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1. 发明专利

JP2014158016A Housing container of roll-shaped body, base material processing system, base material processing method, program and computer storage medium 有权
标题翻译：滚筒式容器，基体材料加工系统，基础材料加工方法，程序和计算机存储介质
公开(公告)号：JP2014158016A
公开(公告)日：2014-08-28
申请号：JP2013251830
申请日：2013-12-05
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KIMURA YOSHIO
IPC分类号： H01G13/00 , H01G11/84 , H01M4/04 , H01M4/139
CPC分类号： Y02E60/122
摘要： PROBLEM TO BE SOLVED: To process a strip-like base material properly and efficiently.SOLUTION: A housing container 80 for housing an electrode roll 60 formed by winding a strip-like metal foil around the shaft center 61 comprises: a container body 90 for housing the electrode roll 60; a lid which can open and close an aperture 91 formed in the side face of the container body 90, and can seal the inside of the container body 90; a bearing member 93 provided in the container body 90 and supporting both ends of the shaft center 61; and a fixing mechanism 94 for fixing the shaft center 61 supported by the bearing member 93.
摘要翻译：要解决的问题：适当和有效地处理条状基材。解决方案：用于容纳通过将带状金属箔缠绕在轴心61上而形成的电极辊60的容纳容器80包括：容器主体90，用于容纳电极辊60; 能够开闭形成在容器主体90的侧面的孔91的盖，能够密封容器主体90的内部; 设置在容器主体90中并支撑轴心61的两端的轴承部件93; 以及用于固定由轴承构件93支撑的轴心61的固定机构94。

2. 发明专利

JP2011199299A Coating/developing system 有权
标题翻译：涂料/开发体系
公开(公告)号：JP2011199299A
公开(公告)日：2011-10-06
申请号：JP2011103236
申请日：2011-05-02
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKUMOTO MASAMI , HAYASHI SHINICHI , HAYASHIDA YASUSHI , MATSUOKA NOBUAKI , KIMURA YOSHIO , UEDA KAZUNARI , ITO AKIRA
IPC分类号： H01L21/027 , H01L21/677
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67178
摘要： PROBLEM TO BE SOLVED: To reduce the depth dimension of a coating/developing system that forms a resist film on a substrate and performs a developing process to the substrate subjected to light exposure.SOLUTION: A plurality of coating process unit blocks each containing a plurality of coating process units for forming a coating film on a substrate are stacked in a layered form, and a plurality of developing process unit blocks each containing a plurality of developing units are stacked on the coating process unit blocks. Liquid process units in respective coating process unit blocks and liquid process units in respective developing process unit blocks are so arranged as to construct a layered form. Likewise, heating process units in respective coating process unit blocks and heating process units in respective developing process unit blocks are so arranged as to construct a layered form. The layered form structure of the liquid process units and the layered form structure of the heating process units are so arranged as to face each other via a straight-line-shaped substrate transfer path.
摘要翻译：要解决的问题：减少在基板上形成抗蚀剂膜的涂覆/显影系统的深度尺寸，并对经过曝光的基板进行显影处理。解决方案：多个涂覆处理单元块，每个包含多个用于在基板上形成涂膜的涂布处理单元以层叠形式堆叠，并且在涂布处理单元块上堆叠多个包含多个显影单元的显影处理单元块。相应的显影处理单元块中相应涂布处理单元块和液体处理单元中的液体处理单元布置成构成分层形式。同样，相应的显影处理单元块中的各涂布处理单元块和加热处理单元中的加热处理单元被布置成构成分层形式。液体处理单元的层状结构和加热处理单元的分层结构被布置为经由直线状的基板传送路径彼此面对。

