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    • 1. 发明申请
    • Surface-Modified Tantalum Oxide Nanoparticles, Preparation Method Thereof, and Contrast Medium for X-Ray Computed Tomography and Highly Dielectric Thin Film Using Same
    • 表面改性钽氧化物纳米颗粒,其制备方法和用于X射线计算机断层摄影的对比介质和使用其的高介电性薄膜
    • US20130065995A1
    • 2013-03-14
    • US13580594
    • 2011-02-22
    • Taeghwan HyeonMyoung Hwan Oh
    • Taeghwan HyeonMyoung Hwan Oh
    • C07F9/00C08L33/12C08K5/50C08K5/544C07F9/50A61K49/04
    • A61K49/0428B82Y5/00
    • The present invention relates to a surface-modified tantalum oxide nanoparticle, a method for preparation thereof, a contrast agent (medium) for X-ray computed tomography, and a highly dielectric (high-K) film using the same. In particular, the present invention is directed to a surface-modified tantalum oxide nanoparticle, a method for preparing surface-modified tantalum oxide nanoparticles, comprising: (i) adding an aqueous phase to an organic solvent which contains a surfactant, to prepare a water-in-oil microemulsion; (ii) introducing a tantalum precursor to said microemulsion; (iii) adding a surface-modifier having an organic silane group or phosphine group to a solution obtained at the step (ii); (iv) removing said organic solvent from a product obtained at the step (iii); and (v) separating surface-modified tantalum oxide nanoparticles from a mixture obtained at the step (iv), a contrast agent for X-ray computed tomography, and a highly dielectric (thin) film using the same.
    • 本发明涉及表面改性的氧化钽纳米颗粒,其制备方法,用于X射线计算机断层摄影的造影剂(介质)和使用其的高电介质(高K)膜。 特别地,本发明涉及一种表面改性的氧化钽纳米颗粒,一种制备表面改性的氧化钽纳米颗粒的方法,包括:(i)将水相加入到含有表面活性剂的有机溶剂中以制备水 油微乳液; (ii)向所述微乳液引入钽前体; (iii)向在步骤(ii)获得的溶液中加入具有有机硅烷基或膦基的表面改性剂; (iv)从步骤(iii)获得的产物中除去所述有机溶剂; 和(v)从步骤(iv)获得的混合物,用于X射线计算机断层摄影的造影剂和使用其的高电介质(薄)膜分离表面改性的氧化钽纳米颗粒。
    • 2. 发明授权
    • Surface-modified tantalum oxide nanoparticles, preparation method thereof, and contrast medium for X-ray computed tomography and highly dielectric thin film using same
    • 表面改性的氧化钽纳米粒子,其制备方法和用于X射线计算机断层摄影的造影剂和使用其的高介电性薄膜
    • US08871310B2
    • 2014-10-28
    • US13580594
    • 2011-02-22
    • Taeghwan HyeonMyoung Hwan Oh
    • Taeghwan HyeonMyoung Hwan Oh
    • B05D1/30A61K49/04B82Y5/00
    • A61K49/0428B82Y5/00
    • The present invention relates to a surface-modified tantalum oxide nanoparticle, a method for preparation thereof, a contrast agent (medium) for X-ray computed tomography, and a highly dielectric (high-κ) film using the same. In particular, the present invention is directed to a surface-modified tantalum oxide nanoparticle, a method for preparing surface-modified tantalum oxide nanoparticles, comprising: (i) adding an aqueous phase to an organic solvent which contains a surfactant, to prepare a water-in-oil microemulsion; (ii) introducing a tantalum precursor to said microemulsion; (iii) adding a surface-modifier having an organic silane group or phosphine group to a solution obtained at the step (ii); (iv) removing said organic solvent from a product obtained at the step (iii); and (v) separating surface-modified tantalum oxide nanoparticles from a mixture obtained at the step (iv), a contrast agent for X-ray computed tomography, and a highly dielectric (thin) film using the same.
    • 本发明涉及表面改性的氧化钽纳米颗粒,其制备方法,用于X射线计算机断层摄影的造影剂(介质)以及使用其的高电介质(高电影)膜。 特别地,本发明涉及一种表面改性的氧化钽纳米颗粒,一种制备表面改性的氧化钽纳米颗粒的方法,包括:(i)将水相加入到含有表面活性剂的有机溶剂中以制备水 油微乳液; (ii)向所述微乳液引入钽前体; (iii)向在步骤(ii)获得的溶液中加入具有有机硅烷基或膦基的表面改性剂; (iv)从步骤(iii)获得的产物中除去所述有机溶剂; 和(v)从步骤(iv)获得的混合物,用于X射线计算机断层摄影的造影剂和使用其的高电介质(薄)膜分离表面改性的氧化钽纳米颗粒。
    • 7. 发明授权
    • CMP slurry and method for polishing semiconductor wafer using the same
    • CMP浆料和使用其的抛光半导体晶片的方法
    • US07736530B2
    • 2010-06-15
    • US11657051
    • 2007-01-24
    • Seung Beom ChoJong Pil KimJun Seok NhoMyoung Hwan OhJang Yul Kim
    • Seung Beom ChoJong Pil KimJun Seok NhoMyoung Hwan OhJang Yul Kim
    • C09K13/04
    • C09G1/02H01L21/3212
    • Disclosed is a CMP slurry in which a compound having a weight-average molecular weight of 30-500 and containing a hydroxyl group (OH), a carboxyl group (COOH), or both, is added to a CMP slurry comprising abrasive particles and water and having a first viscosity, so that the CMP slurry is controlled to have a second viscosity 5-30% lower than the first viscosity. Also disclosed is a method for polishing a semiconductor wafer using the CMP slurry. According to the disclosed invention, the agglomerated particle size of abrasive particles in the CMP slurry can be reduced, while the viscosity of the CMP slurry can be reduced and the global planarity of wafers upon polishing can be improved. Thus, the CMP slurry can be advantageously used in processes for manufacturing semiconductor devices requiring fine patterns and can improve the reliability and production of semiconductor devices through the use thereof in semiconductor processes.
    • 公开了一种CMP浆料,其中将包含重均分子量为30-500并含有羟基(OH),羧基(COOH)或二者)的化合物加入到包含磨料颗粒和水的CMP浆料中 并且具有第一粘度,使得CMP浆料被控制为具有比第一粘度低5-30%的第二粘度。 还公开了使用CMP浆料来研磨半导体晶片的方法。 根据所公开的发明,可以减少CMP浆料中的磨料颗粒的聚集粒度,同时可以减少CMP浆料的粘度,并且可以提高抛光时晶片的全局平面性。 因此,CMP浆料可以有利地用于制造需要精细图案的半导体器件的工艺中,并且可以通过其在半导体工艺中的使用来提高半导体器件的可靠性和生产。