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1. 发明专利

JP2006253501A Coating and developping device, and its manufacturing method 有权
标题翻译：涂料和开发设备及其制造方法
公开(公告)号：JP2006253501A
公开(公告)日：2006-09-21
申请号：JP2005069723
申请日：2005-03-11
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKUMOTO MASAMI , HAYASHI SHINICHI , HAYASHIDA YASUSHI , MATSUOKA NOBUAKI , KIMURA YOSHIO , UEDA KAZUNARI , ITO AKIRA
IPC分类号： H01L21/027
CPC分类号： H01L21/67742 , G03F7/162 , H01L21/6715 , H01L21/67173 , H01L21/67178
摘要： PROBLEM TO BE SOLVED: To cope with both cases that a antireflection film is formed or not when forming the antireflection film on and beneath a resist film, and achieve space saving. SOLUTION: Three-layer unit blocks B3 to B5 for forming a coating film and two-layer unit blocks B1, B2 for developing are alternately laminated on a treatment block S2. As a first or a second antireflection film 31, 33 for forming the antireflection film beneath or on the resist film and a coating unit 32 are formed at the respective unit blocks B3 to B5 for forming the coating film, the space saving can be achieved when forming the antireflection film on and beneath the resist film irrespective of both the caseses that the antireflection film is formed or not on and beneath the resist film. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了应对在抗蚀剂膜上和下面形成抗反射膜时形成抗反射膜的两种情况，并且节省空间。解决方案：用于形成涂膜的三层单元块B3至B5和用于显影的两层单元块B1，B2交替层压在处理块S2上。作为形成涂膜的各单元块B3〜B5，形成第一或第二防反射膜31,33，用于在抗蚀膜上形成防反射膜上的防反射膜和涂覆单元32，可以实现节省空间，在抗蚀剂膜上和下方形成抗反射膜，而不管形成抗反射膜的两种情况与抗蚀剂膜上和下方是否形成。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006216614A Coating and developing apparatus 有权
标题翻译：涂料和开发设备
公开(公告)号：JP2006216614A
公开(公告)日：2006-08-17
申请号：JP2005025509
申请日：2005-02-01
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKUMOTO MASAMI , HAYASHI SHINICHI , HAYASHIDA YASUSHI , MATSUOKA NOBUAKI , KIMURA YOSHIO , UEDA KAZUNARI , ITO AKIRA
IPC分类号： H01L21/027 , B05C11/08 , B05C13/02
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67178 , H01L21/67207 , H01L21/67745
摘要： PROBLEM TO BE SOLVED: To provide a coating and developing apparatus that can obtain a high conveyance efficiency, is capable of maintenance by appropriately restraining the height of the apparatus, and can block an increase in an installation area by appropriately restraining the length of the apparatus. SOLUTION: A unit block having a carrying means for carrying units for performing coating treatment before exposure to light and the substrate between the units, and a unit block having a carrying means for carrying units for performing development treatment after exposure to light and the substrate between the units are separated up and down. And the units for performing coating treatment before exposure to light are dispersed to a first laminated block and a second laminated one in front and in rear, and further the layer of both the laminated block sections is used properly depending on whether a reflection prevention film is applied to the upper or lower portion of a resist film. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供可以获得高输送效率的涂覆和显影装置，能够通过适当地限制装置的高度来维持，并且可以通过适当地限制长度来阻止安装面积的增加的装置。解决方案：具有用于承载单元的承载装置的单元块，用于在曝光之前执行涂覆处理和各单元之间的基板;以及单元块，具有用于承载单元，用于在曝光后进行显影处理; 单元之间的基板上下分离。并且在曝光之前进行涂布处理的单元分散到第一层叠块和前后两层叠体，进一步根据防反射膜是否正确地使用两层叠块部的层施加到抗蚀剂膜的上部或下部。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004214696A Apparatus and method for treating substrate 审中-公开
标题翻译：用于处理基板的装置和方法
公开(公告)号：JP2004214696A
公开(公告)日：2004-07-29
申请号：JP2004093794
申请日：2004-03-26
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： UEDA KAZUNARI , HAYASHI SHINICHI , IIDA NARIAKI , MATSUYAMA YUJI , DEGUCHI YOICHI
IPC分类号： H01L21/677 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for treating a substrate which can reduce the influence of the time required for controlling the temperature of substrate, on the reduction of the throughput as much as possible, and to provide a substrate treating apparatus which can accurately perform a temperature control in a unit for treating liquid to a substrate. SOLUTION: Each heat treatment unit of ten steps G3-G5 and each application treatment unit of five steps G1 and G2 are arranged at the periphery of a first main wafer transfer A1 and a second main wafer transfer A2, and in the heat treatment unit G3-G5, by transferring the wafer W while controlling the temperature of the wafer W using an apparatus C for controlling temperature and transferring, the influence of the time required for controlling the temperature of the substrate, on the reduction of the throughput can be reduced as much as possible. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种可以减少控制基板温度所需的时间的影响的基板的处理装置和方法，尽可能地降低生产量，并提供一种基板处理装置，其可以在用于将液体处理到基板的单元中精确地进行温度控制。解决方案：在第一主晶片转印A1和第二主晶片转印体A2的周边配置有10个步骤G3-G5的各热处理单元和5个阶梯G1，G2的各施工处理单元，处理单元G3-G5，通过使用用于控制温度和转印的设备C控制晶片W的温度同时传送晶片W，控制基板的温度所需的时间对生产能力的降低的影响可以尽可能减少。版权所有（C）2004，JPO＆NCIPI