3. 发明专利

JP2011187975A Coating and developing system 有权
标题翻译：涂料与开发体系
公开(公告)号：JP2011187975A
公开(公告)日：2011-09-22
申请号：JP2011103228
申请日：2011-05-02
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKUMOTO MASAMI , HAYASHI SHINICHI , HAYASHIDA YASUSHI , MATSUOKA NOBUAKI , KIMURA YOSHIO , UEDA KAZUNARI , ITO AKIRA
IPC分类号： H01L21/027 , H01L21/677
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67178
摘要： PROBLEM TO BE SOLVED: To reduce the depth dimension of a device in a coating and developing system for performing a process to form an antireflection film on a substrate, a process to form a resist film thereon, and a process to carry out developing on a substrate after exposure. SOLUTION: A COT layer B4 for forming the resist film on the substrate, a BCT layer B5 for forming the antireflection film underlying the resist film, a TCT layer B3 for forming the antireflection film overlying the resist film, and DEV layers B1 and B2 for carrying out developing processing are mutually laminated. A delivery stage group laminated with delivery stages corresponding to each layer is provided in the front and rear of these laminates. Thus, the substrate can be delivered between respective layers via the delivery stage. Further, a protective film formation unit for forming a protective film to immersion exposure on the surface of the substrate is provided on any of the COT layer B4, the BCT layer B5 and TCT layer B3. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题为了减少用于进行在基板上形成抗反射膜的工艺的涂布和显影系统中的装置的深度尺寸，在其上形成抗蚀剂膜的工艺以及执行方法曝光后在底物上显影。解决方案：用于在基板上形成抗蚀剂膜的COT层B4，用于在抗蚀剂膜下形成抗反射膜的BCT层B5，用于形成覆盖抗蚀剂膜的抗反射膜的TCT层B3和DEV层B1 和B2进行显影处理相互层叠。在这些层叠体的前后设置有与各层对应的输送台层叠的输送阶段组。因此，可以经由输送阶段将基板输送到相应的层之间。此外，在COT层B4，BCT层B5和TCT层B3中的任一个上设置用于在基板表面上形成浸渍曝光的保护膜的保护膜形成单元。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011020100A Liquid treatment apparatus and liquid treatment method 有权
标题翻译：液体处理装置和液体处理方法
公开(公告)号：JP2011020100A
公开(公告)日：2011-02-03
申请号：JP2009169466
申请日：2009-07-17
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KIMURA YOSHIO
IPC分类号： B05C11/08 , B05C13/02 , B08B3/02 , G03F7/16 , H01L21/304 , H01L21/31 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To prevent the deterioration of the yield of a product by detecting whether a treating liquid is present on a substrate or not with a simple structure.
SOLUTION: Static sensors 54A-54C are embedded in a spin chuck 2. The capacitance of the static sensor 54, when the treating liquid is present on a wafer W being the substrate, is made larger than that when the treating liquid is absent on the wafer W. It is detected whether the treating liquid is present or not on the wafer W on the spin chuck 2 by the static sensors 54A-54C. As a result, because abnormality of the discharge of the treating liquid from a treating liquid nozzle 4 or the diffusion of the treating liquid on the substrate is smoothly detected by detecting whether the treating liquid is present or not on the wafer W in a prescribed timing, the abnormality is immediately coped with and the deterioration of the yield of the product is suppressed.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过以简单的结构检测处理液是否存在于基板上以防止产品的收率的劣化。静电传感器54A-54C嵌入在旋转卡盘2中。静电传感器54的电容当处理液体存在于作为基板的晶片W上时的电容大于处理液体为通过静电传感器54A-54C检测旋转卡盘2上的晶片W上是否存在处理液。结果，由于处理液喷嘴4的处理液的排出异常或处理液在基板上的扩散通过在规定的时间内检测晶片W上是否存在处理液而平滑地检测出来，则立即应对异常，抑制产品收率的劣化。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2011005695A Template processor, imprint system, release agent processing method, program and computer storage medium 有权
标题翻译：模板处理器，印刷系统，发行代理处理方法，程序和计算机存储介质
公开(公告)号：JP2011005695A
公开(公告)日：2011-01-13
申请号：JP2009149888
申请日：2009-06-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TERADA SHOICHI , KIMURA YOSHIO , KITANO TAKAHIRO
IPC分类号： B29C33/58 , B29C33/72 , B29C59/02 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To properly form a release agent on the surface of a template.SOLUTION: A template processor 1 is configured by integrally connecting a template carrying in and out station 2 with a processing station 3. The template carrying in and out station 2 retains a plurality of templates T and carries in and out a template T for the processing station 3. The processing station 3 has a conveyance unit 20 and conveys the template T to respective kinds of processing units arranged in processing blocks G1 to G4. The processing blocks G1 to G4 perform film forming of the release agent onto the surface of the template T. The processing blocks G1, G2 respectively have release agent reforming units which weaken a release effect of UV rays by irradiating the release agent on an outer area of the template T with the UV rays.
摘要翻译：要解决的问题：在模板表面上正确形成脱模剂。解决方案：模板处理器1通过将载入和退出站2的模板与处理站3整体连接而构成。模板进出站 2保留多个模板T，并携带和输出用于处理站3的模板T.处理站3具有传送单元20，并将模板T传送到布置在处理块G1至G4中的各种处理单元。处理块G1〜G4进行剥离剂的膜形成到模板T的表面上。处理块G1，G2分别具有脱模剂重整单元，其通过在外部区域照射脱模剂来削弱紫外线的释放效果的模板T与紫外线。

