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1. 发明专利

JPH0786332A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0786332A
公开(公告)日：1995-03-31
申请号：JP23188893
申请日：1993-09-17
申请人： TOSHIBA CORP , TOPPAN PRINTING CO LTD
发明人： SHIMIZU SHINYA , OTAKI HIROKO , TSUKAMOTO TAKETO , TOKI SOTARO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To improve reliability of plating bonding in irregularity of height direction of an inner lead by a method wherein a plurality of electrode pads are short-circuited by wiring pattern, and the potential from the lead terminal which is brought into contact with the electrode pads is applied to non-contact electrode parts too. CONSTITUTION:The electrode pads 12 of a semiconductor chip 11 is short- circuited by a wiring pattern 11a. When the semiconductor chip 11 and a lead frame 13 are adhered, at least one of lead terminals 14 is brought into contact with one of the electrode pads 12. As a result, uniform potential can be applied to each electrode pad of the semiconductor chip 11 from the lead terminals 14 when a plating-bonding operation is conducted. Accordingly, potential is applied to each electrode pad 12 when a plating-bonding operation is conducted, highly efficient plated junction can be formed by the growth of a metal-plated layer 15 from both lead terminals 14 and the electrode pad 12, and the reliability of plating bonding can be improved.

2. 发明专利

JPH06224262A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06224262A
公开(公告)日：1994-08-12
申请号：JP944693
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , UEDA RYUJI , YAMAMURA YASUSHI , HORII KAZUYUKI , FUJIZU TAKAO , KUDO YOSHIMASA , KATO TOSHIHIRO , SHIMIZU SHINYA , YANAGIDA SATORU
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which the damage of the electrodes of a semiconductor chip brought about when the inner leads of a lead frame is brought into contact with the electrodes of the semiconductor chip can be prevented and also the semiconductor chip can be surely connected to the lead frame. CONSTITUTION:A double-sided adhesive tape 6 is placed between a semiconductor 1 with electrodes 4 formed on the surface and the inner leads 3 of a lead frame made of a conductive material and is temporarily fastened by thermocompression bonding and at the same time the electrodes 4 and the inner leads 3 are interconnected by plating, and the tips of the inner leads 3 are brought into contact with the electrodes 4 of the semiconductor chip 1 in advance and at the same time a soft metal-plating 8 is formed in at least one tip part nearer to the tip-side part than the double-sided adhesive tape 6 of the inner leads 3.

3. 发明专利

JPH06224261A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06224261A
公开(公告)日：1994-08-12
申请号：JP944593
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , HORII KAZUYUKI , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which the damage of the electrode of a semiconductor chip can be prevented by relaxing a stress applied to the semiconductor chip when a lead frame and an inner lead are brought into contact with each other and also the semiconductor chip and the lead frame can be surely connected. CONSTITUTION:A double-sided adhesive tape 6 is placed between a semiconductor chip 1 with electrodes 4 formed on the surface and the inner leads 3 of a lead frame 2 made of a conductive material and is temporarily fastened by thermo compression bonding and at the same time the electrodes 4 of the semiconductor chip 1 and the inner leads 3 are interconnected by plating, and the tips of the inner leads 3 is brought into contact with the electrodes 4 of the semiconductor chip 1 in advance and at the same time a notch is provided in a least one place nearer to the tip-side part than the double-sided adhesive tape 6 of the inner leads 3.

4. 发明专利

JPH06224359A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06224359A
公开(公告)日：1994-08-12
申请号：JP945093
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To securely connect the end part of inner lead with a pad and prevent damage on the pad. CONSTITUTION:Since an inner lead 11 is formed of two layers of metal materials having different thermal expansion coefficients, for instance, 42 alloy 12 and Cu alloy 13, with the 42 alloy 12 having a small thermal expansion coefficient provided in the side of pad 4, the inner lead 11 allows the Cu alloy 13 having a larger thermal expansion coefficient to elongate, and thereby deflects toward the 42 alloy 12 having the smaller thermal expansion coefficient. With this deflection, the end part of the inner lead 11 is to be in contact with the pad 4 of the semiconductor chip 2.

5. 发明专利

JPH06224358A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224358A
公开(公告)日：1994-08-12
申请号：JP944993
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , YAMAMURA YASUSHI , OKANO TATSUHIRO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To ensure high accuracy of alignment between inner lead end portion and a pad to prevent generation of non-contact portions and damages on the pad. CONSTITUTION:The surface of a lead frame of inner lead 11 in the side of a semiconductor chip 2 is half-etched and the half-etched portion 12 is thermally bonded for temporary deposition with a semiconductor chip 2 through a both- side adhesive tape 6. In this case, the half-etched portion 12 is formed in the depth larger than the thickness of both-side adhesive tape 6. After this temporary deposition, a pad 4 of the semiconductor chip 2 is connected with the inner lead end part 13, for example, with electrical plating or the like.

