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1. 发明专利

JPH0786332A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0786332A
公开(公告)日：1995-03-31
申请号：JP23188893
申请日：1993-09-17
申请人： TOSHIBA CORP , TOPPAN PRINTING CO LTD
发明人： SHIMIZU SHINYA , OTAKI HIROKO , TSUKAMOTO TAKETO , TOKI SOTARO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To improve reliability of plating bonding in irregularity of height direction of an inner lead by a method wherein a plurality of electrode pads are short-circuited by wiring pattern, and the potential from the lead terminal which is brought into contact with the electrode pads is applied to non-contact electrode parts too. CONSTITUTION:The electrode pads 12 of a semiconductor chip 11 is short- circuited by a wiring pattern 11a. When the semiconductor chip 11 and a lead frame 13 are adhered, at least one of lead terminals 14 is brought into contact with one of the electrode pads 12. As a result, uniform potential can be applied to each electrode pad of the semiconductor chip 11 from the lead terminals 14 when a plating-bonding operation is conducted. Accordingly, potential is applied to each electrode pad 12 when a plating-bonding operation is conducted, highly efficient plated junction can be formed by the growth of a metal-plated layer 15 from both lead terminals 14 and the electrode pad 12, and the reliability of plating bonding can be improved.

2. 发明专利

JPH0794550A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0794550A
公开(公告)日：1995-04-07
申请号：JP23464993
申请日：1993-09-21
申请人： TOSHIBA CORP , TOPPAN PRINTING CO LTD
发明人： SHIMIZU SHINYA , FUJIZU TAKAO , KUDO YOSHIMASA , OTAKI HIROKO , TSUKAMOTO TAKETO , TOKI SOTARO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To enhance the reliability of bonding when a semiconductor device is manufactured by plate bonding the inner lead of a lead frame to an electrode on a semiconductor chip. CONSTITUTION:A protective layer 14 of metal paste is formed on an electrode pad 12 arranged on a semiconductor chip 11, for example. An inner lead 13 of a lead frame is then pressed, at the tip thereof, against the protective layer 14 thus conducting the inner lead 13 and the electrode pad 12 electrically. When a metal plating layer 15 is formed under that state, stabilized plate bonding is achieved.

3. 发明专利

JPH06224265A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224265A
公开(公告)日：1994-08-12
申请号：JP945193
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , TSUKAMOTO TAKETO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which a semiconductor chip can be surely connected to a lead frame and the breakdown of the semiconductor chip due to the electrical damage of the circuit of the semiconductor chip and the internal part can be prevented and also the generation of dimensional displacement from a die at the time of after work. CONSTITUTION:The tips of inner leads 3 are brought into contact the electrodes 4 of a semiconductor chip 1 in advance, and then a double-sided adhesive tape 6 is placed between the semiconductor chip 1 and the inner leads 3 to temporarily fasten them together by thermo compression bonding. Next, the temporarily fastened semiconductor chip 1 and the inner leads 3 are pressed from both sides with two sheets of plating masks 71, 72 having an opening used for supplying plating liquid on one side in a predetermined part, and as occasion demands, an anode corresponding to a lead frame to make a cathode is provided on the non-lead frame side of the plating masks 71, 72, and after that, plating liquid is supplied from the opening of the plating masks 1 to connecting the electrodes 4 of the semiconductor 1 to the inner leads 3 by plating treatment.

4. 发明专利

JPH06224263A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06224263A
公开(公告)日：1994-08-12
申请号：JP944793
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , TSUKAMOTO TAKETO , WATANABE HIROKI , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which the damage of the electrodes of a semiconductor chip brought about when the inner leads of a lead frame is brought into contact with the electrodes of the semiconductor chip can be prevented and also the semiconductor chip and the lead frame can be surely connected. CONSTITUTION:A double-sided adhesive tape 9 is placed between a semiconductor chip 1 with electrodes 4 formed on the surface and the inner leads 3 of a lead from 2 made of a conductive material and is temporarily fastened by thermo compression bonding, and at the same time the electrodes 4 of the semiconductor chip 1 and the inner leads 3 are interconnected by plating, and the tip part of the inner leads 3 is so constituted as to be depressed, and for the double-sided adhesive tape is used a double-sided adhesive tape made up of a bonding agent having high heat contraction.