4. 发明专利

JP2001189368A SUBSTRATE-TREATING APPARATUS AND METHOD 失效
公开(公告)号：JP2001189368A
公开(公告)日：2001-07-10
申请号：JP2000278874
申请日：2000-09-13
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , HAYASHI SHINICHI , IIDA NARIAKI , MATSUYAMA YUJI , DEGUCHI YOICHI
IPC分类号： G03F7/30 , B05C9/14 , B05C13/00 , B65G49/00 , B65G49/07 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a substrate-treating apparatus and method for reducing influence that is given from the time required for the temperature-control treatment of a substrate to the reduction in throughput, and the substrate-treating device for accurately controlling the temperature in a treatment unit for treating liquid for the substrate. SOLUTION: Each of the five stages of application treatment unit parts G1 and G2 of each of the ten stages in heat treatment unit parts G3-G5 is arranged around first and second main wafer conveyance parts A1 and A2, and the temperature of a wafer W is controlled by a temperature control/conveyance device C at the heat treatment unit parts G3-G5 and at the same time the wafer W is carried, thus reducing the influence given to reduction in throughput, by the time required to conduct the temperature-control treatment of a substrate.

5. 发明专利

JP2001155981A PROCESSING SYSTEM FOR SUBSTRATE 失效
公开(公告)号：JP2001155981A
公开(公告)日：2001-06-08
申请号：JP33847699
申请日：1999-11-29
申请人： TOKYO ELECTRON LTD
发明人： HARADA KOJI , UEDA KAZUNARI
IPC分类号： H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a processing system for a substrate, in which interference of heat by gas flow between heating process units and cooling process units is suppressed. SOLUTION: In a processing station 3 of a coating/developing process system, a partition plate 55 that partitions a region S, where a group G3 of processing units containing pre-baking units 32 or 33 and so on located on upper steps than a cooling unit 30 and a region T other than that, is installed. An ascending current of air is generated in the region S by an air supply unit 60 to allow the air that is warmed by the heat from the pre-baking unit 32 or 33 to escape, so as not to influence the temperature of the cooling unit 30 located on the downside.

6. 发明专利

JP2001057335A DEVICE AND METHOD FOR SUBSTRATE TREATMENT 失效
公开(公告)号：JP2001057335A
公开(公告)日：2001-02-27
申请号：JP2000167899
申请日：2000-06-05
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , KUDO HIROYUKI
IPC分类号： G03F7/30 , F24F7/06 , H01L21/027 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To suppress fluctuation in a pressure in a treating chamber to the utmost and also eliminate an adverse effect on a treatment of a semiconductor wafer, which is associated with the fluctuation in the pressure. SOLUTION: In a substrate treatment device, a ventilation unit 61 for ventilating from the upper part toward the lower part in a treating chamber 51, and exhaust tubes 71 and 72 for exhausing from the lower part in the chamber 51, are provided. At least, one out of the interval between shot dampers 65 and the aperture between autodampers 73 is controlled by a controller 80 interlocking with fluctuation in a pressure in this chamber 51, a ventilation quantity or an exhaust quantity is controlled and the pressure in the chamber 51 is maintained almost constant.