6. 发明专利

JPH06224264A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224264A
公开(公告)日：1994-08-12
申请号：JP944893
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which a semiconductor chip and a lead frame can be surely connected and the damage of the electrodes of the semiconductor device brought about when the inner leads of a lead frame is brought into contact with the electrodes of the semiconductor chip can be prevented and the manufacture thereof. CONSTITUTION:The electrodes 4 of a semiconductor chip 1 with electrodes formed on the surface are connected to the inner leads 3 of a lead frame 2 made of a conductive material, and the other part than the tip in contact with the electrodes 4 of the semiconductor chip 1 in the inner leads 3 is covered with an insulating resin in advance. Next, the tips of the inner leads 3 are brought into contact with the electrodes 4 of the semiconductor chip 1 to align them on the semiconductor chip 1, and then a bonding agent is dropped in the other position than the contact place between the tips and the electrodes 4 of the semiconductor chip 1 from the upper part of the inner leads 3 to temporarily fasten the electrodes 4 of the semiconductor chip 1 and the inner leads 3 together, and then the tips of the inner leads 3 are connected to the electrodes 4 of the semiconductor chip 1 by plating.

7. 发明专利

JPH0794550A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0794550A
公开(公告)日：1995-04-07
申请号：JP23464993
申请日：1993-09-21
申请人： TOSHIBA CORP , TOPPAN PRINTING CO LTD
发明人： SHIMIZU SHINYA , FUJIZU TAKAO , KUDO YOSHIMASA , OTAKI HIROKO , TSUKAMOTO TAKETO , TOKI SOTARO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To enhance the reliability of bonding when a semiconductor device is manufactured by plate bonding the inner lead of a lead frame to an electrode on a semiconductor chip. CONSTITUTION:A protective layer 14 of metal paste is formed on an electrode pad 12 arranged on a semiconductor chip 11, for example. An inner lead 13 of a lead frame is then pressed, at the tip thereof, against the protective layer 14 thus conducting the inner lead 13 and the electrode pad 12 electrically. When a metal plating layer 15 is formed under that state, stabilized plate bonding is achieved.

8. 发明专利

JPH06224342A LEAD FRAME AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224342A
公开(公告)日：1994-08-12
申请号：JP945293
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , OKANO TATSUHIRO , TANAKA SATOSHI , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L23/50
摘要： PURPOSE:To provide a lead frame wherein alignment accuracy of the tip end of an inner lead and a pad is increased and no non-contact portion is produced and the pad is prevented from being damaged. CONSTITUTION:A lead frame is constructed such that in a half-etching process the tip ends of inner lead terminals 21 are connected through a common plate 22, and in this state at least one portion of the tip ends of inner lead terminals 21 is rendered to half-etching. In this case, the portion to which the half-etching is applied is the side of a semiconductor chip on the inner lead terminals 21 oppositely disposed to the pad sides. Then, in a cutting process, the tip ends of the inner lead terminals 21 are cut and the common portion is removed whereby the inner leads are formed. Further, in a bending process, the inner leads are inclined at the base thereof to the pad side.

9. 发明专利

JPH06224265A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224265A
公开(公告)日：1994-08-12
申请号：JP945193
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , TSUKAMOTO TAKETO , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which a semiconductor chip can be surely connected to a lead frame and the breakdown of the semiconductor chip due to the electrical damage of the circuit of the semiconductor chip and the internal part can be prevented and also the generation of dimensional displacement from a die at the time of after work. CONSTITUTION:The tips of inner leads 3 are brought into contact the electrodes 4 of a semiconductor chip 1 in advance, and then a double-sided adhesive tape 6 is placed between the semiconductor chip 1 and the inner leads 3 to temporarily fasten them together by thermo compression bonding. Next, the temporarily fastened semiconductor chip 1 and the inner leads 3 are pressed from both sides with two sheets of plating masks 71, 72 having an opening used for supplying plating liquid on one side in a predetermined part, and as occasion demands, an anode corresponding to a lead frame to make a cathode is provided on the non-lead frame side of the plating masks 71, 72, and after that, plating liquid is supplied from the opening of the plating masks 1 to connecting the electrodes 4 of the semiconductor 1 to the inner leads 3 by plating treatment.

10. 发明专利

JPH06224263A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06224263A
公开(公告)日：1994-08-12
申请号：JP944793
申请日：1993-01-22
申请人： TOPPAN PRINTING CO LTD , TOSHIBA CORP
发明人： OTAKI HIROKO , TSUKAMOTO TAKETO , WATANABE HIROKI , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a semiconductor device in which the damage of the electrodes of a semiconductor chip brought about when the inner leads of a lead frame is brought into contact with the electrodes of the semiconductor chip can be prevented and also the semiconductor chip and the lead frame can be surely connected. CONSTITUTION:A double-sided adhesive tape 9 is placed between a semiconductor chip 1 with electrodes 4 formed on the surface and the inner leads 3 of a lead from 2 made of a conductive material and is temporarily fastened by thermo compression bonding, and at the same time the electrodes 4 of the semiconductor chip 1 and the inner leads 3 are interconnected by plating, and the tip part of the inner leads 3 is so constituted as to be depressed, and for the double-sided adhesive tape is used a double-sided adhesive tape made up of a bonding agent having high heat contraction.

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