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    • 1. 发明专利
    • Manufacturing method for magnetic memory
    • 磁记忆的制造方法
    • JP2013143548A
    • 2013-07-22
    • JP2012004248
    • 2012-01-12
    • Toshiba Corp株式会社東芝
    • YOSHIKAWA MASAHISASEDO SATOSHIHARAKAWA HIDEAKI
    • H01L21/8246H01L27/105H01L29/82H01L43/08H01L43/12
    • PROBLEM TO BE SOLVED: To achieve an exposure step of a magnetic storage element with excellent controllability.SOLUTION: A manufacturing method for magnetic memory includes the steps of: forming a magnetic storage element film 41 on a lower electrode 40; forming a mask layer 42 on the magnetic storage element film 41; processing the magnetic storage element film 41 using the mask layer 42; covering the processed magnetic storage element film 41 by a protection film 43; forming a high ionization rate film 44 on the protection film 43; depositing an interlayer insulating film 25 on the high ionization rate film 44; exposing the high ionization rate film 44 by thinning the interlayer insulating film 25; exposing the mask layer 42 by etching the high ionization rate film 44 and the protection film 43; and forming an upper electrode 45 on the mask layer 42.
    • 要解决的问题:实现具有优异的可控性的磁存储元件的曝光步骤。解决方案:一种磁存储器的制造方法,包括以下步骤:在下电极40上形成磁存储元件膜41; 在磁存储元件膜41上形成掩模层42; 使用掩模层42处理磁存储元件膜41; 用保护膜43覆盖处理后的磁存储元件膜41; 在保护膜43上形成高电离率膜44; 在高电离率膜44上沉积层间绝缘膜25; 通过使层间绝缘膜25变薄而暴露高电离率膜44; 通过蚀刻高电离率膜44和保护膜43来暴露掩模层42; 并在掩模层42上形成上电极45。
    • 5. 发明专利
    • Magnetoresistive element and magnetic memory
    • 磁性元件和磁记忆
    • JP2008252036A
    • 2008-10-16
    • JP2007094886
    • 2007-03-30
    • Toshiba Corp株式会社東芝
    • KITAGAWA EIJIYOSHIKAWA MASAHISAKISHI TATSUYAYODA HIROAKI
    • H01L43/08H01L21/8246H01L27/105
    • PROBLEM TO BE SOLVED: To reduce further current density required for magnetization reversal.
      SOLUTION: A magnetoresistive element 10 includes a first free layer 15 in which a direction of magnetization changes by action of electrons with spin polarized; a second free layer 13 in which the direction of the magnetization changes by the action of the electrons with the spin polarized; a fixed layer 11 in which the direction of the magnetization is fixed; a first nonmagnetic layer 14 provided between the first free layer 15 and the second free layer 13; and a second nonmagnetic layer 12 provided between the second free layer 13 and the fixed layer 11. The relation between a product Ku1×V1 of a magnetic anisotropy constant Ku1 and activation volume V1 of the first free layer 15, and a product Ku2×V2 of a magnetic anisotropy constant Ku2 and activation volume V2 of the second free layer 13 satisfies Ku1×V1>Ku2×V2.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了减少磁化反转所需的进一步的电流密度。 解决方案:磁阻元件10包括第一自由层15,其中磁化方向随着具有自旋极化的电子的作用而改变; 第二自由层13,其中磁化方向由具有自旋极化的电子的作用而变化; 固定层11,其中固定磁化方向; 设置在第一自由层15和第二自由层13之间的第一非磁性层14; 以及设置在第二自由层13和固定层11之间的第二非磁性层12.将磁各向异性常数Ku1的乘积Ku1×V1与第一自由层15的激活体积V1与乘积Ku2×V2 第二自由层13的磁各向异性常数Ku2和活化体积V2满足Ku1×V1> Ku2×V2。 版权所有(C)2009,JPO&INPIT
    • 10. 发明专利
    • Magnetoresistive effect element and manufacturing method therefor
    • 磁阻效应元件及其制造方法
    • JP2013016587A
    • 2013-01-24
    • JP2011147464
    • 2011-07-01
    • Toshiba Corp株式会社東芝
    • YOSHIKAWA MASAHISASEDO SATOSHIHARAKAWA HIDEAKIOSEGI JUNICHIKISHI TATSUYAHOSOYA KEIJI
    • H01L21/8246H01L27/105H01L29/82H01L43/08H01L43/12
    • H01L27/228H01L43/08H01L43/12
    • PROBLEM TO BE SOLVED: To prevent electrical short circuit due to re-deposition without causing degradation of the element characteristics.SOLUTION: The magnetoresistive effect element includes a storage layer 11 having a variable magnetization direction, a tunnel barrier layer 12 on the storage layer 11, a reference layer 13 having an invariable magnetization direction on the tunnel barrier layer 12, a hard mask layer 14 on the reference layer 13, and a sidewall spacer layer 17 on the sidewall of the reference layer 13 and hard mask layer 14. The storage layer 11 and reference layer 13 have vertical magnetization, and the plane size of the reference layer 13 is smaller than that of the storage layer 11. Difference in size between the storage layer 11 and reference layer 13 is 2 nm or less, and the sidewall spacer layer 17 includes one of diamond, DLC, BN, SiC, BC, AlOand AlN.
    • 要解决的问题:为了防止由于再沉积引起的电气短路而不会导致元件特性的劣化。 解决方案:磁阻效应元件包括具有可变磁化方向的存储层11,存储层11上的隧道势垒层12,在隧道势垒层12上具有不变磁化方向的参考层13,硬掩模 参考层13上的层14和参考层13的侧壁上的侧壁间隔层17和硬掩模层14.存储层11和参考层13具有垂直磁化,参考层13的平面尺寸为 存储层11和参考层13之间的尺寸差异为2nm以下,侧壁间隔层17包括金刚石,DLC,BN,SiC,B,SB SB =“ POST“> 4 C,A1 2 O 3 和AlN。 版权所有(C)2013,JPO&INPIT