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1. 发明授权

US6087597A Connecting member and a connecting method with ball and tapered via 失效
标题翻译：连接构件和球形和锥形通孔的连接方法
公开(公告)号：US6087597A
公开(公告)日：2000-07-11
申请号：US505847
申请日：1995-07-24
申请人： Yuzo Shimada , Yoshimasa Tanaka , Shinichi Hasegawa , Takayuki Suyama
发明人： Yuzo Shimada , Yoshimasa Tanaka , Shinichi Hasegawa , Takayuki Suyama
IPC分类号： H01L23/495 , H01L23/498 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： H05K3/3436 , H01L23/49572 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H05K3/363 , H01L2224/16237 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H05K2201/0209 , H05K2201/09827 , H05K2201/10234 , H05K2201/10666 , H05K2201/10681 , H05K2201/10992 , H05K2203/041 , Y02P70/613
摘要： An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, the first pad facing the second pad; a rigid spherical core interposed between the first and second pads; and solder connecting the first and second pads. The first substrate has a through-hole which is provided through the first substrate at a position of the first pad, at least a part of the solder is positioned in the through-hole and at least a part of the spherical core is received in the through-hole. The through-hole has an inner wall which is continuously tapered from the first surface of the first substrate to the second surface of the first substrate.
摘要翻译：一种包括在其第一表面上具有第一表面，第二表面和第一焊盘的第一基板的电子器件组件（及其形成方法）; 第二基板，具有第一表面，第二表面和在其第二表面上的第二焊盘，所述第一焊盘面向所述第二焊盘; 插入在第一和第二垫之间的刚性球形芯; 以及焊接连接第一和第二焊盘。第一基板具有在第一焊盘的位置处通过第一基板提供的通孔，焊料的至少一部分位于通孔中，并且至少一部分球形芯被接收在通孔中通孔。通孔具有从第一基板的第一表面到第一基板的第二表面连续渐缩的内壁。

2. 发明授权

US5923535A Electronic device assembly 失效
标题翻译：电子设备组装
公开(公告)号：US5923535A
公开(公告)日：1999-07-13
申请号：US959270
申请日：1997-10-28
申请人： Yuzo Shimada , Takayuki Suyama , Shinichi Hasegawa
发明人： Yuzo Shimada , Takayuki Suyama , Shinichi Hasegawa
IPC分类号： H01L23/498 , H05K1/14 , H05K3/00 , H05K3/34 , H05K3/36 , H05K1/03
CPC分类号： H01L23/4985 , H05K3/3436 , H05K3/363 , H01L2224/16225 , H01L2224/73253 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H05K1/141 , H05K2201/096 , H05K2201/09827 , H05K2201/10234 , H05K2201/10666 , H05K2201/10681 , H05K2201/10992 , H05K2203/041 , H05K3/0058 , H05K3/3457 , H05K3/368 , Y02P70/613
摘要： An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.
摘要翻译：电子设备组件包括刚性的第一衬底和第二衬底。第一基板在上表面具有第一焊盘，在第一焊盘的位置具有通孔。第二衬底在其上表面上具有第二衬垫。第一和第二焊盘通过焊料连接。焊料的至少一部分位于第一基板的通孔中。第一基板可以包括柔性基板和刚性板。通孔设置在柔性基板中。第一衬垫设置在柔性衬底的下表面上。刚性板附着在柔性基板上。该板在通孔的位置处具有孔，以使第一垫可达。

3. 发明授权

US5731630A Tape carrier for increasing the number of terminals between the tape carrier and a substrate 失效
标题翻译：用于增加带载体和基底之间的端子数量的带载体
公开(公告)号：US5731630A
公开(公告)日：1998-03-24
申请号：US403626
申请日：1995-03-14
申请人： Takayuki Suyama , Shinichi Hasegawa
发明人： Takayuki Suyama , Shinichi Hasegawa
IPC分类号： H01L21/60 , H01L21/607 , H01L23/31 , H01L23/495 , H01L23/48
CPC分类号： H01L24/80 , H01L23/3107 , H01L23/49572 , H01L2224/16225 , H01L2224/16227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , H01L2924/15151 , H01L2924/15311 , H01L2924/30107 , H01L2924/3025
摘要： A tape carrier for increasing the number of terminals between the tape carrier and a substrate includes a film, a lead, a terminal and a connection. The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions. The lead is provided on the first surface of the film and extends above the opening of the film. The lead is coupled to the device at the opening of the film when the device is received by the first surface of the film. The terminal is provided on the second surface in the first region of the film. The connection connects the lead to the terminal. The lead and the device are connected together by thermocompression bonding with a thermode inserted into the opening of the film.
摘要翻译：用于增加带载体和基底之间的端子数量的带载体包括膜，引线，端子和连接。该膜具有第一和第二表面并包括第一和第二区域。当设备被胶片的第一表面接收时，胶片的第一区域被装置覆盖。该膜在第一和第二区域之间具有开口。引线设置在薄膜的第一表面上并延伸到薄膜的开口之上。当设备被薄膜的第一表面接收时，引线在薄膜的开口处耦合到设备。端子设置在膜的第一区域中的第二表面上。连接将导线连接到端子。引线和器件通过与插入到膜的开口中的热电偶的热压接合而连接在一起。