7. 发明专利

JP2000353653A SUBSTRATE PLACEMENT DEVICE 失效
公开(公告)号：JP2000353653A
公开(公告)日：2000-12-19
申请号：JP16395599
申请日：1999-06-10
申请人： TOKYO ELECTRON LTD
发明人： HARADA KOJI , UEDA KAZUNARI , INADA HIROICHI
IPC分类号： H01L21/683 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a placement device which surely supports a substrate with a support member, while being placed at a prescribed position. SOLUTION: For a substrate process placement device in a pre-baking device 17 for heating, a support member 81 for supporting a substrate W is turned outwardly. The support member 81, rotated in advance to open, closes while rotating when placing the substrate W, so that a guide part of the support member 81 guides the substrate W to a prescribed position. The support member 81 is pushed up to be opened outward by a push-up member 75, which moves vertically being interlocked with a rising/falling pin 80.

8. 发明专利

JP2000306973A TREATMENT SYSTEM 失效
公开(公告)号：JP2000306973A
公开(公告)日：2000-11-02
申请号：JP11145299
申请日：1999-04-19
申请人： TOKYO ELECTRON LTD
发明人： INADA HIROICHI , UEDA KAZUNARI
IPC分类号： H01L21/677 , H01L21/00 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To prevent increase in the number of components by a method wherein a substrate is conveyed between a plurality of treatment units which execute a prescribed treatment to the substrate, and an imaging means which images the inside of the treatments units is installed at a conveyance apparatus which conveys the substrate. SOLUTION: Two pairs of tweezers 57, 58 are provided at the upper part and the lower part of a conveyance base 56 to hold a wafer in a wafer conveyance means 54. The tweezers 57, 58 are moved freely in the front direction and the rear direction by a motor which is built in the conveyance base 56, and the wafer which is held between the tweezers 57, 58 is conveyed. In addition, a CCD-camera support member 59 is provided on the tweezers 57, 58, and the CCD-camera support member 59 is moved freely in the front direction and the rear direction by the motor which is built in the conveyance base 56. In addition, a CCD camera 61 which images in the horizontal direction is provided at the tip upper part of the CCD-camera support member 59. A laser displacement meter 62 which detects a height displacement in the lower direction is mounted at the tip lower part.

9. 发明专利

JP2000124301A CONTAINER MOUNTING UNIT, CONTAINER HOUSING APPARATUS AND TREATING APPARATUS 失效
公开(公告)号：JP2000124301A
公开(公告)日：2000-04-28
申请号：JP29109098
申请日：1998-10-13
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , MATSUSHITA MICHIAKI , ITO KAZUHIKO
IPC分类号： B65D85/86 , B65G49/07 , H01L21/673 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To increase the container housing capacity of a container mounting unit by providing a third position for keeping in standby a substrate container between a first position where a substrate to be treated is taken in and out of the substrate container and a second position where the substrate container is taken in and out between an external conveyor. SOLUTION: A waiting part (third position) 31 is provided for staying a plurality of carrier cassettes CR between a cassette mount (second position) 20 of a container mounting unit 30 and an auxiliary arm 21. The cassette CR housed in a container housing is carried to a home access position (first position) between the cassette mount 20 and the arm 21. The arm 21 takes an untreated wafer W out and transfers it to a main arm 22, and sets the wafer W on treating units G1,..., to apply required treatments. Thus, a plurality of carrier cassette CR are housed in the vertical direction of the waiting part 31 and hence the housing ability of the carrier cassette CR can be improved.

10. 发明专利

JPH1154428A COATING DEVELOPING APPARATUS 失效
公开(公告)号：JPH1154428A
公开(公告)日：1999-02-26
申请号：JP22430597
申请日：1997-08-06
申请人： TOKYO ELECTRON LTD
发明人： AKUMOTO MASAMI , UEDA KAZUNARI
IPC分类号： G03F7/16 , B05C11/08 , H01L21/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a new coating development apparatus capable of improving throughput by preparing a composite unit and treating substrate treatment other than the delivery of substrates. SOLUTION: In a treatment unit group having a multi-stage for treatment units individually treating coating and development of substrates, a composite unit (CTP) in which a sub-transferring device 21 and a main transferring device 22 can transfer substrates and the delivery and cooling of the substrate can be done simultaneously is provided. No proprietary unit for the delivery of the substrate is needed in the treatment unit, and the allocation of the open space to the other treatment unit can improve the throughput.

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