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1. 发明授权

US07260256B2 Method and system for inspecting a pattern 失效
标题翻译：检查图案的方法和系统
公开(公告)号：US07260256B2
公开(公告)日：2007-08-21
申请号：US09571938
申请日：2000-05-16
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto , Chie Shishido
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto , Chie Shishido
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in the Y direction are mixedly present. The cross comparison between a notice point and comparison points, for example which are repetitive pitches away from the notice point, is carried out, and only the portion having the difference which can be found out with any of the comparison points is extracted as a defect candidate, which results in that the portion having the two-dimensional repetition as well as the portion having the repetition only in the X direction or in the Y direction can be inspected. As a result, while the portion, such as an isolated point, having no repetition both in the X direction and in the Y direction is extracted as the defect candidate, the defect candidate is not treated as the defect in the case where the defect candidate of interest occurs regularly in a plurality of objects to be inspected, so that such a defect candidate is excluded to extract only a true defect.
摘要翻译：本发明涉及通过简单的坐标指定来检测缺陷，在检查具有多个图案的物体时，其中具有二维重复的部分和仅在X方向上重复的部分和Y 方向混合存在。执行通知点和比较点之间的交叉比较，例如，距离通知点的重复间距是比较点，并且只有具有任何比较点可以找出的具有差异的部分被提取为缺陷候选，这导致可以检查具有二维重复的部分以及仅在X方向或Y方向上具有重复的部分。结果，虽然提取了在X方向和Y方向上都没有重复的诸如孤立点的部分作为缺陷候选，但是在缺陷候选者的情况下，缺陷候选不被视为缺陷感兴趣的事件定期发生在要检查的多个对象中，因此排除这样的缺陷候选者仅提取真实的缺陷。

2. 发明授权

US06347150B1 Method and system for inspecting a pattern 失效
标题翻译：检查图案的方法和系统
公开(公告)号：US06347150B1
公开(公告)日：2002-02-12
申请号：US08932193
申请日：1997-09-17
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto , Chie Shishido
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto , Chie Shishido
IPC分类号： G06K964
CPC分类号： G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in the Y direction are mixedly present. The cross comparison between a notice point and comparison points, for example, which are repetitive pitches away from the notice point, is carried out, and only the portion having the difference which can be found out with any of the comparison points is extracted as a defect candidate, which results in that the portion having the two-dimensional repetition as well as the portion having the repetition only in the X direction or in the Y direction can be inspected. As a result, while the portion, such as an isolated point, having no repetition both in the X direction and in the Y direction is extracted as the defect candidate, the defect candidate is not treated as the defect in the case where the defect candidate of interest occurs regularly in a plurality of objects to be inspected, so that such a defect candidate is excluded to extract only a true defect.
摘要翻译：本发明涉及通过简单的坐标指定来检测缺陷，在检查具有多个图案的物体时，其中具有二维重复的部分和仅在X方向上重复的部分和Y 方向混合存在。执行通知点与比较点之间的交叉比较，比较点例如是远离通知点的重复间距，并且只有具有任何一个比较点可以发现的具有差异的部分被提取为缺陷候补，这导致可以检查具有二维重复的部分以及仅在X方向或Y方向上具有重复的部分。结果，虽然提取了在X方向和Y方向上都没有重复的诸如孤立点的部分作为缺陷候选，但是在缺陷候选者的情况下，缺陷候选不被视为缺陷感兴趣的事件定期发生在要检查的多个对象中，因此排除这样的缺陷候选者仅提取真实的缺陷。

3. 发明授权

US06376854B2 Method of inspecting a pattern on a substrate 有权
标题翻译：检查基板上的图案的方法
公开(公告)号：US06376854B2
公开(公告)日：2002-04-23
申请号：US09848422
申请日：2001-05-04
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N2188
CPC分类号： G01N21/95607
摘要： A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction which is perpendicular to the first direction; detecting an electron radiated from the substrate by the irradiation of the converged electron beam in which the movement of the table and the scanning of the converged electron beam are synchronized; forming a digital image of the substrate from the detected electron; improving a quality of the digital image by filtering the digital image; and detecting a defect of a pattern formed on the substrate by using the improved quality digital image.
摘要翻译：一种用于检查形成在基板上的图案的方法，包括以下步骤：沿着安装有待检查的基板的第一方向移动工作台，通过沿第二方向扫描会聚的电子束将会聚的电子束照射在基板上其垂直于第一方向; 通过会聚电子束的照射来检测从基板辐射的电子，其中台的移动和会聚电子束的扫描同步; 从检测到的电子形成衬底的数字图像; 通过过滤数字图像来提高数字图像的质量; 以及通过使用改进的质量数字图像来检测在基板上形成的图案的缺陷。