6. 发明专利

JP2010041059A Coating and developing apparatus 审中-公开
标题翻译：涂料和开发设备
公开(公告)号：JP2010041059A
公开(公告)日：2010-02-18
申请号：JP2009211791
申请日：2009-09-14
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKUMOTO MASAMI , HAYASHI SHINICHI , HAYASHIDA YASUSHI , MATSUOKA NOBUAKI , KIMURA YOSHIO , UEDA KAZUNARI , ITO AKIRA
IPC分类号： H01L21/677 , B65G49/06 , B65G49/07 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To achieve high carrying efficiency and high throughput in a coating and developing apparatus that performs a developing process on an exposed substrate after forming a coating layer including a resist layer on the substrate.
SOLUTION: A carrier block S1, a processing block S2 and an interface are disposed in a single line. In the processing block S2, two unit blocks are aligned in the front-back direction. The unit block includes a wafer transfer path that extends horizontally and linearly from the carrier block S1 towards the interface block S3, a coating processing unit that applies a coating solution on a substrate before exposure, and a heat processing unit that performs heat processing on the substrate. Rows of the two unit blocks are stacked vertically. The front unit block and the back unit block in the row of unit blocks in each layer are successively processed. The transfer of substrates between both unit blocks is performed via an intermediate stage.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了在形成包括在基板上的抗蚀剂层的涂层之后在暴露的基板上进行显影处理的涂覆和显影装置中实现高承载效率和高生产率。解决方案：载体块S1，处理块S2和接口设置在一条线上。在处理块S2中，两个单位块在前后方向上排列。单元块包括从载体块S1朝向界面块S3水平且线性延伸的晶片传送路径，在曝光之前将涂布溶液涂布在基板上的涂布处理单元，以及对该基板进行热处理的热处理单元基质。两个单元块的行垂直堆叠。连续处理每层中单元块行中的前单元块和后单元块。在两个单元块之间的衬底的转移通过中间阶段进行。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009278138A Coating and developing apparatus, and method therefor 有权
标题翻译：涂料和开发设备及其方法
公开(公告)号：JP2009278138A
公开(公告)日：2009-11-26
申请号：JP2009193367
申请日：2009-08-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKUMOTO MASAMI , HAYASHI SHINICHI , HAYASHIDA YASUSHI , MATSUOKA NOBUAKI , KIMURA YOSHIO , UEDA KAZUNARI , ITO AKIRA
IPC分类号： H01L21/027 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To suppress throughput deterioration when trouble occurs in a processing unit for performing development processing or a conveying mechanism, in an apparatus which carries out resist film formation on a substrate and development of the substrate subjected to exposure. SOLUTION: Three-layer unit blocks B3 to B5 for forming a coating film and two-layer unit blocks B1, B2 for development processing are mutually laminated on a treatment block S2. Each of the unit blocks B1, B2 for development processing is provided with a developing liquid processing unit, a heating unit, a cooling unit and a main arm A1 or the like which moves along a conveying area extending horizontally and linearly from a carrier block side toward an interface block side. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了在用于进行显影处理的处理单元或输送机构中发生故障时抑制生产率恶化，在基板上进行抗蚀剂膜形成的设备和经受曝光的基板的显影。解决方案：用于形成涂膜的三层单元块B3至B5和用于显影处理的两层单元块B1，B2彼此层压在处理块S2上。用于显影处理的单元块B1，B2设置有沿着从承载块侧水平和线性延伸的输送区域移动的显影液处理单元，加热单元，冷却单元和主臂A1等朝向接口块侧。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2007067178A Heating apparatus, coating apparatus, and developing apparatus 有权
标题翻译：加热装置，涂装装置和开发装置
公开(公告)号：JP2007067178A
公开(公告)日：2007-03-15
申请号：JP2005251389
申请日：2005-08-31
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： FUKUOKA TETSUO , AKUMOTO MASAMI , KITANO TAKAHIRO , KIMURA YOSHIO , HAYASHI SHINICHI , ITO AKIRA
IPC分类号： H01L21/027
CPC分类号： C30B33/02 , C30B35/00 , H01L21/67098 , H01L21/67748
摘要： PROBLEM TO BE SOLVED: To provide devices which so cut down the overhead time of a heating apparatus as to improve its throughput, and reduce the sticking amount of particles to a substrate, in the heating apparatus having hot plates and a cooling plate. SOLUTION: The heating apparatus 2 has a flat heating chamber 4 provided in a housing and for heating a wafer W of a substrate on whose one side an opening is provided for carrying the wafer W thereinto/therefrom, hot plates 44, 45 so provided in the heating chamber 4 as to heat the wafer W from its upside and downside, a cooling plate 3 so provided as to adjoin to the side of the opening of the heating chamber 4 for cooling the wafer W heated by the hot plates 44, 45, and a carrying means provided in the housing for so carrying the wafer W between the upside position of the cooling plate 3 and the inside of the heating chamber 4 as to perform the heat treatment of the substrate in the heating chamber 4 in the state of holding the wafer W. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：在具有加热板和冷却板的加热装置中，提供一种能够降低加热装置的开销时间以提高其生产量并减少颗粒到基板的粘附量的装置。解决方案：加热装置2具有设置在壳体中的平坦加热室4，用于加热其一侧设置有用于承载晶片W的开口的基板的晶片W，热板44,45 设置在加热室4中以从上下侧加热晶片W;冷却板3，设置成与加热室4的开口侧邻接，用于冷却由热板44加热的晶片W 45，以及设置在壳体中用于将晶片W承载在冷却板3的上侧位置和加热室4的内部之间的承载装置，以便在加热室4中对基板进行热处理持有晶圆的状态。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007005576A Substrate processing system and method of controlling the same 有权
