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    • 2. 发明授权
    • Compound semiconductor field effect transistor
    • 复合半导体场效应晶体管
    • US06534790B2
    • 2003-03-18
    • US09796803
    • 2001-03-02
    • Takehiko KatoKazuki OtaHironobu MiyamotoNaotaka IwataMasaaki Kuzuhara
    • Takehiko KatoKazuki OtaHironobu MiyamotoNaotaka IwataMasaaki Kuzuhara
    • H01L2915
    • H01L29/66462H01L29/7785
    • The present invention provides a field effect transistor (FET) having, on a semi-insulating compound semiconductor substrate, a buffer layer; an active layer that includes a channel layer made of a first conductive-type epitaxial growth layer (e.g. InGaAs); source/drain electrodes formed on a first conductive-type contact layer which is formed either on said active layer or on a lateral face thereof; a gate layer made of a second conductive-type epitaxial growth layer (e.g. p+-GaAs); and a gate electrode formed on said gate layer; which further has, between said second conductive-type gate layer and said channel layer, a semiconductor layer (e.g. InGaP) that rapidly lowers the energy of the valance band spreading from said gate layer to said channel layer. The present invention improves withstand voltage characteristic of a FET having a pn junction in a gate region (JFET) and realizes stable operations of a JFET.
    • 本发明提供一种在半绝缘化合物半导体衬底上具有缓冲层的场效应晶体管(FET) 包括由第一导电型外延生长层(例如InGaAs)制成的沟道层的有源层; 源极/漏极,形成在形成在所述有源层上或其侧面上的第一导电型接触层上; 由第二导电型外延生长层(例如p + -GaAs)制成的栅极层; 以及形成在所述栅极层上的栅电极; 在所述第二导电型栅极层和所述沟道层之间还具有快速降低从所述栅极层扩散到所述沟道层的能带的能量的半导体层(例如InGaP)。 本发明提高了在栅极区(JFET)中具有pn结的FET的耐压特性,并且实现了JFET的稳定操作。
    • 6. 发明授权
    • Field effect transistor
    • 场效应晶体管
    • US06624440B2
    • 2003-09-23
    • US10021540
    • 2001-10-30
    • Yasunori BitoNaotaka Iwata
    • Yasunori BitoNaotaka Iwata
    • H01L2906
    • H01L29/66462H01L29/0891H01L29/7783
    • An FET (Field Effect Transistor) has an epitaxial wafer including an Al0.2Ga0.8As gate contact layer. A GaAs gate buried layer doped with Si, Al0.2Ga0.8As wide-recess stopper layer doped with Si, an undoped GaAs layer and a GaAs cap layer doped with Si are sequentially formed on the gate contact layer by epitaxial growth. An electron accumulation layer is formed on the undoped GaAs layer and reduces a potential barrier. This allows electrons to pass through the potential barrier of the AlGaAs layer with higher probability. Because the GaAs layer is not doped with an impurity, electrons are scattered little and achieve higher mobility. It is therefore possible to reduce contact resistance from the cap layer to a channel layer. In addition, sheet resistance sparingly increases because the gate contact layer is not exposed to the outside. An ON resistance as low as 1.4 &OHgr;·mm is achievable which is lower than the conventional ON resistance by 0.2 &OHgr;·mm.