4. 发明授权

US06236057B1 Method of inspecting pattern and apparatus thereof with a differential brightness image detection 有权
标题翻译：用差分亮度图像检测来检查图案及其装置的方法
公开(公告)号：US06236057B1
公开(公告)日：2001-05-22
申请号：US09610954
申请日：2000-07-06
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N2188
CPC分类号： G01N21/95607
摘要： A method and apparatus for inspecting a pattern, a first image of a first area on a sample is acquired by imaging the first area formed as a first pattern, and the first image is memorized. A second image of a second area on the sample is acquired by imaging the second area formed as a second pattern which is to be the same as the first pattern. A defect of the first pattern is detected by acquiring a differential image between the first image and the second image. The detection of the defect includes processing the differential image by using information of brightness corresponding to both of the first image and the second image.
摘要翻译：通过对形成为第一图案的第一区域进行成像，并记录第一图像来获取用于检查图案的样品的第一区域的第一图像的方法和装置。通过对形成为与第一图案相同的第二图案的第二区域成像来获取样品上的第二区域的第二图像。通过获取第一图像和第二图像之间的差分图像来检测第一图案的缺陷。缺陷的检测包括通过使用与第一图像和第二图像两者相对应的亮度的信息来处理差分图像。

5. 发明授权

US6087673A Method of inspecting pattern and apparatus thereof 失效
标题翻译：检查图案及其装置的方法
公开(公告)号：US6087673A
公开(公告)日：2000-07-11
申请号：US81636
申请日：1998-05-20
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N23/20 , G01N21/88 , G01N21/956 , G01N23/225 , G06T1/00 , H01L21/66
CPC分类号： G01N21/95607
摘要： In a method of inspecting a defect and an apparatus thereof, an allowable range for a gradation value of a difference image is determined for each pixel from one pixel or less of position shift quantity between two images to be compared, a variation rate in a local gradation value of an image, and a representative value of the local gradation value. Then, by comparing the gradation value of the difference image with the allowable range determined for each pixel, a pixel, on which the gradation value of the difference image is within the allowable range, is judged to be an non-defective candidate and a pixel, on which the gradation value of the difference image is beyond the allowable range, is judged to be a defective candidate. This reduces the number of false information caused by mismatches attributed to an object to be inspected and an image detecting system, such as an infinitesimal difference in pattern configuration, a difference in the gradation value, a distortion of a pattern, and a position shift, thus making it possible to detect a more minute defect.
摘要翻译：在检查缺陷的方法和装置中，针对要比较的两个图像之间的位置偏移量的一个像素或更少的像素，针对每个像素确定差分图像的灰度值的允许范围，局部变化率图像的灰度值和局部灰度值的代表值。然后，通过将差分图像的灰度值与对于每个像素确定的容许范围进行比较，将差分图像的灰度值在允许范围内的像素判断为无缺陷候选和像素，其中差分图像的灰度值超出允许范围，被判断为缺陷候选。这减少了归因于待检查对象的失配和图像检测系统引起的错误信息的数量，例如图案配置中的无穷小差异，灰度值的差异，图案的失真和位置偏移，从而可以检测到更小的缺陷。

6. 发明授权

US07122796B2 Electron beam inspection method and apparatus and semiconductor manufacturing method and its manufacturing line utilizing the same 有权
标题翻译：电子束检查方法及装置及半导体制造方法及其制造线
公开(公告)号：US07122796B2
公开(公告)日：2006-10-17
申请号：US11003506
申请日：2004-12-06
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
IPC分类号： G01N23/00
CPC分类号： H01J37/28 , H01J2237/2817
摘要： An inspection method and apparatus includes control of an acceleration voltage of an electron beam, irradiation of the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, and detection of at least one of secondary electrons and reflected electrons emanated from the object in response to the irradiation. An image of the object is obtained from the detected electron by using positional information of the stage and inspection or measurement of the object is conducted using and obtained image. In the detection, an electric field in the vicinity of the object mounted on the stage is controlled so that at least one secondary electrons and the reflected electrons emanated from the object in response to the irradiation of the electron beam are decelerated.
摘要翻译：检查方法和装置包括控制电子束的加速电压，将电子束照射到安装在至少在一个方向上连续移动的台上的被检查物体，以及二次电子中的至少一个的检测以及响应于照射从物体发射的反射电子。通过使用舞台的位置信息从被检测的电子获得对象的图像，并使用获得的图像进行对象的检查或测量。在检测中，控制安装在平台上的物体附近的电场，使得响应于电子束的照射而从物体发出的至少一个二次电子和反射电子减速。

7. 发明授权

US06828554B2 Electron beam inspection method and apparatus and semiconductor manufacturing method and its manufacturing line utilizing the same 失效
公开(公告)号：US06828554B2
公开(公告)日：2004-12-07
申请号：US10785949
申请日：2004-02-26
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
IPC分类号： G01N2300
CPC分类号： H01J37/28 , H01J2237/2817
摘要： A method of detecting a defect includes of determining an image acquisition condition for irradiating a converged electron beam onto a specimen and detecting a secondary electron emanated from the specimen, acquiring an image by detecting the secondary electron emanated from the specimen in synchronism with the irradiation of the electron beam, processing the acquired image to detect a defect on the specimen, and outputting information regarding the detected defect. The image acquisition condition is determined based on plural images which are acquired by changing at least one of acceleration condition of the secondary electron and an electrical field in the vicinity of the specimen.