标题翻译：基板处理系统及其控制方法
公开(公告)号：JP2007005576A
公开(公告)日：2007-01-11
申请号：JP2005184296
申请日：2005-06-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KIMURA YOSHIO , OKUBO TAKAHIRO
IPC分类号： H01L21/027 , B05C5/00 , B05C11/08 , B05D1/26 , B05D3/00
CPC分类号： H01L21/67178 , H01L21/67184 , H01L21/6719
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing system equipped with a dispensing mechanism which dispenses processing liquid to modules having different thickness profiles as accurate as a substrate processing system which dispenses the processing liquid to two or more modules stacked up in layers, and to provide a method of controlling the same.
SOLUTION: The substrate processing system is equipped with a processing liquid supply source 30 which keeps the processing liquid, a pressing means which forcibly sends the processing liquid by pressurizing the processing liquid source 30, and pumps 34 which are arranged by the side of the modules respectively to internally reserve the processing liquid forcibly sent from the processing liquid supply source 30 by the pressing means. The pumps 34 and the nozzles Nz are arranged so as to make the piping distances between the outlets of the pumps 34 and the corresponding nozzles Nz all equal to each other, and to set the discharge pressures of all the nozzles equal to each other. The method of controlling the substrate processing system is also indicated.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种配备有分配机构的基板处理系统，该分配机构将处理液体分配给具有与衬底处理系统不同的厚度分布的模块，该基板处理系统将处理液体分配到层叠的两个或更多个模块并提供一种控制该方法的方法。解决方案：基板处理系统配备有处理液体供给源30，其保持处理液体，通过对处理液体源30进行加压而强制地送出处理液体的按压单元以及由侧面排列的泵34 分别对由加压装置强制地从处理液供给源30送出的处理液进行内部的保存。泵34和喷嘴Nz被布置成使得泵34的出口和相应的喷嘴Nz之间的管道距离全部彼此相等，并且将所有喷嘴的排出压力设定为彼此相等。还指出了控制基板处理系统的方法。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2003332213A Wet processing device and method 有权
标题翻译：湿处理装置和方法
公开(公告)号：JP2003332213A
公开(公告)日：2003-11-21
申请号：JP2002138594
申请日：2002-05-14
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KIMURA YOSHIO
IPC分类号： G03F7/30 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of processing the surface of a substrate with high uniformity with a processing solution and saving the floor space of a wet processing device for processing the surface of the substrate as prescribed while the processing solution is applied on it.
SOLUTION: The substrate is placed on a substrate mount provided inside a closed vessel as keeping nearly horizontal in position. At this point, the substrate is placed on the substrate mount as all the rear peripheral edge of the substrate is pressed on the annular projection of the substrate mount. A developing solution as a processing solution is fed into the closed vessel to make the substrate to undergo still development, and then rinses are supplied so as to discharge the processing solution from the closed vessel. In succession, after the rinses are discharged from the vessel, the inside of the vessel is dried out by a drying means. In this case, a developing process is carried out without being affected by a flow of ambient air, so that the substrate can be subjected to a developing process with uniformity through its surface, and moreover a developing solution feeding nozzle or the like and an area for installing it are not required to be provided above the substrate, so that the processing device can be reduced in size.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种能够利用处理溶液以高均匀性处理基板表面的技术，并且节省了用于在处理溶液中按规定处理基板表面的湿处理装置的占地空间应用于它。解决方案：将基板放置在设置在密闭容器内的基板安装座上，使其保持接近水平的位置。此时，将衬底的所有后周缘按压在衬底安装件的环形突起上之后，将衬底放置在衬底安装件上。将作为处理溶液的显影液供给到密闭容器中，以使基材经历静置显影，然后进行冲洗，以将处理溶液从密闭容器中排出。接下来，在从容器排出漂洗液之后，通过干燥装置干燥容器的内部。在这种情况下，在不受环境空气流动的影响的情况下进行显影处理，从而能够使基板通过其表面进行均匀的显影处理，并且还可以进行显影液供给喷嘴等的区域为了安装，不需要在基板的上方设置，因此可以减小处理装置的尺寸。版权所有（C）2004，JPO

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