操作性能，并且仅仅配备有检查涂布机（M1）具有检查头（15）和涂覆头（16）进入第二操作模式。

3. 发明申请

US20130000114A1 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD 有权
标题翻译：组件安装设备和组件安装方法
公开(公告)号：US20130000114A1
公开(公告)日：2013-01-03
申请号：US13581688
申请日：2012-01-19
申请人： Yoshiyuki Kitagawa , Shuzo Yagi , Takeyuki Kawase
发明人： Yoshiyuki Kitagawa , Shuzo Yagi , Takeyuki Kawase
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/08 , H05K13/085 , Y10S901/20 , Y10T29/4913 , Y10T29/49155 , Y10T29/49904 , Y10T29/49998 , Y10T29/53091 , Y10T29/5313 , Y10T29/53174
摘要： In a component mounting device (1) which has a first mounting lane (L1) and a second mounting lane (L2) and which is structured so as to be able to select either an independence mounting mode or an alternation mounting mode, when device type changing operation is performed with change of the type of boards which are the mounted objects, if a tape feeder float detecting sensor (17) that is provided in proximity of an opening (19) through which a part of the body or the foreign object enters in the component supplying part is, detects a part of the body such as a finger (26) of the operator or the foreign object, operation of the component mounting mechanism which belong to the mounting lane opposite to the mounting lane to which the component supplying part, in which the optical sensor is provided, belongs is stopped.
摘要翻译：在具有第一安装通道（L1）和第二安装通道（L2）的部件安装装置（1）中，其构造为能够选择独立安装模式或交替安装模式，当装置类型如果设置在开口（19）附近的带状供料器浮子检测传感器（17），身体或异物的一部分通过该进给器浮动检测传感器（17）进入，则改变作为安装对象的板类型的改变操作在部件供给部中，检测身体的一部分，例如操作者的手指（26）或异物，属于与安装车道相对的安装车道的部件安装机构的操作，设置有光学传感器的部件被停止。

4. 发明申请

US20090088888A1 COMPONENT MOUNTING METHOD 审中-公开
标题翻译：组件安装方法
公开(公告)号：US20090088888A1
公开(公告)日：2009-04-02
申请号：US11995166
申请日：2006-08-07
申请人： Takeyuki Kawase , Yoshiyuki Hattori
发明人： Takeyuki Kawase , Yoshiyuki Hattori
IPC分类号： G06F19/00 , B23P19/00
CPC分类号： H05K13/0813 , H05K13/0417 , Y10T29/53174
摘要： The component mounter (100) includes a component return determination apparatus (503) being a computer device for determining whether the electronic component picked up by a suction nozzle is a component to be returned to the component supply unit based on a component type. The component return determination apparatus (503) has: a data storage unit (506) into which pick-up position information (506a), the number of remaining components (506b), component return flag information (506c) are stored; a reuse judgment unit (507) which judges whether the electronic component currently picked up by the suction nozzle is the component to be returned to the component supply unit for reuse; and a component return control unit (508) which obtains pick-up position information of the picked-up component from the pick-up position information (506a) stored in the data storage unit (506) and controls an XY robot so that the component is returned to the pick-up position.
摘要翻译：部件安装器（100）包括作为计算机装置的部件返回确定装置（503），用于基于部件类型来确定由吸嘴吸取的电子部件是否要返回到部件供应部件的部件。分量返回确定装置（503）具有：拾取位置信息（506a），剩余分量数（506b），分量返回标志信息（506c）被存储到的数据存储单元（506）判断当前由吸嘴吸取的电子部件是否要返回到部件供给部用于再利用的再生判定部（507）以及从存储在数据存储单元（506）中的拾取位置信息（506a）中获取拾取组件的拾取位置信息的组件返回控制单元（508），并控制XY机器人，使得组件返回到拾取位置。

5. 发明申请

US20090077106A1 COMPONENT DATA DISTRIBUTION METHOD, COMPONENT DATA DISTRIBUTION APPARATUS, AND PROGRAM THEREOF 审中-公开
标题翻译：组件数据分配方法，组件数据分发设备及其程序
公开(公告)号：US20090077106A1
公开(公告)日：2009-03-19
申请号：US12297359
申请日：2007-06-05
申请人： Takeyuki Kawase , Hiroshi Okamura
发明人： Takeyuki Kawase , Hiroshi Okamura
IPC分类号： G06F17/30
CPC分类号： G06Q10/06 , G05B2219/31044 , G05B2219/31288 , G05B2219/31323 , H05K13/085 , Y02P90/04 , Y02P90/185 , Y02P90/24
摘要： A component data distribution method which is executed by a server device (10) and allows distribution of component data between a plurality of terminal devices (20) when a component is mounted on a board includes: a component data collecting step of collecting component data and evaluation data indicating a degree of an operation required to achieve actual production using the component data from a first terminal device; and a component data accumulating step of accumulating the collected component data with the collected evaluation data so as to provide the collected component data for a second terminal device different from the first terminal device.
摘要翻译：一种由服务器装置执行并且当部件安装在电路板上时允许在多个终端装置（20）之间分配组件数据的组件数据分配方法包括：组件数据收集步骤，用于收集组件数据和评估数据，其指示使用来自第一终端设备的组件数据来实现实际生产所需的操作程度; 以及分量数据累积步骤，利用所收集的评估数据累积所收集的分量数据，以便为不同于第一终端设备的第二终端设备提供收集的分量数据。