    • FET(场效应晶体管)具有包括Al 0.2 Ga 0.8 As栅极接触层的外延晶片。 通过外延生长,在栅极接触层上依次形成掺杂有Si,Al0.2Ga0.8As宽凹槽停止层,掺杂有Si的未掺杂GaAs层和GaAs覆盖层的GaAs栅极掩埋层。 在未掺杂的GaAs层上形成电子聚集层并减少势垒。 这允许电子以较高的概率穿过AlGaAs层的势垒。 由于GaAs层不掺杂杂质,所以电子散射很小,实现较高的迁移率。 因此可以降低从盖层到沟道层的接触电阻。 此外,由于栅极接触层不暴露于外部,薄层电阻微小地增加。 可以实现低至1.4Ω·μm的导通电阻,其低于传统的ON电阻0.2Ω·mm。
    • 9. 发明授权
    • Passive element circuit
    • 被动元件电路
    • US6072205A
    • 2000-06-06
    • US090533
    • 1998-06-04
    • Keiko YamaguchiNaotaka Iwata
    • Keiko YamaguchiNaotaka Iwata
    • H01L27/04H01L21/822H01L27/01H01L29/80H01L31/112
    • H01L27/01H01L2224/45144H01L2224/48091H01L2924/30107H01L2924/3011
    • A passive element circuit is formed by a spiral inductor, a high-dielectric-constant thin-film capacitor, a via hole, and a bonding pad. By using SrTiO.sub.3 as the high-dielectric-constant thin-film, which exhibits a dielectric constant of 200 up to a frequency of 20 GHz, it is possible to achieve a reduction of the capacitor surface area to approximately 1/30 of the area formerly required when using a SiN.sub.x (dielectric constant up to 6.5). Two high-dielectric-constant thin-film capacitors, a via hole for grounding, and a bonding pad are disposed at the center, which are surrounded by the spiral inductor. To connect the two high-dielectric-constant thin-film capacitors are joined in series, they are formed on one high-dielectric-constant thin-film. A lead from the spiral inductor is made by a metal wire from the bonding pad at the center.
    • 无源元件电路由螺旋电感器,高介电常数薄膜电容器,通孔和接合焊盘构成。 通过使用SrTiO3作为介电常数为200的高介电常数薄膜,直到20GHz的频率,可以使电容器表面积减小到大约+ E,从而使1/30 +使用SiNx(介电常数高达6.5)以前要求的区域。 两个高介电常数薄膜电容器,一个用于接地的通孔和一个接合焊盘设置在中心,被螺旋电感器包围。 为了连接两个高介电常数薄膜电容器串联连接,它们形成在一个高介电常数的薄膜上。 来自螺旋电感器的引线由来自中心的焊盘的金属线制成。
    • 10. 发明授权
    • Depletion mode two-dimensional electron gas field effect transistor and
the method for manufacturing the same
    • 耗散模式二维电子气场效应晶体管及其制造方法
    • US4689646A
    • 1987-08-25
    • US741597
    • 1985-06-05
    • Yoshishige MatsumotoNaotaka Iwata
    • Yoshishige MatsumotoNaotaka Iwata
    • H01L29/812H01L21/20H01L21/268H01L21/324H01L21/338H01L29/04H01L29/15H01L29/778H01L29/80
    • H01L21/268H01L29/04H01L29/155H01L29/7787
    • The depletion mode two-dimensional electron gas field effect transistor comprises a substantially pure semiconductor layer, an impurity doped super lattice semiconductor layer formed on the pure semiconductor layer, the energy band gaps and the electron affinities of the pure semiconductor layer and the super lattice semiconductor layer being selected to produce the two-dimensional electron gas at the surface of the pure semiconductor layer when no bias is applied to the super lattice semiconductor layer, source and drain regions formed separatedly in the super lattice semiconductor layer to reach the pure semiconductor layer, a gate electrode formed on the super lattice semiconductor layer between the source and drain regions, and large energy band gap regions formed at side portions of the gate electrode which do not face the source and drain regions, the large energy band gap regions having an energy band gap larger than the super lattice semiconductor layer and being formed by local annealing to convert the super lattice semiconductor to a mixed semiconductor.
    • 耗尽型二维电子气体场效应晶体管包括基本上纯的半导体层,形成在纯半导体层上的杂质掺杂超晶格半导体层,纯半导体层和超晶格半导体的能带隙和电子亲和力 当在超晶格半导体层中分离形成的超晶格半导体层,源极和漏极区域不施加偏压以到达纯半导体层时,选择在纯半导体层的表面处产生二维电子气的层, 形成在源极和漏极区域之间的超晶格半导体层上的栅电极,以及形成在栅电极的不面向源区和漏区的侧部的大能带隙区,大能带隙区具有能量 带隙大于超晶格半导体层并由本地形成 l退火以将超晶格半导体转换成混合半导体。