4. 发明授权

US5699610A Process for connecting electronic devices 失效
标题翻译：连接电子设备的过程
公开(公告)号：US5699610A
公开(公告)日：1997-12-23
申请号：US474019
申请日：1995-06-07
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka , Shinichi Hasegawa
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka , Shinichi Hasegawa
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H05K13/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/01 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457 , Y10T29/49144 , Y10T29/49165
摘要： In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.
摘要翻译：在第一步骤中，制备第一衬底。第一基板具有第一表面，第二表面和它们之间的通孔。在第二步骤中，制备第二衬底。第二基板在第二基板的第一表面上具有第一表面，第二表面和焊盘。在第三步骤中，在第二基板的焊盘上设置焊料。在第四步骤中，第一基板的通孔位于焊料上。第一基板的第二表面和第二基板的第一表面彼此面对。在第五步骤中，焊料被加热以使焊料流入第一衬底的通孔中。在第六步骤中，可以确认第一基板的第一表面上的焊料的外观，以检测焊料的连接。

5. 发明授权

US06403463B1 Method for fabricating a multichip module to improve signal transmission 失效
标题翻译：制造多芯片模块以改善信号传输的方法
公开(公告)号：US06403463B1
公开(公告)日：2002-06-11
申请号：US09440049
申请日：1999-11-15
申请人： Takayuki Suyama
发明人： Takayuki Suyama
IPC分类号： H01L214763
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/3011 , H01L2924/3511
摘要： A multichip module of the present invention includes a substrate having an upper surface, a hole provided on the upper surface of the substrate and a chip provided in the hole. The upper surface of the chip and the upper surface of the substrate forms an even, or substantially even, surface. A first insulating layer is formed on the upper surface of the chip and the upper surface of the substrate and a first wiring layer is formed on the first dielectric layer. A method for manufacturing a multichip module, which includes a substrate having a cavity provided thereon, and a chip, includes providing the chip in the cavity so that the upper surface of the chip and the upper surface of the substrate becomes even, or substantially even. The method also includes forming a first insulating layer on the upper surface of the chip and the upper surface of the substrate, and forming a first wiring layer on the first insulating layer.
摘要翻译：本发明的多芯片模块包括具有上表面的基板，设置在基板的上表面上的孔和设置在孔中的芯片。芯片的上表面和衬底的上表面形成均匀或基本均匀的表面。第一绝缘层形成在芯片的上表面和基板的上表面上，第一布线层形成在第一介电层上。一种用于制造多芯片模块的方法，其包括其上设置有空腔的基板和芯片，包括在所述空腔中提供所述芯片，使得所述芯片的上表面和所述基板的上表面变得均匀或基本均匀。该方法还包括在芯片的上表面和基板的上表面上形成第一绝缘层，并在第一绝缘层上形成第一布线层。

6. 发明授权

US5838064A Supporting member for cooling means and electronic package using the same 失效
标题翻译：冷却装置的支撑构件和使用其的电子封装
公开(公告)号：US5838064A
公开(公告)日：1998-11-17
申请号：US423455
申请日：1995-04-19
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H01L23/10 , H01L23/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/50 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2224/73253 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457
摘要： An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.
摘要翻译：电子包装包括支撑部件，电子装置，载体，基板，冷却装置。支撑构件包括用于支撑板的板和底腿。底脚的第一端连接到板的下表面。载体具有用于接收底部支腿的孔。电子装置连接到载体上并附着到板的下表面。底脚的第二端插入托架的孔中。底脚的第二端连接到基底的上表面。电子设备位于支撑构件的板和基板之间。冷却被附着到板的上表面并由其支撑。

7. 发明授权

US5814535A Supporting member for cooling means, electronic package and method of making the same 失效
标题翻译：冷却装置的支撑构件，电子封装及其制造方法
公开(公告)号：US5814535A
公开(公告)日：1998-09-29
申请号：US573131
申请日：1995-12-15
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H01L21/00 , H01L21/70 , H01L23/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/50 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2224/73253 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457
摘要： An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling means is attached onto and supported by the upper surface of the plate.
摘要翻译：根据本发明的电子封装包括支撑构件，电子装置，载体，基板和冷却装置。支撑构件包括用于支撑板的板和底腿。底脚的第一端连接到板的下表面。载体具有用于接收底部支腿的孔。电子装置连接到载体上并附着到板的下表面。底脚的第二端插入托架的孔中。底脚的第二端连接到基底的上表面。电子设备位于支撑构件的板和基板之间。冷却装置附接到板的上表面并由板的上表面支撑。