8. 发明授权

US06373054B1 Electron beam inspection method and apparatus and semiconductor manufacturing method and its manufacturing line utilizing the same 有权
公开(公告)号：US06373054B1
公开(公告)日：2002-04-16
申请号：US09752468
申请日：2001-01-03
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
IPC分类号： H01J37304
摘要： An inspection method and apparatus which controls an acceleration voltage of an electron beam, irradiates the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, detects at least one of a secondary electron and a reflected electron emanated from the object by the irradiating, obtains an image of the object from the detected electron by using positional information of the stage, conducts inspection or measurement of the object using the image obtained, and outputs a result of the inspection or the measurement through a network system which is connected to a computer.

9. 发明授权

US06172365B2 Electron beam inspection method and apparatus and semiconductor manufacturing method and its manufacturing line utilizing the same 有权
标题翻译：电子束检查方法及装置及半导体制造方法及其制造线
公开(公告)号：US06172365B2
公开(公告)日：2001-01-09
申请号：US09437313
申请日：1999-11-10
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
IPC分类号： H01J3728
CPC分类号： H01J37/28 , H01J2237/2817
摘要： An electron beam inspection method including the steps of irradiating an electron beam to an object to be inspected, detecting at least one of a secondary electron and a reflected electron emanated from the object by the irradiation of the electron beam, and obtaining an image of the object from the detected electron. The method further includes the steps of controlling an electric field in a neighborhood of the object for filtering the at least one of the secondary and reflected electron emanated from the object so as to control the contrast of the image, detecting at least one of the secondary and reflected electron emanated from the object which passes through the electric field in the neighborhood of the object by the irradiation of the electron beam, and conducting inspection or measurement of the object on the basis of a detected signal of the detection in the controlled electric field.
摘要翻译：一种电子束检查方法，包括以下步骤：将电子束照射到待检查对象，通过电子束的照射检测从物体发射的二次电子和反射电子中的至少一种，并获得物体来自被检测的电子。该方法还包括以下步骤：控制物体附近的电场，以对从物体发出的次级和反射电子中的至少一种进行过滤，以便控制图像的对比度，检测二次以及通过电子束的照射而在物体附近通过电场发射的反射电子，并且根据检测到的受控电场的检测信号进行物体的检查或测量。

10. 发明授权

US5986263A Electron beam inspection method and apparatus and semiconductor manufacturing method and its manufacturing line utilizing the same 失效
标题翻译：电子束检查方法及装置及半导体制造方法及其制造线
公开(公告)号：US5986263A
公开(公告)日：1999-11-16
申请号：US824413
申请日：1997-03-26
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
IPC分类号： G01Q20/00 , G01Q30/04 , G01Q30/02 , G01Q60/00 , H01J37/20 , H01J37/22 , H01J37/256 , H01J37/28 , H01L21/66
CPC分类号： H01J37/28 , H01J2237/2817
摘要： An electron beam inspection method and apparatus. The method includes controlling acceleration voltage of electron beam and electric field on a sample, beam current, beam diameter, image detection rate, image dimensions, precharge, discharge, or a combination of them, exposing an object to the electron beam, detecting in a sensor a physical change generated from the object, and inspecting or measuring the object on the basis of a signal representing the detected physical change. The apparatus includes an electron source (potential E2) for generating an electron beam, a deflector for scanning generated electrons, an objective lens for focusing the electron beam upon the object, a grid (potential E1) disposed between the object and the objective lens, a wafer holder (potential E0) for holding the object, a sensor for detecting generated secondary electrons, a potential controller for controlling the potential E0, E1 and E2, and a storage for storing optimum potential conditions. By changing conditions of an electron optic system such as potential E0, E1 and E2, the acceleration voltage and electric field on the object are controlled. For a material located at least in an upper layer of a plurality of materials forming the object, the secondary electron yield ratio can be made nearly unity and appropriate contrast of an obtained image can be provided with minimized influence of charge up.
摘要翻译：电子束检查方法和装置。该方法包括控制电子束的加速电压和样品上的电场，束电流，光束直径，图像检测率，图像尺寸，预充电，放电或它们的组合，将物体暴露于电子束，在传感器从物体产生的物理变化，以及根据表示检测到的物理变化的信号检查或测量物体。该装置包括用于产生电子束的电子源（电位E2），用于扫描产生的电子的偏转器，用于将电子束聚焦在物体上的物镜，设置在物体和物镜之间的格栅（电位E1）用于保持物体的晶片保持器（电位E0），用于检测产生的二次电子的传感器，用于控制电位E0，E1和E2的电位控制器，以及用于存储最佳电位条件的存储器。通过改变诸如电位E0，E1和E2的电子光学系统的状态，控制对象上的加速电压和电场。对于至少位于形成物体的多种材料的上层中的材料，二次电子屈服比可以几乎一致，并且可以以最小化的充电影响来提供所获得的图像的适当的对比度。

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