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1. 发明专利

JPH06224359A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06224359A
公开(公告)日：1994-08-12
申请号：JP945093
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To securely connect the end part of inner lead with a pad and prevent damage on the pad. CONSTITUTION:Since an inner lead 11 is formed of two layers of metal materials having different thermal expansion coefficients, for instance, 42 alloy 12 and Cu alloy 13, with the 42 alloy 12 having a small thermal expansion coefficient provided in the side of pad 4, the inner lead 11 allows the Cu alloy 13 having a larger thermal expansion coefficient to elongate, and thereby deflects toward the 42 alloy 12 having the smaller thermal expansion coefficient. With this deflection, the end part of the inner lead 11 is to be in contact with the pad 4 of the semiconductor chip 2.

2. 发明专利

JPH06224358A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224358A
公开(公告)日：1994-08-12
申请号：JP944993
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , YAMAMURA YASUSHI , OKANO TATSUHIRO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To ensure high accuracy of alignment between inner lead end portion and a pad to prevent generation of non-contact portions and damages on the pad. CONSTITUTION:The surface of a lead frame of inner lead 11 in the side of a semiconductor chip 2 is half-etched and the half-etched portion 12 is thermally bonded for temporary deposition with a semiconductor chip 2 through a both- side adhesive tape 6. In this case, the half-etched portion 12 is formed in the depth larger than the thickness of both-side adhesive tape 6. After this temporary deposition, a pad 4 of the semiconductor chip 2 is connected with the inner lead end part 13, for example, with electrical plating or the like.

3. 发明专利

JPH06224264A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224264A
公开(公告)日：1994-08-12
申请号：JP944893
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which a semiconductor chip and a lead frame can be surely connected and the damage of the electrodes of the semiconductor device brought about when the inner leads of a lead frame is brought into contact with the electrodes of the semiconductor chip can be prevented and the manufacture thereof. CONSTITUTION:The electrodes 4 of a semiconductor chip 1 with electrodes formed on the surface are connected to the inner leads 3 of a lead frame 2 made of a conductive material, and the other part than the tip in contact with the electrodes 4 of the semiconductor chip 1 in the inner leads 3 is covered with an insulating resin in advance. Next, the tips of the inner leads 3 are brought into contact with the electrodes 4 of the semiconductor chip 1 to align them on the semiconductor chip 1, and then a bonding agent is dropped in the other position than the contact place between the tips and the electrodes 4 of the semiconductor chip 1 from the upper part of the inner leads 3 to temporarily fasten the electrodes 4 of the semiconductor chip 1 and the inner leads 3 together, and then the tips of the inner leads 3 are connected to the electrodes 4 of the semiconductor chip 1 by plating.

4. 发明专利

JPH06140559A LEAD USED FOR CONNECTION WITH ELECTRODE OF SEMICONDUCTOR ELEMENT, AND MOUNTING METHOD THEREOF 失效
公开(公告)号：JPH06140559A
公开(公告)日：1994-05-20
申请号：JP31701691
申请日：1991-11-29
申请人： NIPPON STEEL CORP , TOSHIBA CORP
发明人： TATSUMI KOHEI , ANDO TOSHINORI , ONO TAKAHIDE , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To obtain leads of a TAB tape and a lead frame which can be aligned with electrodes easily and accurately, by forming on the end part of the lead the protrusion of an electric conductor having a specified dimension in height through plating, or by forming the protrusion through bending the end part of the lead within the range of a specified dimension from the farthest end of the lead. CONSTITUTION:On a TAB tape having a Cu lead 2 on a polyimide film 1 of a foundation bed, a resist film is thermocompression-stuck extensively. Thereafter, the resist film of an end part 7 of the lead 2 is exposed and developed to form a window therein, and the end part 7 is plated electrically to so growth-deposit a plating metal as to stick on the surface of the lead 2 in the window. Subsequently, the residual resist film is removed to form on the end part 7 of the lead 2 a protrusion 6 of the plating metal. Also, after the film of the foundation bed in the end part 7 of the lead 2, etc., are removed therefrom to expose the end part 7 of the lead 2 to the outside, the end part 7 is put on a bending die base having a fixed outer die 8a and a movable inner die 8b. Then, the movable inner die 8b is pressed down to bend the end part 7 of the lead 2 within the range of 5-200mum from the farthest end thereof, and the protrusion 6 is formed.

5. 发明专利

JPH05243470A 失效
公开(公告)号：JPH05243470A
公开(公告)日：1993-09-21
申请号：JP5615492
申请日：1992-02-07
申请人： TOSHIBA CORP
发明人： OMORI HIROFUMI , KAGAMI HIDEYO , NAKAMURA SHINICHI , KUDO YOSHIMASA , SHIMIZU SHINYA , ISHIMARU YOKO , ISHII KIMIKO , YOSHIKI MASAHIKO , TOMITA MITSUHIRO
IPC分类号： C22C9/00 , H01L23/48 , H01L23/50
摘要： PURPOSE:To obtain a lead frame having excellent characteristics and high reliability, and its manufacturing method. CONSTITUTION:The base body part of the title lead frame is composed of Fe (5-95wt.%) and Cu (residual), or at least one kind of the following and Cu (residual); Fe (5-95wt.%), Cr (0.1-20wt.%), Ni (0.1-10wt.%), Al (0.01-0.3wt.%), Ti (0.001-3wt.%), V (0.001-1wt.%), Nb (0.01-1wt.%), Zr (0.001-1wt.%), Mg (0.01-1wt.%), Si (0.01-1wt.%), Mn (0.01-1wt.%), P (0.01-1wt.%), Zn (0.01-1wt.%) and B (0.0005-1wt.%). A surface part is obtained by surface-treating the base body part with mixed solution of, e.g. hydrofluoric acid or hydrochloric acid and hydrogen peroxide liquid, and covers the base body part. The ratio of the Cu concentration n1 of the base body part to the Cu concentration n2 of the surface part is n2/n1>1. A Cu2O film of 10-500A in thickness is formed on the uppermost surface of the surface part.