8. 发明授权

US5645584A Tympanostomy tube and method for producing the same 失效
标题翻译：鼓膜造口管及其制造方法
公开(公告)号：US5645584A
公开(公告)日：1997-07-08
申请号：US604607
申请日：1996-02-21
申请人： Takayuki Suyama
发明人： Takayuki Suyama
IPC分类号： A61F11/00 , A81F2/18
CPC分类号： A61F11/002
摘要： Disclosed are a tympanostomy tube made of pure titanium or a titanium alloy comprising a lumen formed longitudinally in an elongated tubular member and a concavity inwardly formed on said elongated tubular member in a circumferential direction at right angles to a longitudinal direction thereof, said lumen being longitudinally different in diameter and having a larger diameter at a position at which the concavity is not formed than at a position at which the concavity is formed; and a method for producing a tympanostomy tube comprising the steps of drilling a hole longitudinally in a rod member of pure titanium or a titanium alloy to form an elongated tubular member, and forming a concavity on said elongated tubular member in a circumferential direction at right angles to a longitudinal direction thereof.
摘要翻译：公开了一种由纯钛或钛合金构成的鼓膜造口管，其包括在细长管状构件中纵向形成的内腔和在所述细长管状构件上沿与其纵向方向成直角的圆周方向向内形成的凹部，所述内腔纵向在形成凹部的位置处的直径不同于在形成凹部的位置处的直径较大的直径; 以及用于制造鼓膜造口管的方法，包括以下步骤：在纯钛或钛合金的杆构件中纵向钻孔以形成细长管状构件，并且在所述细长管状构件上沿圆周方向以直角形成凹陷到其纵向方向。

9. 发明授权

US06492723B2 Multichip module 失效
标题翻译：多芯片模块
公开(公告)号：US06492723B2
公开(公告)日：2002-12-10
申请号：US09986884
申请日：2001-11-13
申请人： Takayuki Suyama
发明人： Takayuki Suyama
IPC分类号： H01L2312
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/3011 , H01L2924/3511
摘要： A multichip module of the present invention includes a substrate having an upper surface, a hole provided on the upper surface of the substrate and a chip provided in the hole. The upper surface of the chip and the upper surface of the substrate forms an even, or substantially even, surface. A first insulating layer is formed on the upper surface of the chip and the upper surface of the substrate and a first wiring layer is formed on the first dielectric layer. A method for manufacturing a multichip module, which includes a substrate having a cavity provided thereon, and a chip, includes providing the chip in the cavity so that the upper surface of the chip and the upper surface of the substrate becomes even, or substantially even. The method also includes forming a first insulating layer on the upper surface of the chip and the upper surface of the substrate, and forming a first wiring layer on the first insulating layer.
摘要翻译：本发明的多芯片模块包括具有上表面的基板，设置在基板的上表面上的孔和设置在孔中的芯片。芯片的上表面和衬底的上表面形成均匀或基本均匀的表面。第一绝缘层形成在芯片的上表面和基板的上表面上，第一布线层形成在第一介电层上。一种用于制造多芯片模块的方法，其包括其上设置有空腔的基板和芯片，包括在所述空腔中提供所述芯片，使得所述芯片的上表面和所述基板的上表面变得均匀或基本均匀。该方法还包括在芯片的上表面和基板的上表面上形成第一绝缘层，并在第一绝缘层上形成第一布线层。

10. 发明授权

US06285553B1 Mounting structure for an LSI 失效
标题翻译： LSI的安装结构
公开(公告)号：US06285553B1
公开(公告)日：2001-09-04
申请号：US09370879
申请日：1999-08-10
申请人： Takayuki Suyama , Hironobu Ikeda
发明人： Takayuki Suyama , Hironobu Ikeda
IPC分类号： H05K720
CPC分类号： H01L24/81 , H01L23/32 , H01L23/4006 , H01L2023/4062 , H01L2023/4087 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/00
摘要： A PCB is fixed to a PCB stiffener to be held thereby, while an LSI is fixed to an LSI stiffener to be held thereby. The distal ends of four supporting bars provided in the LSI stiffener are screwed on the PCB stiffener, whereby the two stiffeners are firmly integrated with each other to be prevented from being warped. Since a heat sink can be mounted through tapped holes provided in the LSI stiffener, even if the PCB is a thin board such as a build-up substrate, it is possible to mount the heat sink without any difficulties.
摘要翻译： PCB被固定到要被保持的PCB加强件上，同时将LSI固定到要由其保持的LSI加强件。设置在LSI加强件中的四个支撑杆的远端旋拧在PCB加强件上，由此两个加强件彼此牢固地一体形成，以防止其翘曲。由于可以通过设置在LSI加强件中的螺纹孔安装散热器，所以即使PCB是诸如积聚基板的薄板，也可以没有任何困难地安装散热器。

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