5. 发明专利

JP2011238849A Solar cell module circuit sheet, solar cell module, and method of manufacturing solar cell module circuit sheet 有权
标题翻译：太阳能电池模块电路板，太阳能电池模块和制造太阳能电池模块电路的方法
公开(公告)号：JP2011238849A
公开(公告)日：2011-11-24
申请号：JP2010110433
申请日：2010-05-12
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUBOTA KENTARO , KUMAI KOICHI , YAMAGUCHI HIROTAKA , TSUKAMOTO TAKETO
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module circuit sheet capable of avoiding a problem such as a short circuit of a circuit pattern and the filling failure of sealing material in a clearance of the circuit pattern, and stably mounting a solar battery cell of a back contact system.SOLUTION: The solar cell module circuit sheet 10 is composed of an insulation layer 11 made from insulating resin; a barrier layer 13 arranged on a rear surface side of the insulation layer 11, and having a steam barrier property, an oxygen barrier property, and an insulating property; and a metal conductive layer 12 arranged on a front surface side of the insulation layer 11, and having the circuit pattern electrically connected to the solar battery cell. The metal conductive layer 12 is buried in a surface of the insulation layer 11, and the surfaces of the metal conductive layer 12 and the insulation layer 11 are positioned on the same plane.
摘要翻译：要解决的问题：提供一种太阳能电池模块电路板，其能够避免诸如电路图案的短路和电路图案的间隙中的密封材料的填充故障等问题，并且稳定地安装太阳能后接触系统的电池。解决方案：太阳能电池模块电路板10由绝缘树脂制成的绝缘层11构成; 布置在绝缘层11的背面侧的阻隔层13，具有隔热性，隔氧性和绝缘性; 以及布置在绝缘层11的前表面侧上的金属导电层12，并且电路图形与太阳能电池单元电连接。金属导电层12埋设在绝缘层11的表面，金属导电层12和绝缘层11的表面位于同一平面上。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011181619A Solar cell module 审中-公开
标题翻译：太阳能电池模块
公开(公告)号：JP2011181619A
公开(公告)日：2011-09-15
申请号：JP2010043010
申请日：2010-02-26
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAI KOICHI , YAMAGUCHI HIROTAKA , KUBOTA KENTARO , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： H01L31/0516 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module provided with an insulating substrate controlling the generation of warpage in the solar cell module. SOLUTION: The solar cell module 1 has: a translucent substrate 2; a plurality of solar cells 5; and the insulating substrate 3 containing an electric wiring, wherein the plurality of cells 5 are sealed by a sealing layer 6 between the translucent substrate 2 and the insulating substrate 3. The translucent substrate 3 is a glass panel with a thickness of 2-4 mm, and the solar cells 5 are crystalline solar cells with a thickness of not more than 100-300 μm which are arranged staggered via gaps. This solar cell module 1 satisfies following formulas when the warpage (unit: μm) of the solar module 1 is Y, and the product of the elastic modulus E (unit: GPa) and the thermal expansion coefficient α (unit: ppm) of the insulating substrate 3 is X. A formula (1): Y≤12.88X+521.7. A formula (2): Y≥0.0324X+83.69. A formula (3): Y≤1,000, X≤700. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种设置有控制太阳能电池组件翘曲产生的绝缘基板的太阳能电池模块。太阳能电池模块1具有透光性基板2，多个太阳能电池5; 以及包含电布线的绝缘基板3，其中多个单元5由透光性基板2和绝缘基板3之间的密封层6密封。透光性基板3为厚度为2-4mm的玻璃面板太阳能电池5是通过间隙配置的厚度不大于100〜300μm的结晶太阳能电池。当太阳能电池模块1的翘曲（单位：μm）为Y时，该太阳能电池模块1满足下列公式，弹性模量E（单位：GPa）与热膨胀系数α（单位：ppm）的乘积绝缘基板3为X.式（1）：Y≤12.88X+ 521.7。公式（2）：Y≥0.0324X+ 83.69。公式（3）：Y≤1,000，X≤700。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011159749A Solar cell module 有权
标题翻译：太阳能电池模块
公开(公告)号：JP2011159749A
公开(公告)日：2011-08-18
申请号：JP2010019454
申请日：2010-01-29
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAI KOICHI , YAMAGUCHI HIROTAKA , KUBOTA KENTARO , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： Y02A30/17 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module 1 constituted so that solar cell modules themselves, or a solar cell module and an electronic apparatus are easily connected to each other, and maintainability can be improved. SOLUTION: The solar cell module 1 including a wiring board 10 having wiring 12 formed on a top surface of an insulating base 11 so as to electrically connect solar cells 30 to one another, and a plurality of solar cells 30 arranged on the top surface of the wiring board 10 and electrically connected to the wiring 12, is provided with a junction box 60 having a frame 61 provided integrally with the wiring board 10 and fixed to at least the wiring board 10, power lines 62, 63 laid while enclosed by the frame 61, and electrically connected to the wiring 12, and a connection terminal electrically connected to the power lines 62, 63 and enabled to be electrically connected from outside the frame 61. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供太阳能电池模块本身或者太阳能电池模块和电子设备彼此容易连接而构成的太阳能电池模块1，可以提高维护性。解决方案：太阳能电池模块1包括具有布线12的布线板10，布线板10形成在绝缘基底11的顶表面上，以将太阳能电池30彼此电连接，并且多个太阳能电池30布置在布线基板10的上表面与布线12电连接，设有接线盒60，接线盒60具有与布线板10一体设置并固定在至少布线板10上的框架61，电力线62,63被放置由框架61包围并电连接到布线12，以及电连接到电源线62,63并能够从框架61的外部电连接的连接端子。（C）2011，JPO＆INPIT