6. 发明申请

US20070214629A1 DEVICE AND METHOD FOR MOUNTING PART 有权
标题翻译：用于安装零件的装置和方法
公开(公告)号：US20070214629A1
公开(公告)日：2007-09-20
申请号：US11752631
申请日：2007-05-23
申请人： Shigeki Imafuku , Takeyuki Kawase , Yoichi Tanaka , Osamu Okuda , Takanori Yoshitake , Toshiyuki Kino
发明人： Shigeki Imafuku , Takeyuki Kawase , Yoichi Tanaka , Osamu Okuda , Takanori Yoshitake , Toshiyuki Kino
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/49133 , Y10T29/4984 , Y10T29/53039 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved. There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (5). In addition, the nozzle can be elevated in an arc trajectory.
摘要翻译：本发明的目的是提供一种可以缩短喷嘴移动时间的部件安装装置和部件安装方法，从而可以提高生产效率。提供了一种用于控制喷嘴升降装置和喷嘴移动装置的运动位置和运动定时的控制装置。控制装置预先存储位于元件供应单元和电路板之间的障碍物的位置和高度。控制装置与喷嘴在通过部件相机拍摄电子部件之后已经完成通过每个障碍物的时间同步地向下移动喷嘴。或者，控制装置使喷嘴沿路径移动以避免障碍物。此外，在部件安装区域中，喷嘴以部件安装区域移动高度移动，并且部件通过喷嘴从部件安装区域移动高度向下移动而安装。因此，能够缩短喷嘴（5）的升降行程。此外，喷嘴可以以弧形轨迹升高。

7. 发明申请

US20060000085A1 Component mounting apparatus and method 有权
标题翻译：组件安装装置及方法
公开(公告)号：US20060000085A1
公开(公告)日：2006-01-05
申请号：US11222153
申请日：2005-09-09
申请人： Akira Kabeshita , Naoto Mimura , Noriaki Yoshida , Yoshihiko Misawa , Takeyuki Kawase , Tetsutarou Hachimura , Toshiro Nishiwaki , Taira Ishii , Mitsuo Kawate , Hideaki Watanabe
发明人： Akira Kabeshita , Naoto Mimura , Noriaki Yoshida , Yoshihiko Misawa , Takeyuki Kawase , Tetsutarou Hachimura , Toshiro Nishiwaki , Taira Ishii , Mitsuo Kawate , Hideaki Watanabe
IPC分类号： B23P19/00
CPC分类号： H05K13/0061 , H05K13/085 , Y10T29/53178 , Y10T29/53191 , Y10T29/53396
摘要： A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.
摘要翻译：提供能够彼此独立地执行用于两个板的部件保持，部件识别和部件放置的第一安装单元和第二安装单元。独立地布置用于装载和卸载第一板的第一输送路径和用于装载和卸载第二板的第二输送路径。

8. 发明授权

US08595920B2 Component mounting device in which a device type changing operation is performed in one mounting lane without stopping another mounting lane 有权
标题翻译：在一个安装车道中执行装置类型改变操作而不停止另一安装车道的部件安装装置
公开(公告)号：US08595920B2
公开(公告)日：2013-12-03
申请号：US13578382
申请日：2011-11-25
申请人： Satoshi Yamauchi , Takeyuki Kawase
发明人： Satoshi Yamauchi , Takeyuki Kawase
IPC分类号： H05K13/04
CPC分类号： H05K13/0452 , H05K13/085 , Y10T29/49133 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178
摘要： In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.
摘要翻译：在通过选择显示在操作画面（33c）中显示的“文件操作”（35e）等操作操作开关进行操作的操作执行步骤中， 30）在操作面板上，当除了操作对象之外的非物体安装通道执行操作动作时，允许用操作开关输入操作，并且禁止用车道指定开关（36）进行的操作的输入正在生产的第二安装通道（L2）将不会成为操作输入的对象。

9. 发明申请

US20130247369A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US20130247369A1
公开(公告)日：2013-09-26
申请号：US13992090
申请日：2011-12-07
申请人： Takeyuki Kawase , Kazuhiko Itose
发明人： Takeyuki Kawase , Kazuhiko Itose
IPC分类号： H05K13/04
CPC分类号： H05K13/04 , H05K13/0452 , H05K13/085 , Y10T29/4913 , Y10T29/53174
摘要： An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the electronic component mounting apparatus (M5*) equipped with a tray feeder (30) is brought into the second operation mode.
摘要翻译：通过将多个具有第一安装通道（L1）和第二安装通道（L2）的电子部件安装装置（M2）连接到（M5 *）而构成的电子部件安装系统被构造成能够执行从使一个操作性能机构的第一操作模式中选择的任何一个执行操作性能，同时仅将作为对应于操作性能机构的基板传送机构的基板作为目标，并且其中一个操作性能机构可以在将由多个基板输送机构输送的多个基板全部作为目标的同时进行操作性能，并且只有配备有托盘进给器（30）的电子部件安装装置（M5 *）进入第二操作模式。

10. 发明申请

US20120311854A1 COMPONENT MOUNTING DEVICE AND A DEVICE TYPE CHANGING METHOD IN THE COMPONENT MOUNTING DEVICE 有权
标题翻译：组件安装设备和组件安装设备中的设备类型更改方法
公开(公告)号：US20120311854A1
公开(公告)日：2012-12-13
申请号：US13578382
申请日：2011-11-25
申请人： Satoshi Yamauchi , Takeyuki Kawase
发明人： Satoshi Yamauchi , Takeyuki Kawase
IPC分类号： H05K13/04
CPC分类号： H05K13/0452 , H05K13/085 , Y10T29/49133 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178
摘要： In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.
摘要翻译：在通过选择在操作画面（30）中显示的设备类型改变（33c）而显示的文件操作（35e）等操作操作开关（35e）进行与设备类型相关联的操作的操作的操作执行步骤中，操作面板，当除了操作对象之外的非物体安装通道执行操作动作时，允许用操作开关输入操作，并且禁止用车道指定开关（36）进行的操作的输入，使得第二安装生产线（L2）不会成为操作输入的对象。

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