6. 发明专利

JPH05190594A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH05190594A
公开(公告)日：1993-07-30
申请号：JP31483191
申请日：1991-11-28
申请人： TOSHIBA CORP , NIPPON STEEL CORP
发明人： SHIMIZU SHINYA , FUJIZU TAKAO , KUDO YOSHIMASA , ONO TAKAHIDE , TATSUMI KOHEI , ANDO TOSHINORI
IPC分类号： H01L21/60 , B23K101/40
摘要： PURPOSE:To provide a method of manufacturing a semiconductor device where lead terminals can be prevented from being short-circuited to each other even if the lead terminals are arranged at a fine pitch. CONSTITUTION:Inner leads 12 are arranged in array at a prescribed interval on a semiconductor chip 10 where electrode pads 11 have been provided, the inner leads 12 are brought into contact with the electrode pads 11 on the semiconductor chip 10 so as to be electrically connected, and then the inner leads 12 and the pads 11 are set in an atmosphere of metal plating to be jointed together by metal plating.

7. 发明专利

JPH05102384A METHOD OF MANUFACTURING RESIN SEALING TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05102384A
公开(公告)日：1993-04-23
申请号：JP26164191
申请日：1991-10-09
申请人： TOSHIBA CORP
发明人： KUDO YOSHIMASA
IPC分类号： B23K26/00 , H01L21/60 , H01L23/50
摘要： PURPOSE:To form a lead having a minute pitch by a method wherein an electrode of a semiconductor chip is connected to a tip of a lead frame inner lead, a coupling part is cut by laser-machining, and each inner lead is electrically made independent. CONSTITUTION:A tip of a lead frame inner lead 4 is thinned to form a plate- thinned part 4a, and further a coupling part 4b is provided at a tip of the lead frame inner lead 4. A TAB outer lead 2b of a TAB chip and the lead frame inner lead 4 are performed thermocompression bonding, and the TAB chip after a semiconductor chip is mounted is mounted W a lead frame 7. Next, the coupling part 4b is cut by using a laser to separate the lead frame inner lead 4 and electrically made independent each other. Thus, the tips of the lead frame inner leads can minutely be processed and the leads can be connected at narrow lead pitches.

8. 发明专利

JPH0393257A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0393257A
公开(公告)日：1991-04-18
申请号：JP23007089
申请日：1989-09-05
申请人： TOSHIBA CORP
发明人： KUDO YOSHIMASA , KOJIMA SHINJIRO
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To obtain a resin-sealed semiconductor device which is small in size and easy to mount by a method wherein a plurality of outer leads which are drawn out to a single direction from a sealing resin layer are provided and the outer leads are arranged with two or more different pitches and at least two leads are arranged with the respective pitches. CONSTITUTION:Electrodes composing a semiconductor chip are electrically connected to inner leads 15... with fine metal wires made of one type of metal selected from a group composed of gold, aluminum and copper. After a mounting process, a package is formed by a resin-sealing process using a transfer molding method. After unnecessary lead frame parts are removed from the package, outer leads are formed and the bends of the leads are checked, the outer leads 12 which are formed into a zigzag formation are clearly obtained on the side surface of sealing resin layer 16. The outer leads 12 are arranged with two or more different pitches and at least two leads are arranged with the respective pitches.

9. 发明专利

JPH06224265A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224265A
公开(公告)日：1994-08-12
申请号：JP945193
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , TSUKAMOTO TAKETO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which a semiconductor chip can be surely connected to a lead frame and the breakdown of the semiconductor chip due to the electrical damage of the circuit of the semiconductor chip and the internal part can be prevented and also the generation of dimensional displacement from a die at the time of after work. CONSTITUTION:The tips of inner leads 3 are brought into contact the electrodes 4 of a semiconductor chip 1 in advance, and then a double-sided adhesive tape 6 is placed between the semiconductor chip 1 and the inner leads 3 to temporarily fasten them together by thermo compression bonding. Next, the temporarily fastened semiconductor chip 1 and the inner leads 3 are pressed from both sides with two sheets of plating masks 71, 72 having an opening used for supplying plating liquid on one side in a predetermined part, and as occasion demands, an anode corresponding to a lead frame to make a cathode is provided on the non-lead frame side of the plating masks 71, 72, and after that, plating liquid is supplied from the opening of the plating masks 1 to connecting the electrodes 4 of the semiconductor 1 to the inner leads 3 by plating treatment.

10. 发明专利

JPH06224263A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06224263A
公开(公告)日：1994-08-12
申请号：JP944793
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , TSUKAMOTO TAKETO , WATANABE HIROKI , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which the damage of the electrodes of a semiconductor chip brought about when the inner leads of a lead frame is brought into contact with the electrodes of the semiconductor chip can be prevented and also the semiconductor chip and the lead frame can be surely connected. CONSTITUTION:A double-sided adhesive tape 9 is placed between a semiconductor chip 1 with electrodes 4 formed on the surface and the inner leads 3 of a lead from 2 made of a conductive material and is temporarily fastened by thermo compression bonding, and at the same time the electrodes 4 of the semiconductor chip 1 and the inner leads 3 are interconnected by plating, and the tip part of the inner leads 3 is so constituted as to be depressed, and for the double-sided adhesive tape is used a double-sided adhesive tape made up of a bonding agent having high heat contraction.

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