8. 发明专利

JP2011159748A Insulating substrate for solar cell, solar cell module, and method of manufacturing insulating substrate for solar cell 审中-公开
标题翻译：用于太阳能电池的绝缘衬底，太阳能电池模块以及太阳能电池制造绝缘衬底的方法
公开(公告)号：JP2011159748A
公开(公告)日：2011-08-18
申请号：JP2010019453
申请日：2010-01-29
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAI KOICHI , YAMAGUCHI HIROTAKA , KUBOTA KENTARO , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an insulating substrate for solar cell that prevents warpage making a reverse surface side convex from occurring in a back-contact type solar cell module, to provide a solar cell module using the insulating substrate for solar cell, and to provide a method of manufacturing the insulating substrate for solar cell. SOLUTION: The insulating substrate 10 for solar cell is composed of: an insulating material 11 made of a composite material containing fiber and resin and having solar cells arranged on a top surface thereof; and a circuit layer 12 laminated on the reverse surface of the insulating material 11 and electrically connected to the solar cell through-holes 11a bored in the insulating material 11 along a thickness. Here, uneven structures A are formed on the reverse surface of the insulating material 11. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种防止在背接触型太阳能电池模块中发生反面侧凸起的翘曲的太阳能电池用绝缘基板，提供使用太阳能电池用绝缘基板的太阳能电池模块并且提供一种制造太阳能电池用绝缘基板的方法。太阳能电池用绝缘基板10由以下部分构成：绝缘材料11由包含纤维和树脂的复合材料制成并且具有布置在其顶表面上的太阳能电池; 以及层叠在绝缘材料11的背面上的电路层12，并沿着厚度与绝缘材料11中钻出的太阳能电池通孔11a电连接。这里，在绝缘材料11的相反表面上形成不均匀结构A.版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011159725A Base for solar cell module, method of manufacturing the same, and solar cell module 审中-公开
标题翻译：太阳能电池模块的基座，其制造方法和太阳能电池模块
公开(公告)号：JP2011159725A
公开(公告)日：2011-08-18
申请号：JP2010018974
申请日：2010-01-29
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUBOTA KENTARO , KUMAI KOICHI , YAMAGUCHI HIROTAKA , TSUKAMOTO TAKETO , TOMONO TAKAO , YOSHIZAWA KENICHI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To prevent cracking of a solar cell during heating.
SOLUTION: A flexible insulating resin 27, which includes no meshed fiber, is bonded onto one surface of a PET film 26. The insulating resin 27 forming an insulating layer 2 is one of an epoxy resin, an epoxy acrylate resin, a polyimide resin, and a urethane resin. A conductive layer 28 composed of copper is provided on the surface of the insulating layer 2 on the opposite side from the PET film 26. The PET film 26 is peeled thereafter and a barrier layer 4 is provided on the surface of the insulating layer 2 where the PET film 26 is peeled to obtain a base for a solar cell module.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止在加热期间太阳能电池的破裂。解决方案：将不含啮合纤维的柔性绝缘树脂27粘接在PET膜26的一个表面上。形成绝缘层2的绝缘树脂27是环氧树脂，环氧丙烯酸酯树脂，聚酰亚胺树脂和聚氨酯树脂。在绝缘层2的与PET膜26相反的一侧的表面上设置由铜构成的导电层28.此后，剥离PET膜26，在绝缘层2的表面上设置阻挡层4，剥离PET膜26，得到太阳能电池模块用基材。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2011077367A Lead frame for led light emitting element 有权
标题翻译： LED发光元件引线框架
公开(公告)号：JP2011077367A
公开(公告)日：2011-04-14
申请号：JP2009228364
申请日：2009-09-30
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： MANIWA SUSUMU , TODA JUNKO , SAWADAISHI MASASHI , TSUKAMOTO TAKETO
IPC分类号： H01L33/54 , H01L23/48
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED light emitting element that has high adhesion between a sealing resin laminated on a filling resin and the lead frame. SOLUTION: The lead frame 80 for the LED light emitting element includes: a pad 2 having a mounting surface A on which an LED chip 10 is mounted, an electrode 3 having a connection surface C electrically connected to the LED chip 10; and the filling resin 4 for resin-molding the pad 2 and the electrode 3, and further includes a transparent sealing resin 5 laminated on a surface of the filling resin 4 where the mounting surface A and connection surface C are exposed where a part of at least one of the pad 2 and the electrode 3 is protruded from the surface of the filling resin 4. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在层压在填充树脂上的密封树脂与引线框架之间具有高粘合性的LED发光元件的引线框架。解决方案：用于LED发光元件的引线框架80包括：安装有LED芯片10的安装面A的焊盘2，具有与LED芯片10电连接的连接面C的电极3; 以及用于树脂模制垫2和电极3的填充树脂4，并且还包括层叠在填充树脂4的表面上的透明密封树脂5，其中安装表面A和连接表面C暴露在一部分垫片2和电极3中的至少一个从填充树脂4的表面突出。版权所有：（C）2011，JPO＆INPIT

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